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DSM-059 Bluetooth Cloud Module

Table of Contents

1. Introduction

1.1 Purpose& Description

DSM-059 is a low power-consuming Bluetooth module powered by Dusun. The DSM-059 is high performance wireless transparent transmission module based on the CST92F25 chip and the BLE standard design published by SIG.
The control mode of the module is flexible, which can be controlled not only through serial port and pins, but also supports remote control via mobile terminal. When using this module, users can develop standard BLE products in a short time without having to worry about the complex Bluetooth protocol

1.2 Product Feature Summary
  • Built-in ARM Cortex-M0 CPU, main frequency up to 64MHz
  • 8KB code cache
  • 64KB Data RAM
  • Integrate 512KB Flash
  • Working voltage: 1.8 V to 3.6 V
  • Peripherals: 1XUART
  • Bluetooth RF feature
    802.15.4 MAC/PHY supported
    Compatible with BLE 5.0
    TX power:-20 to +5 dBm
    RX sensitivity:
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  • Dimension: 17 x 22 x 2.8 mm
  • Working temperature: –40°C to +85°C
  • Working Humidity: <93%(non-condensing)
  • Certification BQB, SRRC
1.3 Scenario
  • Intelligent Building
  • Intelligent Home And Household Applications
  • Industrial Wireless Control
  • Intelligent Public Traffic
  • Smart Healthcare
  • Web Camera
  • Baby Monitor

2. Mechanical Requirement

2.1 Dimensions

Dimensions: 12.45±0.2 mm (W) x 10.4±0.2 mm (L) x 10.4±1.5 mm (H).

DSM 059 1
2.2 Pin Definition
Pin NumberSymbolIO TypeFunction
1 GNDPGround
2ANTIAntenna input
3GNDPGround
4VCCPPower supply pin (3.3V)
5ENI/OEnabling pin, which works at the high level and is pulled up
0: The module starts broadcasting until it connected to the mobile device
1: Immediately enter into the sleep state regardless of the current state of the module
6RXDISerial port input pin, corresponds to GPI02 of the IC chip
7TXDOSerial port input pin, corresponds to GPI03 of the IC chip
8P06IRestore Factory Setting triggers: 30 seconds after power on, This pin keep low level for 5 s, the system can recover some parameters (shallow recovery), if it could keep more than 20 s will restore all parameters.
9P07I/OProgrammable I/O port
10GNDPGround
11RESETI/OHardware reset pin, which is at a high level by default and is active at a low level
12TCKI/OInterface for debugging: debug clock input
13TMSI/OInterface for debugging: debug data

•P indicates power supply pins, I/O indicates input/output pins

3. Electrical parameters

3.1 Absolute electrical parameters
ParameterDescriptionTypical
value
Minimum valueMaximum valueUnit
Ts Storage temperature-55150
VCCPower supply voltage1.83.6V
Static electricity voltage (human body model)TAMB-25-2KV
Static electricity voltage (machine model)TAMB-25-0.5 KV
3.2 Working conditions
ParameterDescriptionMinimum valueMaximum valueTypical
Value
Unit
TaWorking temperature-4085-
VCCPower supply voltage1.83.63.0V
VILI/O low-level input-0.3-V
VIHI/O high-level inputVDD-0.3VDD+0.3-V
VOLI/O low-level output-0.3-V
VOHI/O high-level outputI0VDD-0.3VDD+0.3-V

NOTE: VCC=3.0V, Tamb=-10~70℃

3.3 Power-Consumption Features
ParameterMin ValueTYP ValueMAX ValueUnit
Sleep Mode,32K RTC running,all the internal of SRAM retain ,can be woken up by RTC time or IO6uA
OFF Mode,can only be woken up by the IO0.7uA
MCU operation currentSystem clock 16MHz,RF NOT Work,with DC-DC2.2mA
System clock 48MHz,RF NOT Work,with DC-DC2.8mA
System clock 64MHz,RF NOT Work,with DC-DC3.2mA
System clock 16MHz,RF NOT Work,without DC-DC3.9mA
System clock 48MHz,RF NOT Work,without DC-DC5.2mA
System clock 64MHz,RF NOT Work,without DC-DC6mA
RX ModeSystem clock 16MHz,with DC-DC5mA
System clock,with DC-DC6mA
System clock,with DC-DC6.4mA
System clock,without DC-DC8mA
System clock,without DC-DC9mA
System clock,without DC-DC9.8mA
TX Mode0dBm output,System clock 16MHz,with DC-DC5.5mA
0dBm output,System clock 48MHz,with DC-DC6.5mA
0dBm output,System clock 64MHz,with DC-DC7mA
0dBm output,System clock 16MHz,without DC-DC8.5mA
0dBm output,System clock 48MHz,without DC-DC9.3mA
0dBm output System clock 64MHz,without DC-DC10.2mA

4. Basic Requirement

4.1 Test Mode

Entering into the test mode via serial commands
FA FB AF 01 01 FF A5 //Mode 1 test Calibration
FA FB AF 01 01 F0 96 //Mode 2 Single Carrier 2402MH 0dbm
FA FB AF 01 01 F1 97 //Mode 3 Single Carrier 2440MHz 0dbm
Case 1: Entering into mode 2 or 3, transmitting a single carrier, exiting after the 10S
Case 2: Entering into mode 1, when no calibration parameter is sent, it will exit after the 10s.
Case 3: Entering into mode 1, when the calibration parameter is sent. It will Perform calibration parameters after a single carrier, finally, it will exit after the 10s.

4.2 OTA Firmware Updates

The module supports OTA Firmware updates via phone or other hosts.
Reserved burning firmware interface is available. The burning pin spacing is 2.54MM supporting chip upgrade via OTA.

5. Antenna

5.1 Antenna type

 The 50 ohm impedance line is leaded to the bonding pad of the module.

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.  If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.

DSM 059 2

6. Certification Requirements

BQB, SRRC

7. Production instructions

1.Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
    Reflow soldering machine
    Automated optical inspection (AOI) equipment
    Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
    Cabinet oven
    Anti-static heat-resistant trays
    Anti-static heat-resistant gloves

2.Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
DSM 059 3

3.Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4.Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5.Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.

6.Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

DSM 059 4
7.2 Storage conditions
DSM 059 5

8. MOQ and packing

Product modelMOQ(pcs)Packing methodNumber of Modules in each reel packNumber of reel packs in each box
DSM-0598000Carrier tape and reel packing20004

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