Core Board
The RK3328 core board belongs to the Android smart motherboard, which is generally suitable for face recognition, smart display terminal products, video terminal products, industrial automation terminal products, such as: advertising machines, digital signage, smart self-service terminals, smart retail terminals, smart homes, O2O Intelligent equipment, industrial control host, robot equipment, etc.
Overview
Product overview
RK3328 adopts ROCHCHIPRK3328Cortex-A53 quad-core processor, equipped with Android/Linux+QT/Ubuntu system, 1.5GHz high performance. Adopt Mali-450MP2GPU, support 4K video encoding, H.264 hard decoding. Multi-channel video output, rich core board interface, lead out all functional pins, support a variety of peripheral expansion, is your best choice for human-computer interaction and industrial control projects.
Product features
Stamp hole welded core board, onboard CVBS, HDMI display interface.
Support Android/Linux+QT system customization, provide system call interface API reference code, and perfectly support customer upper-level application APP development and SDK.
Chip Block Diagram
Mainboard Diagram
Basic parameters
| Item | parameter | Remark |
|---|---|---|
| Mode | DSM-210 | Version V1.0 |
| CPU | ROCKCHIPRK3328 Quad-core A53 | |
| GPU | Mali450MP2 | |
| RAM | DDR4 default 1GB option 2GB | |
| eMMC interface | EMMC5.1 default:8GB;option:16GB/32GB/64GB | |
| Power management | RK805-1 | |
| Li battery | Non | |
| Input power | Up to 5V/2A | |
| Operation system | Andriod7.1/Ubuntu16.04/Linux+QT/debian | |
| Temperature | Working Temperature：-20℃~75℃ | |
| Storage Temperature：-30℃~85℃ | ||
| Humidly | 10~95%(Non-condensing) | |
| Atmospheric pressure | 76Kpa ~106Kpa | |
| Dimensions | 44mm×44mm×3mm |
Common Interface
| Interface | Interfaces by the factory default firmware |
|---|---|
| HDMI | Support up to 4k x 2k @ 60Hz |
| CVBS | Support CVBS |
| UART | Support 3xUart，Include 1CH debug |
| I2C | 2CH I2C |
| I2S | I2S0/I2S1 with 8ch |
| SDIO | 1CH SDIO(Wi-Fi AP6212) |
| SPI | 1CH SPI |
| USB2.0 | Built-in 2 USB 2.0 interfaces, one supports OTG |
| USB3.0 | 1CH USB3.0 |
| Ethernet PHY | Integrated IEEE 802.3/802.3u compliant 10/100Mbps Ethernet PHY |
| TF | 1CH TF card |
| GPIO | Defined function |
| upgrade | Support USB card local upgrade |
Mechanical feature
Dimension
size: 44 ± 0.35mm (W) × 44 ± 0.35mm (L) × 3 ± 0.15mm (H)
Pin define
Pin description
| Pin number | Name | I/O Type | Function |
|---|---|---|---|
| 1 | USB30_TXP | O | USB30_TXP |
| 2 | USB30_TXN | O | USB30_TXN |
| 3 | USB30_RXP | I | USB30_RXP |
| 4 | USB30_RXN | I | USB30_RXN |
| 5 | USB30_DP | I/O | USB30_DP |
| 6 | USB30_DM | I/O | USB30_DM |
| 7 | GND | P | GND |
| 8 | AOL | O | AOL |
| 9 | AOR | O | AOR |
| 10 | GND | P | Ground |
| 11 | VDAC_OUT | O | VDAC_OUT |
| 12 | GND | P | GND |
| 13 | GPIO0_A2 | I/O | GPIO0_A2/CLKOUT_GMAC_M0/SPDIF_TX_M2_d |
| 14 | MUTE_CTL | O | GPIO_MUTE_d |
| 15 | GPIO0_A0 | I/O | GPIO0_A0/CLKOUT_WIFI_M0_d |
| 16 | SDMMC0_PWREN | O | GPIO0_D6/FEPHY_LED_SPEED10/SDMMC0_PWREN_M1 |
| 17 | SPDIF_TX_M0 | O | GPIO0_D3/SPDIF_TX_M0_d |
| 18 | HDMI_HPD | I | GPIO0_A4/HDMI_HPD_d |
| 19 | HDMI_SDA | I/O | I2C3_SDA/HDMI_SDA_od |
| 20 | HDMI_SCL | O | I2C3_SCL/HDMI_SCL_od |
| 21 | HDMI_CEC | O | HDMI_CEC |
| 22 | GND | P | GND |
| 23 | HDMI_TX_C- | O | HDMI_TX_C- |
| 24 | HDMI_TX_C+ | O | HDMI_TX_C+ |
| 25 | GND | P | GND |
| 26 | HDMI_TX_D0- | O | HDMI_TX_D0- |
| 27 | HDMI_TX_D0+ | O | HDMI_TX_D0+ |
| 28 | GND | P | GND |
| 29 | HDMI_TX_D1- | O | HDMI_TX_D1- |
| 30 | HDMI_TX_D1+ | O | HDMI_TX_D1+ |
| 31 | GND | P | GND |
| 32 | HDMI_TX_D2- | O | HDMI_TX_D2- |
| 33 | HDMI_TX_D2+ | O | HDMI_TX_D2+ |
| 34 | OTG20_DM | I/O | OTG20_DM |
| 35 | OTG20_DP | I/O | OTG20_DP |
| 36 | GND | P | GND |
| 37 | USB1_DM | I/O | USB1_DM |
| 38 | USB1_DP | I/O | USB1_DP |
| 39 | GND | P | GND |
| 40 | TD+ | I/O | TD+ |
| 41 | TD- | I/O | TD- |
| 42 | GND | P | GND |
| 43 | RD+ | I/O | RD+ |
| 44 | RD- | I/O | RD- |
| 45 | GND | P | GND |
| 46 | SDMMC0_DET | I | GPIO1_A5/SDMMC0_DETN_u |
| 47 | SDMMC0_D1 | I/O | GPIO1_A1/SDMMC0_D1/UART2_RX_M0_u |
| 48 | SDMMC0_D0 | I/O | GPIO1_A0/SDMMC0_D0/UART2_TX_M0_u |
| 49 | GND | O | GND |
| 50 | SDMMC0_CLK | P | GPIO1_A6/SDMMC0_CLK/TEST_CLK0_d |
| 51 | GND | P | GND |
| 52 | SDMMC0_CMD | O | GPIO1_A4/SDMMC0_CMD_u |
| 53 | SDMMC0_D3 | I/O | GPIO1_A3/SDMMC0_D3/JTAG_TMS_u |
| 54 | SDMMC0_D2 | I/O | GPIO1_A2/SDMMC0_D2/JTAG_TCK_u |
| 55 | UART0_RTSN | I | GPIO1_B2/UART0_RTSN/GMAC_RXD1_M1_d |
| 56 | UART0_TX | O | GPIO1_B1/UART0_TX/GMAC_TXD0_M1_u |
| 57 | UART0_RX | I | GPIO1_B0/UART0_RX/GMAC_TXD1_M1_u |
| 58 | UART0_CTSN | O | GPIO1_B3/UART0_CTSN/GMAC_RXD0_M1_d |
| 59 | GND | P | GND |
| 60 | PCM_SYNC | O | GPIO1_C7/I2S2_LRCK_TX_M0/GMAC_MDC_M1/PDM_SDI0_M1_d |
| 61 | PCM_TX | O | GPIO1_D1/I2S2_SDO_M0/GMAC_TXEN_M1/PDM_SDI2_M1_d |
| 62 | PCM_CLK | O | GPIO1_C6/I2S2_SCLK_M0/GMAC_RXDV_M1/PDM_CLK_M1_u |
| 63 | PCM_RX | I | GPIO1_D0/I2S2_SDI_M0/GMAC_RXER_M1/PDM_SDI1_M1_d |
| 64 | GND | P | GND |
| 65 | 32K_OUT | O | GPIO1_D4/CLK32KOUT_M1_d |
| 66 | GND | P | GND |
| 67 | SDMMC1_D1 | I/O | GPIO1_B7/SDMMC1_D1/GMAC_RXD2_M1_u |
| 68 | SDMMC1_D0 | I/O | GPIO1_B6/SDMMC1_D0/GMAC_RXD3_M1_u |
| 69 | GND | P | GND |
| 70 | SDMMC1_CLK | O | GPIO1_B4/SDMMC1_CLK/GMAC_TXCLK_M1_d |
| 71 | GND | P | GND |
| 72 | SDMMC1_CMD | O | GPIO1_B5/SDMMC1_CMD/GMAC_RXCLK_M1_u |
| 73 | SDMMC1_D3 | I/O | GPIO1_C1/SDMMC1_D3/GMAC_TXD2_M1_u |
| 74 | SDMMC1_D2 | I/O | GPIO1_C0/SDMMC1_D2/GMAC_TXD3_M1_u |
| 75 | GND | P | GND |
| 76 | Wi-Fi_WAKE_HOST | P | GPIO1_C3/SDMMC1_DET/GMAC_MDIO_M1/PDM_FSYNC_M1_u |
| 77 | WIFI_REG_ON | O | GPIO1_C5/I2S2_MCLK/GMAC_CLK_M1_d |
| 78 | BT_WAKE_HOST | I | GPIO1_D2/I2S2_LRCK_RX_M0/CLKOUT_GMAC_M2/PDM_SDI3_M1_d |
| 79 | BT_REG_ON | O | GPIO1_C5/I2S2_MCLK/GMAC_CLK_M1_d |
| 80 | GND | P | GND |
| 81 | EMMC_KEY | I | UPDATA KEY |
| 82 | GND | P | GND |
| 83 | SARADC_IN1 | I | SARADC_IN1 |
| 84 | RECOVER | P | SARADC_IN0 |
| 85 | GND | P | GND |
| 86 | RESET | I | RESET |
| 87 | GND | P | GND |
| 88 | UART2_TX | O | GPIO2_A0/UART2_TX_M1/POWERSTATE0_d |
| 89 | UART2_RX | I | GPIO2_A1/UART2_RX_M1/POWERSTATE1_u |
| 90 | IR_RX | I | GPIO2_A2/IR_RX/POWERSTATE2_u |
| 91 | GND | P | GND |
| 92 | I2C1_SCL_PMIC | O | GPIO2_A5/PWM1/I2C1_SCL_u |
| 93 | I2C1_SDA_PMIC | I/O | GPIO2_A4/PWM0/I2C1_SDA_u |
| 94 | PMIC_SLEEP | I | GPIO2_D2/USB20_DRV_d |
| 95 | GPIO2_A3 | I/O | GPIO2_A3/EFUSE_PWREN/POWERSTATE3_u |
| 96 | PWR_KEY | I | PWR_KEY |
| 97 | RK805_32KOUT | O | RK805_32KOUT |
| 98 | GND | P | GND |
| 99 | GND | P | GND |
| 100 | VCC_SYS | P | Power input 5V |
| 101 | VCC_SYS | P | Power input 5V |
| 102 | PMU_EN | I | Power-on self-start setting switch 0=Power-on do’t turn on 1=Power-on to turn on |
| 103 | GND | P | GND |
| 104 | GND | P | GND |
| 105 | VCCIO_WL | I | Wi-Fi GPIO power 1.8V/3.3V |
| 106 | GND | P | GND |
| 107 | VCC_18 | P | POWER OUT 1V8 100mA |
| 108 | GND | P | GND |
| 109 | VCC_IO | O | POWER OUT 3V3 300mA |
| 110 | GND | P | GND |
| 111 | I2S1_SDI | I | GPIO2_C3/I2S1_SDI/PDM_SDI0_M0/CARD_CLK_M1_u |
| 112 | I2S1_SDIO3 | I | GPIO2_C6/I2S1_SDIO3/PDM_SDI3_M0/CARD_IO_M1_u |
| 113 | I2S1_SDIO2 | I | GPIO2_C5/I2S1_SDIO2/PDM_SDI2_M0/CARD_DET_M1_u |
| 114 | I2S1_SDIO1 | I | GPIO2_C4/I2S1_SDIO1/PDM_SDI1_M0/CARD_RST_M1_u |
| 115 | I2S1_SDO | O | GPIO2_C7/I2S1_SDO/PDM_FSYNC_M0_u |
| 116 | I2S1_LRCK_RX | I | GPIO2_C0/I2S1_LRCK_RX/TSP_D5_M1/CIF_D5_M1_u |
| 117 | I2S1_LRCK_TX | O | GPIO2_C1/I2S1_LRCK_TX/SPDIF_TX_M1/TSP_D6_M1/CIF_D6_M1_u |
| 118 | I2S1_SCLK | O | GPIO2_C2/I2S1_SCLK/PDM_CLK_M0/TSP_D7_M1/CIF_D7_M1_d |
| 119 | I2S1_MCLK | O | GPIO2_B7/I2S1_MCLK/TSP_SYNC_M1/CIF_CLKOUT_M1_d |
| 120 | GND | P | GND |
| 121 | I2C0_SCL | O | GPIO2_D0/I2C0_SCL/FEPHY_LED_LINK_M1_u |
| 122 | I2C0_SDA | I/O | GPIO2_D1/I2C0_SDA/FEPHY_LED_DATA_M1_u |
| 123 | GND | P | GND |
| 124 | UART1_TX | O | GPIO3_A4/TSP_D0/CIF_D0/SDMMC0EXT_D0/UART1_TX/USB3PHY_DEBUG4_u |
| 125 | USB20_HOST_DRV | O | GPIO3_A5/TSP_D1/CIF_D1/SDMMC0EXT_D1/UART1_RTSN/USB3PHY_DEBUG5_u |
| 126 | UART1_RX | I | GPIO3_A6/TSP_D2/CIF_D2/SDMMC0EXT_D2/UART1_RX/USB3PHY_DEBUG6_u |
| 127 | USB30_HOST_DRV | O | GPIO3_A7/TSP_D3/CIF_D3/SDMMC0EXT_D3/UART1_CTSN/USB3PHY_DEBUG7_u |
| 128 | GND | P | GND |
| 129 | SPI2_CS0 | O | GPIO3_B0/TSP_D4/CIF_D4/SPI_CSN0_M2/I2S2_LRCK_TX_M1/USB3PHY_DEBUG8/I2S2_LRCK_RX_M1_d |
| 130 | SPI2_TXD | O | GPIO3_A1/TSP_FAIL/CIF_HREF/SDMMC0EXT_DET/SPI_TXD_M2/USB3PHY_DEBUG2/I2S2_SDO_M1_u |
| 131 | SPI2_RXD | I | GPIO3_A2/TSP_CLK/CIF_CLKIN/SDMMC0EXT_CLK/SPI_RXD_M2/USB3PHY_DEBUG3/I2S2_SDI_M1_d |
| 132 | SPI2_CLK | O | GPIO3_A0/TSP_VALID/CIF_VSYNC/SDMMC0EXT_CMD/SPI_CLK_M2/USB3PHY_DEBUG1/I2S2_SCLK_M1_u |
Note：
1. I-input; O-output; I/O-digital I/O; P-power supply.
Electrical Specification
Absolute Ratings
| Parameters | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Ts | Store temperature | -30 | - | 85 | ℃ |
| VBAT | Input voltage | 4.5 | 5 | 5.5 | V |
| Electrostatic discharge voltage (human body model) | TAMB-25℃ | - | - | 2 | KV |
| Electrostatic discharge voltage (machine model) | TAMB-25℃ | - | - | 0.5 | KV |
remark：Absolute maximum ratings specify the values beyond which the device may be damaged permanently. Long-term exposure to absolute maximum ratings conditions may affect device reliability.
Recommended Operating Condition
| Parameters | Description | Min | Typ. | Max | Unit |
|---|---|---|---|---|---|
| Ta | Operating temperature | -20 | 25 | 75 | °C |
| VDD | 4.75 | 5 | 5.25 | V | |
| VIL | Low-level input voltage | -0.3 | - | VDD*0.25 | V |
| VIH | High-level input voltage | VDD*0.75 | - | 1.8/3.3 | V |
| VOL | Low-level output voltage | - | VDD*0.1 | V | |
| VOH | High-level output voltage | VDD*0.8 | - | - | V |
| ISTD | No-load running current | - | - | 370 | mA |
| Ipeak | Peak current | - | 580 | - | mA |
Production instructions
The SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours)
- SMT devices:
Mounter
SPI
Reflow soldering machine
Thermal profiler
Automated optical inspection (AOI) equipment - Baking devices:
Cabinet oven
Anti-electrostatic and heat-resistant trays
Anti-electrostatic and heat-resistant gloves
Storage conditions for a delivered module
- The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
- The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
- There is a humidity indicator card (HIC) in the packaging bag.
Add Your Heading Text Here
- The packaging bag is damaged before unpacking.
- There is no HIC in the packaging bag.
- After unpacking, circles of 10% and above on the HIC become pink.
- The total exposure time has lasted for over 168 hours since unpacking.
- More than 12 months have passed since the sealing of the bag.
Baking settings
- Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
- Time: 48 hours for reel package and 12 hours for tray package
- Alarm temperature: 65°C for reel package and 135°C for tray package
- Production-ready temperature after natural cooling: < 36°C
- Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
- If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
In the whole production process, take electrostatic discharge (ESD) protective measures
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Recommended oven temperature curve
Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:
- A: Temperature axis
- B: Time axis
- C: Liquids temperature: 217 to 220°C
- D: Ramp-up slope: 1 to 3°C/s
- E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
- F: Duration above the liquids: 50 to 70s
- G: Peak temperature: 235 to 245°C
- H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Storage conditions
