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RK3328 core board

Table of Contents

Core Board

The RK3328 core board belongs to the Android smart motherboard, which is generally suitable for face recognition, smart display terminal products, video terminal products, industrial automation terminal products, such as: advertising machines, digital signage, smart self-service terminals, smart retail terminals, smart homes, O2O Intelligent equipment, industrial control host, robot equipment, etc.

Overview

Product overview

RK3328 adopts ROCHCHIPRK3328Cortex-A53 quad-core processor, equipped with Android/Linux+QT/Ubuntu system, 1.5GHz high performance. Adopt Mali-450MP2GPU, support 4K video encoding, H.264 hard decoding. Multi-channel video output, rich core board interface, lead out all functional pins, support a variety of peripheral expansion, is your best choice for human-computer interaction and industrial control projects.

Product features

Stamp hole welded core board, onboard CVBS, HDMI display interface.

Support Android/Linux+QT system customization, provide system call interface API reference code, and perfectly support customer upper-level application APP development and SDK.

Chip Block Diagram

Chip Block Diagram

Mainboard Diagram

Mainboard Diagram

Basic parameters

Item parameter Remark
Mode DSM-210 Version V1.0
CPU ROCKCHIPRK3328 Quad-core A53
GPU Mali450MP2
RAM DDR4 default 1GB option 2GB
eMMC interface EMMC5.1 default:8GB;option:16GB/32GB/64GB
Power management RK805-1
Li battery Non
Input power Up to 5V/2A
Operation system Andriod7.1/Ubuntu16.04/Linux+QT/debian
Temperature Working Temperature:-20℃~75℃
Storage Temperature:-30℃~85℃
Humidly 10~95%(Non-condensing)
Atmospheric pressure 76Kpa ~106Kpa
Dimensions 44mm×44mm×3mm

Common Interface

Interface Interfaces by the factory default firmware
HDMI Support up to 4k x 2k @ 60Hz
CVBS Support CVBS
UART Support 3xUart,Include 1CH debug
I2C 2CH I2C
I2S I2S0/I2S1 with 8ch
SDIO 1CH SDIO(Wi-Fi AP6212)
SPI 1CH SPI
USB2.0 Built-in 2 USB 2.0 interfaces, one supports OTG
USB3.0 1CH USB3.0
Ethernet PHY Integrated IEEE 802.3/802.3u compliant 10/100Mbps Ethernet PHY
TF 1CH TF card
GPIO Defined function
upgrade Support USB card local upgrade

Mechanical feature

Dimension

size: 44 ± 0.35mm (W) × 44 ± 0.35mm (L) × 3 ± 0.15mm (H)

Dimension01
Dimension02

Pin define

Pin define01 1
Pin define02

Pin description

Pin number Name I/O Type Function
1 USB30_TXP O USB30_TXP
2 USB30_TXN O USB30_TXN
3 USB30_RXP I USB30_RXP
4 USB30_RXN I USB30_RXN
5 USB30_DP I/O USB30_DP
6 USB30_DM I/O USB30_DM
7 GND P GND
8 AOL O AOL
9 AOR O AOR
10 GND P Ground
11 VDAC_OUT O VDAC_OUT
12 GND P GND
13 GPIO0_A2 I/O GPIO0_A2/CLKOUT_GMAC_M0/SPDIF_TX_M2_d
14 MUTE_CTL O GPIO_MUTE_d
15 GPIO0_A0 I/O GPIO0_A0/CLKOUT_WIFI_M0_d
16 SDMMC0_PWREN O GPIO0_D6/FEPHY_LED_SPEED10/SDMMC0_PWREN_M1
17 SPDIF_TX_M0 O GPIO0_D3/SPDIF_TX_M0_d
18 HDMI_HPD I GPIO0_A4/HDMI_HPD_d
19 HDMI_SDA I/O I2C3_SDA/HDMI_SDA_od
20 HDMI_SCL O I2C3_SCL/HDMI_SCL_od
21 HDMI_CEC O HDMI_CEC
22 GND P GND
23 HDMI_TX_C- O HDMI_TX_C-
24 HDMI_TX_C+ O HDMI_TX_C+
25 GND P GND
26 HDMI_TX_D0- O HDMI_TX_D0-
27 HDMI_TX_D0+ O HDMI_TX_D0+
28 GND P GND
29 HDMI_TX_D1- O HDMI_TX_D1-
30 HDMI_TX_D1+ O HDMI_TX_D1+
31 GND P GND
32 HDMI_TX_D2- O HDMI_TX_D2-
33 HDMI_TX_D2+ O HDMI_TX_D2+
34 OTG20_DM I/O OTG20_DM
35 OTG20_DP I/O OTG20_DP
36 GND P GND
37 USB1_DM I/O USB1_DM
38 USB1_DP I/O USB1_DP
39 GND P GND
40 TD+ I/O TD+
41 TD- I/O TD-
42 GND P GND
43 RD+ I/O RD+
44 RD- I/O RD-
45 GND P GND
46 SDMMC0_DET I GPIO1_A5/SDMMC0_DETN_u
47 SDMMC0_D1 I/O GPIO1_A1/SDMMC0_D1/UART2_RX_M0_u
48 SDMMC0_D0 I/O GPIO1_A0/SDMMC0_D0/UART2_TX_M0_u
49 GND O GND
50 SDMMC0_CLK P GPIO1_A6/SDMMC0_CLK/TEST_CLK0_d
51 GND P GND
52 SDMMC0_CMD O GPIO1_A4/SDMMC0_CMD_u
53 SDMMC0_D3 I/O GPIO1_A3/SDMMC0_D3/JTAG_TMS_u
54 SDMMC0_D2 I/O GPIO1_A2/SDMMC0_D2/JTAG_TCK_u
55 UART0_RTSN I GPIO1_B2/UART0_RTSN/GMAC_RXD1_M1_d
56 UART0_TX O GPIO1_B1/UART0_TX/GMAC_TXD0_M1_u
57 UART0_RX I GPIO1_B0/UART0_RX/GMAC_TXD1_M1_u
58 UART0_CTSN O GPIO1_B3/UART0_CTSN/GMAC_RXD0_M1_d
59 GND P GND
60 PCM_SYNC O GPIO1_C7/I2S2_LRCK_TX_M0/GMAC_MDC_M1/PDM_SDI0_M1_d
61 PCM_TX O GPIO1_D1/I2S2_SDO_M0/GMAC_TXEN_M1/PDM_SDI2_M1_d
62 PCM_CLK O GPIO1_C6/I2S2_SCLK_M0/GMAC_RXDV_M1/PDM_CLK_M1_u
63 PCM_RX I GPIO1_D0/I2S2_SDI_M0/GMAC_RXER_M1/PDM_SDI1_M1_d
64 GND P GND
65 32K_OUT O GPIO1_D4/CLK32KOUT_M1_d
66 GND P GND
67 SDMMC1_D1 I/O GPIO1_B7/SDMMC1_D1/GMAC_RXD2_M1_u
68 SDMMC1_D0 I/O GPIO1_B6/SDMMC1_D0/GMAC_RXD3_M1_u
69 GND P GND
70 SDMMC1_CLK O GPIO1_B4/SDMMC1_CLK/GMAC_TXCLK_M1_d
71 GND P GND
72 SDMMC1_CMD O GPIO1_B5/SDMMC1_CMD/GMAC_RXCLK_M1_u
73 SDMMC1_D3 I/O GPIO1_C1/SDMMC1_D3/GMAC_TXD2_M1_u
74 SDMMC1_D2 I/O GPIO1_C0/SDMMC1_D2/GMAC_TXD3_M1_u
75 GND P GND
76 Wi-Fi_WAKE_HOST P GPIO1_C3/SDMMC1_DET/GMAC_MDIO_M1/PDM_FSYNC_M1_u
77 WIFI_REG_ON O GPIO1_C5/I2S2_MCLK/GMAC_CLK_M1_d
78 BT_WAKE_HOST I GPIO1_D2/I2S2_LRCK_RX_M0/CLKOUT_GMAC_M2/PDM_SDI3_M1_d
79 BT_REG_ON O GPIO1_C5/I2S2_MCLK/GMAC_CLK_M1_d
80 GND P GND
81 EMMC_KEY I UPDATA KEY
82 GND P GND
83 SARADC_IN1 I SARADC_IN1
84 RECOVER P SARADC_IN0
85 GND P GND
86 RESET I RESET
87 GND P GND
88 UART2_TX O GPIO2_A0/UART2_TX_M1/POWERSTATE0_d
89 UART2_RX I GPIO2_A1/UART2_RX_M1/POWERSTATE1_u
90 IR_RX I GPIO2_A2/IR_RX/POWERSTATE2_u
91 GND P GND
92 I2C1_SCL_PMIC O GPIO2_A5/PWM1/I2C1_SCL_u
93 I2C1_SDA_PMIC I/O GPIO2_A4/PWM0/I2C1_SDA_u
94 PMIC_SLEEP I GPIO2_D2/USB20_DRV_d
95 GPIO2_A3 I/O GPIO2_A3/EFUSE_PWREN/POWERSTATE3_u
96 PWR_KEY I PWR_KEY
97 RK805_32KOUT O RK805_32KOUT
98 GND P GND
99 GND P GND
100 VCC_SYS P Power input 5V
101 VCC_SYS P Power input 5V
102 PMU_EN I Power-on self-start setting switch 0=Power-on do’t turn on 1=Power-on to turn on
103 GND P GND
104 GND P GND
105 VCCIO_WL I Wi-Fi GPIO power 1.8V/3.3V
106 GND P GND
107 VCC_18 P POWER OUT 1V8 100mA
108 GND P GND
109 VCC_IO O POWER OUT 3V3 300mA
110 GND P GND
111 I2S1_SDI I GPIO2_C3/I2S1_SDI/PDM_SDI0_M0/CARD_CLK_M1_u
112 I2S1_SDIO3 I GPIO2_C6/I2S1_SDIO3/PDM_SDI3_M0/CARD_IO_M1_u
113 I2S1_SDIO2 I GPIO2_C5/I2S1_SDIO2/PDM_SDI2_M0/CARD_DET_M1_u
114 I2S1_SDIO1 I GPIO2_C4/I2S1_SDIO1/PDM_SDI1_M0/CARD_RST_M1_u
115 I2S1_SDO O GPIO2_C7/I2S1_SDO/PDM_FSYNC_M0_u
116 I2S1_LRCK_RX I GPIO2_C0/I2S1_LRCK_RX/TSP_D5_M1/CIF_D5_M1_u
117 I2S1_LRCK_TX O GPIO2_C1/I2S1_LRCK_TX/SPDIF_TX_M1/TSP_D6_M1/CIF_D6_M1_u
118 I2S1_SCLK O GPIO2_C2/I2S1_SCLK/PDM_CLK_M0/TSP_D7_M1/CIF_D7_M1_d
119 I2S1_MCLK O GPIO2_B7/I2S1_MCLK/TSP_SYNC_M1/CIF_CLKOUT_M1_d
120 GND P GND
121 I2C0_SCL O GPIO2_D0/I2C0_SCL/FEPHY_LED_LINK_M1_u
122 I2C0_SDA I/O GPIO2_D1/I2C0_SDA/FEPHY_LED_DATA_M1_u
123 GND P GND
124 UART1_TX O GPIO3_A4/TSP_D0/CIF_D0/SDMMC0EXT_D0/UART1_TX/USB3PHY_DEBUG4_u
125 USB20_HOST_DRV O GPIO3_A5/TSP_D1/CIF_D1/SDMMC0EXT_D1/UART1_RTSN/USB3PHY_DEBUG5_u
126 UART1_RX I GPIO3_A6/TSP_D2/CIF_D2/SDMMC0EXT_D2/UART1_RX/USB3PHY_DEBUG6_u
127 USB30_HOST_DRV O GPIO3_A7/TSP_D3/CIF_D3/SDMMC0EXT_D3/UART1_CTSN/USB3PHY_DEBUG7_u
128 GND P GND
129 SPI2_CS0 O GPIO3_B0/TSP_D4/CIF_D4/SPI_CSN0_M2/I2S2_LRCK_TX_M1/USB3PHY_DEBUG8/I2S2_LRCK_RX_M1_d
130 SPI2_TXD O GPIO3_A1/TSP_FAIL/CIF_HREF/SDMMC0EXT_DET/SPI_TXD_M2/USB3PHY_DEBUG2/I2S2_SDO_M1_u
131 SPI2_RXD I GPIO3_A2/TSP_CLK/CIF_CLKIN/SDMMC0EXT_CLK/SPI_RXD_M2/USB3PHY_DEBUG3/I2S2_SDI_M1_d
132 SPI2_CLK O GPIO3_A0/TSP_VALID/CIF_VSYNC/SDMMC0EXT_CMD/SPI_CLK_M2/USB3PHY_DEBUG1/I2S2_SCLK_M1_u

Note:

1. I-input; O-output; I/O-digital I/O; P-power supply.

Electrical Specification

Absolute Ratings

Parameters Description Min Typ Max Unit
Ts Store temperature -30 - 85
VBAT Input voltage 4.5 5 5.5 V
Electrostatic discharge voltage
(human body model)
TAMB-25℃ - - 2 KV
Electrostatic discharge voltage
(machine model)
TAMB-25℃ - - 0.5 KV

remark:Absolute maximum ratings specify the values beyond which the device may be damaged permanently. Long-term exposure to absolute maximum ratings conditions may affect device reliability.

Recommended Operating Condition

Parameters Description Min Typ. Max Unit
Ta Operating temperature -20 25 75 °C
VDD 4.75 5 5.25 V
VIL Low-level input voltage -0.3 - VDD*0.25 V
VIH High-level input voltage VDD*0.75 - 1.8/3.3 V
VOL Low-level output voltage - VDD*0.1 V
VOH High-level output voltage VDD*0.8 - - V
ISTD No-load running current - - 370 mA
Ipeak Peak current - 580 - mA

Production instructions

The SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours)

  • SMT devices:
    Mounter
    SPI
    Reflow soldering machine
    Thermal profiler
    Automated optical inspection (AOI) equipment
  • Baking devices:
    Cabinet oven
    Anti-electrostatic and heat-resistant trays
    Anti-electrostatic and heat-resistant gloves

Storage conditions for a delivered module

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • There is a humidity indicator card (HIC) in the packaging bag.
image01

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  • The packaging bag is damaged before unpacking.
  • There is no HIC in the packaging bag.
  • After unpacking, circles of 10% and above on the HIC become pink.
  • The total exposure time has lasted for over 168 hours since unpacking.
  • More than 12 months have passed since the sealing of the bag.

Baking settings

  • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
  • Time: 48 hours for reel package and 12 hours for tray package
  • Alarm temperature: 65°C for reel package and 135°C for tray package
  • Production-ready temperature after natural cooling: < 36°C
  • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

In the whole production process, take electrostatic discharge (ESD) protective measures

To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

image02
  • A: Temperature axis
  • B: Time axis
  • C: Liquids temperature: 217 to 220°C
  • D: Ramp-up slope: 1 to 3°C/s
  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
  • F: Duration above the liquids: 50 to 70s
  • G: Peak temperature: 235 to 245°C
  • H: Ramp-down slope: 1 to 4°C/s

Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

image03

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