DSGW-030-AUTO In-vehicle IoT Gateway

The DSGW-030-AUTO gateway, developed based on MediaTek MT7628, is a lightweight micro-development embedded gateway product specifically designed for smart electric vehicles. Additionally, it supports the OpenWrt system, facilitating customer connections to vehicle cloud MQTT and vehicle body MQTT servers, making it suitable for industrial applications in the in-vehicle IoT.
Table of Contents

1. Product Introduction

1.1 Product Overview

Based on MediaTek MT7628 designed for smart electric car, a model created light weight micro development Embedded Gateway product. DSGW-030-AUTO gateway has powerful low-power Bluetooth connection capabilities, fully satisfied connection requirements for in-car aftermarket sub-devices and camping scene sub-devices.

Otherwise gateway support Openwrt system, it is convenient for customers to connect the vehicle-cloud MQTT and vehicle-body MQTT servers, suitable for use in industry scenarios of in-vehicle Internet of Things.

1.2 Hardware Specifications
Name Describe
Product Model DSGW-030-LD
CPU MT7628DAN
RAM 64MB
FLash 32MB
System Android 12
Network Port 1 10/100Mbps Ethernet test point
USB2.0 Interface 1 USB2.0 interface
Wi-Fi IEEE 802.11b/g/n, Channel 1~13, 2400MHz~2483.5MHz, 1 PCB antenna
BLE Support Bluetooth 5.2, 2402MHz~2480MHz, 1 Ipex antenna
Debug Interface Support 1 UART interface on board
Button 1 function button
1 soft reset button
LED Yellow light flashes: Bluetooth signal connected
Red light is always on: Not connected to the server properly
Green light is always on: Normal connection to the server
Power Supply DC power supply voltage range 12V/2A and battery power supply voltage range 9V to 12V
Operating Temperature -10℃~55℃
Storage Temperature -40℃~70℃
PCBA Dimensions 64.8*64mm
1.3 Product Application Diagram
1.3.1 Industry Application Block Diagram
dsgw 030 auto in vehicle system

■ Functional description of vehicle IoT scenarios:

1). Intelligent vehicle control ecosystem

The DSGW-030-AUTO gateway reads and controls Bluetooth refrigerators and car fragrance devices in the car through Bluetooth, and processes data locally on the car system, integrates the car control ecosystem, executes various smart scenarios, customizes smart car life, and achieves the best car intelligent control experience.

2). Smart camping

DSGW-030-AUTO opens BLE API, supports the access of various types of BLE devices, and realizes intelligent remote control of camping scenes through mobile phone APP through the cloud MQTT server.

■ Dusun In-vehicle IoT Gateway Advantages:

1). Car body + car cloud data communication

DSGW-030-AUTO is connected to the EMQ service to realize the synchronous data processing of the vehicle body MQTT server + vehicle cloud MQTT server, which can realize the intelligent and fast control of the vehicle computer in seconds. In addition, in areas without network coverage, intelligent vehicle control can still be performed locally through the vehicle computer.

2). Custom BLE Driver

Through Dusun’s many years of experience in IoT device access, the gateway-side BLE driver is optimized, and the provided BLE API can quickly become compatible with various types of BLE devices, enabling rapid access to new devices that support subsequent scenario expansion without the need for OTA.

3). Dual scene usage inside and outside the car

DSGW-030-AUTO has a dual power input design, supports the in-car 12VDC power interface and the standard type C interface. The product is compact and easy to disassemble and assemble, making it suitable for use in both in-car and out-of-car scenarios.

1.3.2 System Software Block Diagram

Dusun integrates the standard systemIn-vehicle IoTIndustry-related applications, customized high-reliability operating systems and industry SDKs, with many years of experience in the development and design of embedded motherboards, complete the transplantation and testing of a variety of hardware peripheral drivers that meet the industry. The following is the software framework of the default Openwrt system of DSGW-030.

system software block diagram

Dusun provides industry SDK source code that matches the motherboard, supporting customers to conduct micro-development to achieve rapid productization.

Dusun SDK has the following features:

1). Streamlined operating system

On the premise of meeting industry applications, the number of components is streamlined, the system resource utilization rate is high, thereby reducing hardware costs, and to a certain extent, the functional structure is optimized, the system architecture is reasonably laid out, and the system is more efficient and easy to maintain.

2). BSP with industry attributes

According to the types of peripheral devices used in the industry, we transplant and debug the drivers and adapt the industry algorithms to meet the customers’ needs for selecting the overall hardware + algorithm solution. In addition, Dusun BSP driver will continue to iterate the access to peripheral devices of different brands and models.

3). Strong scalability

By installing additional software packages or writing custom code, the functions of MT7628 can be expanded according to specific needs to adapt it to different in-vehicle application scenarios.

1.3.3 Supported algorithms and peripheral hardware
1.3.3.1 Basic equipment
Peripherals Model Illustrate
Power Supply -- DC12V/DC-5V/2A
1.3.3.2 Core Components
Matching peripheral hardware Model Illustrate
Car Fragrance Customer Model Bluetooth BLE, can be directly connected
Car Refrigerator Customer Model Bluetooth BLE, can be directly connected
Camping lights Customer Model Bluetooth BLE, support RGB dimming
Light Strip Customer Model Bluetooth BLE, support RGB dimming
Temperature and humidity sensor DSBC-060 Bluetooth, temperature and humidity sensor
1.3.3.3 SupportedPlatform docking

The default connection is to the EMQX MQTT server platform, and the reserved API interface can be connected to the customer’s private cloud and third-party cloud.

2. Installation Instructions

2.1 Packaging instructions

⚠️: This section describes the product packaging form (boxed/antistatic bag, etc.?), packaging size, unit weight, packing instructions, etc.

1). Describe the type of box: airplane box, top and bottom box, double-insert box, buckle bottom box, drawer box.

2). Describe the type of bag: bubble bag, flat bag, sealed bag.

3). State the weight of the complete machine (excluding accessories), with one decimal place and tolerance.

4). Describe the packing situation: how many boxes are in a box, how they are arranged, and provide illustrations.

2.2 Accessories List

⚠️: This section describes the factory accessories list of the product

1). Use graphic description + list to describe the factory accessories of the whole machine.

2). If necessary, explain how to use the accessories, such as how to install them, installation precautions, etc.

2.3 Installation

⚠️: This section describes the installation method and installation precautions of the product. If the product is a complete machine, use diagrams to describe the appropriate installation method and installation steps. If the product is a PCBA, describe the fixed space and air avoidance rules, radiator installation, etc.

1). Whole machine status before leaving the factory: Use graphic description + text description to explain the installation method and steps of the product, and especially emphasize precautions, etc.

2). Module status at the factory: Describe the module installation method, precautions, recommended hole opening values, etc. If necessary, we can use graphic descriptions to recommend customers to assemble the module according to the structure recommended by our company.

2.4 Product Dimensions

⚠️: Use 2D wireframes to quickly describe the product dimensions. Also provide a link to download the 3D product image.

1). Use the simplest wireframe to describe the key dimensions of the product and indicate the tolerances.

2). Integrate the product into a “part state” and provide 3D drawings (STP format).

3. Hardware Instructions

3.1 Product Appearance
dsgw 030 auto appearance
3.2 Product IO Interface Diagram
3.2.1 Interface Identification Diagram
dsgw 030 auto pcba interface
3.2.2 Interface Usage Description
Serial number Describe Remark
1 Reset button For restoring factory settings
2 USB TYPE-C interface Used to provide power to the motherboard
3 DC 12V interface Used to provide power to the motherboard
4 Network port debugging interface Used to upgrade the system with the server
5 BLE Module The module is on the mainboard and the interface is not external.
6 BLE module ipex socket Used to connect BLE module and built-in FPC antenna
7 button WIFI network configuration button
8 Red LED light Used to show that the server is not connected properly
9 Green LED light Used to display the normal connection server
10 Yellow LED light Used to display Bluetooth signal access
3.2.3 Definition and color description of indicator lights
Serial number name color state Remark
1 DS1 green Display status can be user defined Green light is always on: Normal connection to the server
2 DS2 yellow Display status can be user defined Yellow light flashes: Bluetooth signal connected
3 DS3 red Display status can be user defined Red light is always on: Not connected to the server properly

4. Relevant standards and certifications

4.1 Hazardous Substance Standards
4.1.1 ROHS

Chinese Standard: GB/T 26572-2011
EU Standard: Directive 2011/65/EU
Note: The components used in the current product comply with ROHS standards

4.1.2 REACH

EU Standard: EU Regulation (EC) No 1907/2006 (REACH)
Note: The components used in the current product comply with REACH standards.

4.2 Anti-vibration standard STA-2A
4.2.1 Vibration Standards
1 Random vibration test 1. Place 3 noodles on the platform for 30 minutes.
2. Place Noodle 1 on the platform for 10 minutes.
3. Place side 2 or side 4 on the platform for 10 minutes.
4. Place surface 5 or 6 on the platform for 10 minutes.
5. Frequency: 1…4…100…200
6. PSD: 0.0001…0.01…0.01…0.0001
There is no obvious damage to the box after the random vibration test
2 Fixed displacement test Displacement: 25 mm
Displacement times: 14200 ci
There is no obvious damage to the box after the displacement test
3 Sinusoidal vibration test (packaging) sinusoidal vibration test packaging 1. The appearance, function and performance of the equipment under test meet the specifications of the relevant standards without obvious changes, and the functions of the equipment meet the requirements of Table 2.
2. Minor surface damage (such as scratches, nicks, etc.) of the sample meets the requirements.
3. Some parts of the sample (such as connectors) are allowed to have slight deformation, but this deformation cannot affect the mechanical and electrical properties of the device.
4 Sinusoidal vibration test (bare metal) sinusoidal vibration test bare metal 1. The appearance, function and performance of the equipment under test meet the specifications of the relevant standards without obvious changes, and the functions of the equipment meet the requirements of Table 2.
2. Minor surface damage (such as scratches, nicks, etc.) of the sample meets the requirements.
3. Some parts of the sample (such as connectors) are allowed to have slight deformation, but this deformation cannot affect the mechanical and electrical properties of the device.
4.2.2 Drop Standard
1 Package drop test 1. Wt< 10 Kg, drop 97 cm,
2. Wt:10 ~ 19 Kg, drop 81 cm,
3. 19 ~ 28 Kg, drop 66 cm,
4. Test standard: one corner, three sides, six faces, ten drops in total.

package drop test
There is no obvious damage to the box after the drop test
2 1. Sample with normal function, no power supply
2. Drop mode: 6 sides, the drop sides are bottom, front, left, right, back and front in order;
3. Drop height
a) Excluding display screen and optical engine products
Free fall from a height of 100 cm onto a wooden floor no less than 3 cm thick
b) Products containing display screens and optical engines
Free fall from a height of 80cm onto a wooden floor no less than 3cm thick
1. The appearance, function and performance of the equipment under test meet the specifications of the relevant standards without obvious changes, and the functions of the equipment meet the requirements of Table 2.
2. Minor surface damage (such as scratches, nicks, etc.) of the sample meets the requirements.
3. Some parts of the sample (such as connectors) are allowed to have slight deformation, but this deformation cannot affect the mechanical and electrical properties of the device.
3 Drop (Packaging) drop packaging 1. The appearance, function and performance of the equipment under test meet the specifications of the relevant standards without obvious changes, and the functions of the equipment meet the requirements of Table 2.
2. Minor surface damage (such as scratches, nicks, etc.) of the sample meets the requirements.
3. Some parts of the sample (such as connectors) are allowed to have slight deformation, but this deformation cannot affect the mechanical and electrical properties of the device.
4.3 EMC implementation standards

EU standards: EN55032:2015 + A11:2020 / EN55035:2017 + A11:2020 / ETSI EN 301489-1 V2.2.3 (2019-11) / ETSI EN 301489-X
Chinese Standard: GB/T 26572-2011
Note: The current product is designed strictly in accordance with EMC standards

4.4 Authentication Support
4.4.1 Proxy Client Authentication

The customer only needs to provide the application company information, and Dusun will be responsible for all the certification processes
The certification process is shown in the following example (CE certification):

ce certificate
4.4.2 Customer Self-Authentication

① Dusun provides certification related materials, the list of materials is as follows (contact the project leader, who will coordinate and organize the materials):
1). BOM list (all in English)
2). Body Label
3). Block diagram
4). Parts placement
5). PCB layout
6). Schematic diagram SCH
7). User manual
8). Antenna Specifications
9). List of key safety components (with safety component certificates, such as relays, fuses, terminal blocks, etc.)
10). PCB-UL certificate

② Dusun provides certification technical support (fixed frequency, safety regulations, EMC)
Contact the project leader, who will coordinate with relevant technical personnel to provide technical support

5. Order

5.1 Model Description

⚠️: Order sub-model and corresponding product description.

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