DSM-054 Bluetooth Cloud Module

Table of Contents

DSM 054

1. Product overview

DSM-054 is a low-power embedded Bluetooth module that Dusun has developed. DSM-054 Series 2 wireless SoCs include a 80 MHz ARM Cortex-M33 core, providing plenty of processing capability and an integrated security subsystem provides leading security features that greatly reduce the risk of IoT security breaches and compromised intellectual property.

The device includes Secure Vault, 1024 kB of flash, 96 kB of RAM. With up to 20 dBm maximum power output and an excellent receive sensitivity of -97 (1 Mbit/s GFSK) dBm, the module provides a robust RF link for reliable communications for Bluetooth 5.1 and Bluetooth mesh applications.

2. Features

  • ARM® Cortex®-M33(Floating-Point Unit)
  • Up to 80 MHz Clock Speed
  • Low Active Mode Current: 50.9 µA/MHz
  • Up to 1024 kB of Programmable Flash
  • Up to 96 kB SRAM
  • BLE RF features
    Compatible with Bluetooth 5, Bluetooth 5.1 and Bluetooth mesh specification
    Excellent receive sensitivity:
    -104.9 dBm @125 kbps GFSK
    -97.5 dBm @1 Mbps GFSK
    -94.4 dBm @2 Mbps GFSK
    Programmable output power: Up to +20 dBm
    Active mode RX: 8.8 mA
    Active mode TX: 9.3 mA @ 0 dBm
    Active mode TX: 33.8 mA @ 10 dBm
  • Working temperature: -20℃ to +85℃
  • Humidy:<85%RH

3. Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

4. Module interfaces

4.1 Dimensions and package

DSM-054 dimensions are 15 (±0.35) mm (W)×18 (±0.35) mm (L) ×2.8(±0.15) mm(H):

DSM 054 2
4.2 Pin definition
DSM 054 3

The definition of interface pins is shown in the following table:

Pin No. Symbol I/O type Function
1 VCC P Power supply reference ground pin
2 PA04 I/O GPIO interface
3 GND I/O Power supply reference ground pin, which must be properly grounded
4 PA03 I/O GPIO interface
5 Rx I/O Serial interface receiving pin
6 PA00 I/O GPIO interface
7 Tx I/O Serial interface transmission pin
8 ADC P ADC input
9 PB00 GPIO interface
10 nRST I/O Hardware reset pin (The chip is reset when the level is low. The level is high in
11 PB01 I/O GPIO interface
12 V P Power supply pin (typical power supply voltage: 3.3 V)
13 D I/O JLINK SWDIO burning pin
14 C I/O JLINK SWCLK burning pin
15 G P Power supply reference ground pin, which must be properly grounded

Note: P indicates a power supply pin, I/O indicates an input/output pin and AI indicates
an analog input pin. If you have your requirements on the light color controlled by PWM output,
please contact the business representative of Dusun.

5. Electrical parameters

5.1 Absolute electrical parameters
Parameter Description Minimum value Maximum value Unit
Ts Storage temperature –50 150
VCC Power supply voltage –0.3 3.8 V
Static electricity
discharge voltage (human
body model)
TAMB-25℃ - 2 KV
Static electricity
discharge voltage (machine
model)
TAMB-25℃ - 1 KV
5.2 Working conditions
Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature –40 - 125
VCC Working voltage 1.75 3.3 3.8 V
VIL I/O low level input –0.3 - VCC*0.3 V
VIH I/O high level input VCC*0.7 - VCC V
VOL I/O low level output VSS - 0.3 V
VOH I/O high level output VCC–0.3 - VCC V
5.3 Power consumption in working mode
Symbol Conditions Typical value Unit
Itx Constantly transmit, output power of 0 dBm 10.5 mA
Irx Constantly receive 9.8 mA

6. RF features

6.1 RF output power

Unless otherwise indicated, typical conditions are: TA = 25℃, PAVDD = 3.0V, AVDD = DVDD
= IOVDD = RFVDD = PAVDD. Crystal frequency=38.4MHz. RF center frequency 2.45 GHz.

Parameter Minimum value Typical value Maximum value Unit
Average RF output power –20 10 10 dBm
6dB bandwidth (1M) - 672.9 - KHz
6dB bandwidth (2M) - 1182.5 - KHz
6.2 RF receiving sensitivity
Unless otherwise indicated, typical conditions are: TA = 25℃, PAVDD = 3.0V, AVDD = DVDD = IOVDD = RFVDD = PAVDD. Crystal frequency=38.4MHz. RF center frequency 2.45 GHz.
Parameter Minimum value Typical value Maximum value Unit
RX sensitivity 1 Mbps –94 –95 –90
RX sensitivity 2 Mbps –93 –94 –89

7. Antenna

7.1 Antenna type
DSM-054 uses an onboard PCB antenna whose frequency band is 2.400 to 2.483 GHz.
7.2 Antenna interference reduction

To ensure the optimal RF performance, it is recommended that the antenna be at least
15 mm away from other metal parts.

Because DSM-054 is mounted to the main control panel through SMT, the placement location
and manner of the PCB directly affect the RF performance. The following are placement
positions recommended and not recommended.

Among them, placement positions in Solution 1 and 2 are recommended, that is, the antenna
is placed outside the frame of the panel, or the antenna is placed along the frame edge
of the panel with a carved area below. In the above two solutions, the RF performance is
not different from that of an independent module.

If the PCB antenna must be placed on the panel due to the design limit, you can refer
to the placement manner in Solution 3. That is, the antenna is placed along with the frame
of the panel without copper or traces below. However, the RF performance is still reduced
by 1 to 2 dBm.

The placement position in Solution 4 is not recommended. In this solution, the antenna
is placed on the PCB without a clearance area below, which greatly affects the strength
of the RF signal.

DSM 054 4
DSM 054 5

8. Firmware

8.1 Docking support

A. API
Support customized various product solutions. and provide related API documents and support.
Customers can pair the device to the gateway (Dusun gateway or Private gateway )according
to the API description and standard protocol.
API content includes reading sensor data, controlling device switches, changing device
configuration, OTA, etc.

B. MQTT
It can provide the terminal device customization + Dusun gateway overall solution, and
can provide the MQTT protocol for the gateway to connect to the customer platform. Customers
can easily deploy the entire system and view the status and data of the terminal equipment
at any time.

DSM 054 6

9. Production Instructions

Use an SMT placement machine to mount components to the stamp hole module that Dusun produces
within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack
the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
    Reflow soldering machine
    Automated optical inspection (AOI) equipment
    Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
    Cabinet oven
    Anti-static heat-resistant trays
    Anti-static heat-resistant gloves
  • Storage conditions for a delivered module are as follows:
    The moisture-proof bag is placed in an environment where the temperature is below 30°C
    and the relative humidity is lower than 70%.
    The shelf life of a dry-packaged product is six months from the date when the product
    is packaged and sealed.
    The package contains a humidity indicator card (HIC).
DSM 054 7
  • Bake a module based on HIC status as follows when you unpack the module package:
    If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
    If the 30% circle is pink, bake the module for 4 consecutive hours.
    If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  • Baking settings:
    Baking temperature: 125±5℃
    Alarm temperature: 130℃
    SMT placement ready temperature after natural cooling:<36℃
    Number of drying times: 1
    Rebaking condition: The module is not soldered within 12 hours after baking.
  • Do not use SMT to process modules that have been unpacked for more than 3 months, because
    electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously
    oxidized for over 3 months. SMT is very likely to cause pseudo and missing soldering.
    Dusun is not liable for such problems and consequences.
  • Before using SMT, take electrostatic discharge (ESD) protective measures.
  • To reduce the reflow defect rate, draw 10% of the products for visual inspection and
    AOI before the first mounting, to determine the rationality of oven temperature control
    and component attachment and placement manners. Draw 5 to 10 modules from subsequent
    batches each hour for visual inspection and AOI.

10. Recommended oven temperature curve and temperature

For oven temperature setting, refer to oven temperatures for wave soldering. The peak
temperature is 260°C±5°C. The wave soldering temperature curve is shown below:

DSM 054 8

Recommended soldering temperature:

Recommended wave soldering
oven temperature
Recommended manual soldering
temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

11. Storage conditions

DSM 054 9
Product No. MOQ (pcs) Shipping packaging method Number of modules
per reel (pcs)
Number of reels per
carton (reel)
DSM-054 3600 Tape reel 900 4

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