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BLE Cloud Module

Table of Contents

1 Introduction

1.1 Purpose& Description

DSM-05D is a low power-consuming embedded BLE module developed By Roombanker. It consists of the highly integrated wireless radio processor chip, EFR32BG21A020F768IM32-B, and several peripherals, with a built-in BLE protocol stack and robust library functions.

This data terminal device is embedded with the high-performance 32-bit 80 MHz ARM Cortex®-M33 CPU with DSP instructions and floating point unit for efficient signal processing, 768 KB flash memory, 64 KB RAM data memory, and robust peripheral resources. It is mainly used for BLE coordinator device to support BLE 5.1 protocol stack.

1.2 Product Feature Summary
  • High-performance 32-bit 80 MHz ARM Cortex®-M33 with DSP instructions and floating point unit for efficient signal processing
  • Up to 768kB Flash programming memory
  • Up to 64kB RAM data memory
  • Working voltage: 1.71 V to 3.8 V
  • BLE operating feature
    1. Bluetooth 5.1 and Bluetooth Mesh supported
    2. Working channel: [email protected] GHz to 2.483 GHz, with an air interface, rate of 2Mbps
    3. Maximum output power: +19.5 dBm; dynamic difference of output power: > 35 dB
    4. Working Distance:

Min 200m @Output power 8dBm (longrange)

Min 400m @output power 19dBm (longrange)

  • Dimension: 17 x 22 x 2.8 mm
  • Working temperature: –40°C to +85°C
  • Certification CE, FCC, SRRC
1.3 Scenario
  • Intelligent Building
  • Intelligent Home And Household Applications
  • Industrial Wireless Control
  • Intelligent Public Traffic

2 Mechanical Requirement

2.1 Dimensions

DSM-05D provides two rows of pins(2 * 14) with the pin pitch of 1.27±0.1mm

Dimensions: 17±0.35 mm (W) x 22±0.35 mm (L) x 2.8±0.15 mm (H).

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2.3 Pin Definition
Pin NumberSymbolIO TypeFunction
1GNDPPower supply reference ground pin
2ANTRFRF signal input/output port, which corresponds to ANT of IC
3GNDPPower supply reference ground pin
4NCNot connect
5PA0I/OCorresponding to PA0 of IC
6PC5I/OCorresponding to PC5 of IC
7PC4I/OCorresponding to PC4 of IC
8PA3I/OCorresponding to PA3 of IC
9PA4I/OCorresponding to PA4 of IC
10PC1I/OCorresponding to PC1 of IC
11PC0I/OCorresponding to PC0 of IC
12PD4I/OCorresponding to PD4 of IC
13PD3I/OCorresponding to PD3 of IC
14PD2I/OCorresponding to PD2 of IC
15NCNot connect
16NCNot connect
17PB0I/OCorresponding to PB0 of IC
18PB1I/OCorresponding to PB1 of IC
19NCNot connect
20GNDPPower supply reference ground pin
21VCCPPower supply pin (3.3V)
22RX0ICorresponding to internal RXD0 of IC
23TX0OCorresponding to internal TXD0 of IC
24SWDIOI/OCorresponding to internal SWDIO of IC
25SWCLKI/OCorresponding to PF2 of IC
26PC3I/OCorresponding to PF3 of IC
27PC2I/ONot connect
28nRESETIHardware reset pin, which is at a high level by default and is active at a low level

• P indicates power supply pins, I/O indicates input/output pins

3 Electrical parameters

3.1 Absolute electrical parameters
ParameterDescriptionTypical valueMinimum valueMaximum valueUnit
TsStorage temperature-50105
VCCPower supply voltage1.713.8V
Static electricity voltage (human body model)TAMB-25℃-KV
Static electricity voltage (machine model)TAMB-25℃-KV
3.2 Working conditions
ParameterDescriptionMinimum valueMaximum valueTypical valueUnit
TaWorking temperature-40125-
VCCPower supply voltage1.713.83V
VILI/O low-level input-I0VDD*0.3V
VIHI/O high-level inputI0VDD*0.7--V
VOLI/O low-level output-I0VDD*0.2-V
VOHI/O high-level outputI0VDD*0.8--V
3.3 Current consumption during constant transmission and receiving
Working statusModeTX Power/ ReceivingTypical valueAverage valueUnit
TXCW Mode+20dBm185mA
TXCW Mode+10dBm60.8mA
TXCW Mode+0dBm10.5mA
RX2MbpsConstant receiving9.4mA
RX1MbpsConstant receiving8.8mA
RX500KbpsConstant receiving9.1mA
RX125KbpsConstant receiving9

4 RF features

4.1 Basic RF feature
ParameterDescription
Frequency band2.412~2.484GHz
Wi-Fi standardBLE5.1
Data transmission rate2Mbps max
Antenna typePCB antenna with a gain of 1dBi. IPEX (optional)
4.2 TX performance (Performance during constant transmission)
ParameterMinimum valueTypical valueMaximum valueUnit
Maximum output power-19.5-dBm
Minimum output power--20.5-dBm
Output power adjustment step-0.5dBm
Output spectrum adjacent-channel rejection ratio--47-dBc
Frequency error-15-15ppm
4.3 RX performance (RX sensitivity)
ParameterMinimum valueTypical valueMaximum valueUnit
PER<1%, RX sensitivity(BLE 250Kbps)-95-94-93dBm

5 Antenna

5.1 Antenna type

This product uses an onboard PCB antenna or IPEX.

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.

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7 Production instructions

1. Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
    1. Reflow soldering machine
    2. Automated optical inspection (AOI) equipment
    3. Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
    1. Cabinet oven
    2. Anti-static heat-resistant trays
    3. Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30 ℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
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3.Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4.Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5.Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.

6.Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

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7.2 Storage conditions
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8 MOQ and packing

Product modelMOQ(pcs)Packing methodNumber of Modules in each reel packNumber of reel packs in each box
DSM-05D2800Carrier tape and reel packing7004

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