Be A Dusun Distributor >>

RK3328 core board

Table of Contents

Core Board

The RK3328 core board belongs to the Android smart motherboard, which is generally suitable for face recognition, smart display terminal products, video terminal products, industrial automation terminal products, such as: advertising machines, digital signage, smart self-service terminals, smart retail terminals, smart homes, O2O Intelligent equipment, industrial control host, robot equipment, etc.

Overview

Product overview

RK3328 adopts ROCHCHIPRK3328Cortex-A53 quad-core processor, equipped with Android/Linux+QT/Ubuntu system, 1.5GHz high performance. Adopt Mali-450MP2GPU, support 4K video encoding, H.264 hard decoding. Multi-channel video output, rich core board interface, lead out all functional pins, support a variety of peripheral expansion, is your best choice for human-computer interaction and industrial control projects.

Product features

Stamp hole welded core board, onboard CVBS, HDMI display interface.

Support Android/Linux+QT system customization, provide system call interface API reference code, and perfectly support customer upper-level application APP development and SDK.

Chip Block Diagram

Chip Block Diagram

Mainboard Diagram

Mainboard Diagram

Basic parameters

ItemparameterRemark
ModeDSM-210Version V1.0
CPUROCKCHIPRK3328 Quad-core A53
GPUMali450MP2
RAMDDR4 default 1GB option 2GB
eMMC interfaceEMMC5.1 default:8GB;option:16GB/32GB/64GB
Power managementRK805-1
Li batteryNon
Input powerUp to 5V/2A
Operation systemAndriod7.1/Ubuntu16.04/Linux+QT/debian
TemperatureWorking Temperature:-20℃~75℃
Storage Temperature:-30℃~85℃
Humidly10~95%(Non-condensing)
Atmospheric pressure76Kpa ~106Kpa
Dimensions44mm×44mm×3mm

Common Interface

InterfaceInterfaces by the factory default firmware
HDMISupport up to 4k x 2k @ 60Hz
CVBSSupport CVBS
UARTSupport 3xUart,Include 1CH debug
I2C2CH I2C
I2SI2S0/I2S1 with 8ch
SDIO1CH SDIO(Wi-Fi AP6212)
SPI1CH SPI
USB2.0Built-in 2 USB 2.0 interfaces, one supports OTG
USB3.01CH USB3.0
Ethernet PHYIntegrated IEEE 802.3/802.3u compliant 10/100Mbps Ethernet PHY
TF1CH TF card
GPIODefined function
upgradeSupport USB card local upgrade

Mechanical feature

Dimension

size: 44 ± 0.35mm (W) × 44 ± 0.35mm (L) × 3 ± 0.15mm (H)

Dimension01
Dimension02

Pin define

Pin define01 1
Pin define02

Pin description

Pin numberNameI/O TypeFunction
1USB30_TXPOUSB30_TXP
2USB30_TXNOUSB30_TXN
3USB30_RXPIUSB30_RXP
4USB30_RXNIUSB30_RXN
5USB30_DPI/OUSB30_DP
6USB30_DMI/OUSB30_DM
7GNDPGND
8AOLOAOL
9AOROAOR
10GNDPGround
11VDAC_OUTOVDAC_OUT
12GNDPGND
13GPIO0_A2I/OGPIO0_A2/CLKOUT_GMAC_M0/SPDIF_TX_M2_d
14MUTE_CTLOGPIO_MUTE_d
15GPIO0_A0I/OGPIO0_A0/CLKOUT_WIFI_M0_d
16SDMMC0_PWRENOGPIO0_D6/FEPHY_LED_SPEED10/SDMMC0_PWREN_M1
17SPDIF_TX_M0OGPIO0_D3/SPDIF_TX_M0_d
18HDMI_HPDIGPIO0_A4/HDMI_HPD_d
19HDMI_SDAI/OI2C3_SDA/HDMI_SDA_od
20HDMI_SCLOI2C3_SCL/HDMI_SCL_od
21HDMI_CECOHDMI_CEC
22GNDPGND
23HDMI_TX_C-OHDMI_TX_C-
24HDMI_TX_C+OHDMI_TX_C+
25GNDPGND
26HDMI_TX_D0-OHDMI_TX_D0-
27HDMI_TX_D0+OHDMI_TX_D0+
28GNDPGND
29HDMI_TX_D1-OHDMI_TX_D1-
30HDMI_TX_D1+OHDMI_TX_D1+
31GNDPGND
32HDMI_TX_D2-OHDMI_TX_D2-
33HDMI_TX_D2+OHDMI_TX_D2+
34OTG20_DMI/OOTG20_DM
35OTG20_DPI/OOTG20_DP
36GNDPGND
37USB1_DMI/OUSB1_DM
38USB1_DPI/OUSB1_DP
39GNDPGND
40TD+I/OTD+
41TD-I/OTD-
42GNDPGND
43RD+I/ORD+
44RD-I/ORD-
45GNDPGND
46SDMMC0_DETIGPIO1_A5/SDMMC0_DETN_u
47SDMMC0_D1I/OGPIO1_A1/SDMMC0_D1/UART2_RX_M0_u
48SDMMC0_D0I/OGPIO1_A0/SDMMC0_D0/UART2_TX_M0_u
49GNDOGND
50SDMMC0_CLKPGPIO1_A6/SDMMC0_CLK/TEST_CLK0_d
51GNDPGND
52SDMMC0_CMDOGPIO1_A4/SDMMC0_CMD_u
53SDMMC0_D3I/OGPIO1_A3/SDMMC0_D3/JTAG_TMS_u
54SDMMC0_D2I/OGPIO1_A2/SDMMC0_D2/JTAG_TCK_u
55UART0_RTSNIGPIO1_B2/UART0_RTSN/GMAC_RXD1_M1_d
56UART0_TXOGPIO1_B1/UART0_TX/GMAC_TXD0_M1_u
57UART0_RXIGPIO1_B0/UART0_RX/GMAC_TXD1_M1_u
58UART0_CTSNOGPIO1_B3/UART0_CTSN/GMAC_RXD0_M1_d
59GNDPGND
60PCM_SYNCOGPIO1_C7/I2S2_LRCK_TX_M0/GMAC_MDC_M1/PDM_SDI0_M1_d
61PCM_TXOGPIO1_D1/I2S2_SDO_M0/GMAC_TXEN_M1/PDM_SDI2_M1_d
62PCM_CLKOGPIO1_C6/I2S2_SCLK_M0/GMAC_RXDV_M1/PDM_CLK_M1_u
63PCM_RXIGPIO1_D0/I2S2_SDI_M0/GMAC_RXER_M1/PDM_SDI1_M1_d
64GNDPGND
6532K_OUTOGPIO1_D4/CLK32KOUT_M1_d
66GNDPGND
67SDMMC1_D1I/OGPIO1_B7/SDMMC1_D1/GMAC_RXD2_M1_u
68SDMMC1_D0I/OGPIO1_B6/SDMMC1_D0/GMAC_RXD3_M1_u
69GNDPGND
70SDMMC1_CLKOGPIO1_B4/SDMMC1_CLK/GMAC_TXCLK_M1_d
71GNDPGND
72SDMMC1_CMDOGPIO1_B5/SDMMC1_CMD/GMAC_RXCLK_M1_u
73SDMMC1_D3I/OGPIO1_C1/SDMMC1_D3/GMAC_TXD2_M1_u
74SDMMC1_D2I/OGPIO1_C0/SDMMC1_D2/GMAC_TXD3_M1_u
75GNDPGND
76Wi-Fi_WAKE_HOSTPGPIO1_C3/SDMMC1_DET/GMAC_MDIO_M1/PDM_FSYNC_M1_u
77WIFI_REG_ONOGPIO1_C5/I2S2_MCLK/GMAC_CLK_M1_d
78BT_WAKE_HOSTIGPIO1_D2/I2S2_LRCK_RX_M0/CLKOUT_GMAC_M2/PDM_SDI3_M1_d
79BT_REG_ONOGPIO1_C5/I2S2_MCLK/GMAC_CLK_M1_d
80GNDPGND
81EMMC_KEYIUPDATA KEY
82GNDPGND
83SARADC_IN1ISARADC_IN1
84RECOVERPSARADC_IN0
85GNDPGND
86RESETIRESET
87GNDPGND
88UART2_TXOGPIO2_A0/UART2_TX_M1/POWERSTATE0_d
89UART2_RXIGPIO2_A1/UART2_RX_M1/POWERSTATE1_u
90IR_RXIGPIO2_A2/IR_RX/POWERSTATE2_u
91GNDPGND
92I2C1_SCL_PMICOGPIO2_A5/PWM1/I2C1_SCL_u
93I2C1_SDA_PMICI/OGPIO2_A4/PWM0/I2C1_SDA_u
94PMIC_SLEEPIGPIO2_D2/USB20_DRV_d
95GPIO2_A3I/OGPIO2_A3/EFUSE_PWREN/POWERSTATE3_u
96PWR_KEYIPWR_KEY
97RK805_32KOUTORK805_32KOUT
98GNDPGND
99GNDPGND
100VCC_SYSPPower input 5V
101VCC_SYSPPower input 5V
102PMU_ENIPower-on self-start setting switch 0=Power-on do’t turn on 1=Power-on to turn on
103GNDPGND
104GNDPGND
105VCCIO_WLIWi-Fi GPIO power 1.8V/3.3V
106GNDPGND
107VCC_18PPOWER OUT 1V8 100mA
108GNDPGND
109VCC_IOOPOWER OUT 3V3 300mA
110GNDPGND
111I2S1_SDIIGPIO2_C3/I2S1_SDI/PDM_SDI0_M0/CARD_CLK_M1_u
112I2S1_SDIO3IGPIO2_C6/I2S1_SDIO3/PDM_SDI3_M0/CARD_IO_M1_u
113I2S1_SDIO2IGPIO2_C5/I2S1_SDIO2/PDM_SDI2_M0/CARD_DET_M1_u
114I2S1_SDIO1IGPIO2_C4/I2S1_SDIO1/PDM_SDI1_M0/CARD_RST_M1_u
115I2S1_SDOOGPIO2_C7/I2S1_SDO/PDM_FSYNC_M0_u
116I2S1_LRCK_RXIGPIO2_C0/I2S1_LRCK_RX/TSP_D5_M1/CIF_D5_M1_u
117I2S1_LRCK_TXOGPIO2_C1/I2S1_LRCK_TX/SPDIF_TX_M1/TSP_D6_M1/CIF_D6_M1_u
118I2S1_SCLKOGPIO2_C2/I2S1_SCLK/PDM_CLK_M0/TSP_D7_M1/CIF_D7_M1_d
119I2S1_MCLKOGPIO2_B7/I2S1_MCLK/TSP_SYNC_M1/CIF_CLKOUT_M1_d
120GNDPGND
121I2C0_SCLOGPIO2_D0/I2C0_SCL/FEPHY_LED_LINK_M1_u
122I2C0_SDAI/OGPIO2_D1/I2C0_SDA/FEPHY_LED_DATA_M1_u
123GNDPGND
124UART1_TXOGPIO3_A4/TSP_D0/CIF_D0/SDMMC0EXT_D0/UART1_TX/USB3PHY_DEBUG4_u
125USB20_HOST_DRVOGPIO3_A5/TSP_D1/CIF_D1/SDMMC0EXT_D1/UART1_RTSN/USB3PHY_DEBUG5_u
126UART1_RXIGPIO3_A6/TSP_D2/CIF_D2/SDMMC0EXT_D2/UART1_RX/USB3PHY_DEBUG6_u
127USB30_HOST_DRVOGPIO3_A7/TSP_D3/CIF_D3/SDMMC0EXT_D3/UART1_CTSN/USB3PHY_DEBUG7_u
128GNDPGND
129SPI2_CS0OGPIO3_B0/TSP_D4/CIF_D4/SPI_CSN0_M2/I2S2_LRCK_TX_M1/USB3PHY_DEBUG8/I2S2_LRCK_RX_M1_d
130SPI2_TXDOGPIO3_A1/TSP_FAIL/CIF_HREF/SDMMC0EXT_DET/SPI_TXD_M2/USB3PHY_DEBUG2/I2S2_SDO_M1_u
131SPI2_RXDIGPIO3_A2/TSP_CLK/CIF_CLKIN/SDMMC0EXT_CLK/SPI_RXD_M2/USB3PHY_DEBUG3/I2S2_SDI_M1_d
132SPI2_CLKOGPIO3_A0/TSP_VALID/CIF_VSYNC/SDMMC0EXT_CMD/SPI_CLK_M2/USB3PHY_DEBUG1/I2S2_SCLK_M1_u

Note:

1. I-input; O-output; I/O-digital I/O; P-power supply.

Electrical Specification

Absolute Ratings

ParametersDescriptionMinTypMaxUnit
TsStore temperature-30-85
VBATInput voltage4.555.5V
Electrostatic discharge voltage
(human body model)
TAMB-25℃--2KV
Electrostatic discharge voltage
(machine model)
TAMB-25℃--0.5KV

remark:Absolute maximum ratings specify the values beyond which the device may be damaged permanently. Long-term exposure to absolute maximum ratings conditions may affect device reliability.

Recommended Operating Condition

ParametersDescriptionMinTyp.MaxUnit
TaOperating temperature-202575°C
VDD4.7555.25V
VILLow-level input voltage-0.3-VDD*0.25V
VIHHigh-level input voltageVDD*0.75-1.8/3.3V
VOLLow-level output voltage-VDD*0.1V
VOHHigh-level output voltageVDD*0.8--V
ISTDNo-load running current--370mA
IpeakPeak current-580-mA

Production instructions

The SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours)

  • SMT devices:
    Mounter
    SPI
    Reflow soldering machine
    Thermal profiler
    Automated optical inspection (AOI) equipment
  • Baking devices:
    Cabinet oven
    Anti-electrostatic and heat-resistant trays
    Anti-electrostatic and heat-resistant gloves

Storage conditions for a delivered module

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • There is a humidity indicator card (HIC) in the packaging bag.
image01

Add Your Heading Text Here

  • The packaging bag is damaged before unpacking.
  • There is no HIC in the packaging bag.
  • After unpacking, circles of 10% and above on the HIC become pink.
  • The total exposure time has lasted for over 168 hours since unpacking.
  • More than 12 months have passed since the sealing of the bag.

Baking settings

  • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
  • Time: 48 hours for reel package and 12 hours for tray package
  • Alarm temperature: 65°C for reel package and 135°C for tray package
  • Production-ready temperature after natural cooling: < 36°C
  • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

In the whole production process, take electrostatic discharge (ESD) protective measures

To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

image02
  • A: Temperature axis
  • B: Time axis
  • C: Liquids temperature: 217 to 220°C
  • D: Ramp-up slope: 1 to 3°C/s
  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
  • F: Duration above the liquids: 50 to 70s
  • G: Peak temperature: 235 to 245°C
  • H: Ramp-down slope: 1 to 4°C/s

Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

image03

Looking For An IoT Device Supplier For Your Projects?

CONTACT US

    This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

    CONTACT US

      This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

      Welcome to DusunIoT

      Hi there 👋 Is there anything we can help you with today? Please fill in the form below for the team to follow up if you become disconnected.