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DSM-036 Wi-Fi6 and BLE Dual Cloud Module

Table of Contents

1. Introduction

1.1 Purpose& Description

Dsm-036 is an Internet of Things wireless module with a stamp hole interface designed based on embedded WI-FI6 +BLE SoC chip ECR6600. It includes PCB onboard antenna and IPEX seat. In addition to this,  It has a small size and rich interfaces, easy to develop. The model specification describes the physical characteristics, technical specifications, communication protocol, product functions, performance, and other technical standards of the module

1.2 Product Feature Summary
  • MCU Frequency 240MHz
  • True Random number generator
  • RAM maps directly to the data
  • Peripherals: UART 0/1/2, SPIO(80MHz max), I2C Controller, I2S Controller, SDI02.0(50MHz max), PWMx5, ADC*3
  • Working voltage: 3.0 V to 3.6 V
  • Wi-Fi Performance
    Support Full MAC (LMAC+UMAC)
    Single Frequency 2.4G IEEE 802.11 b/g/n/ax
    Support Greenfield mode, Mixed-mode, and Legacy mode
    Soft-AP, STA
    Support RX, STBC
    Built-in PA, LNA, TRX Switch
    All GI, TWT
    Dynamic bandwidth management
  • BLE Performance
    BLE 5.1
    Support BLE and BT multi-device connection
    iShare PA&LNA with Wi-Fi
    GAP
    Supporting Adaptive Frequency Hopping(AFH)
  • Certification CE, FCC, SRRC
  • Supporting Firmware OTA
  • Supporting connection parameter update
1.3 Scenario
  • Intelligent Building
  • IOT and Big data transmission
  • Electrician, Lighting, and Door Lock
  • Wearable Devices
  • Battery IPC
  • POS
  • Home Appliances/ Home Entertainment/ Wi-Fi Toys

2. Mechanical Requirement

2.1 Dimensions

Dimensions: 18±0.35 mm (W) x33 ±0.35 mm (L) x 3.0±0.15 mm (H).

DSM 036 7
2.3 PCB Layout
DSM 036 1
2.4 Pin Definition
DSM 036 2
Pin Number Pin Name IO Type Main Function
(After Reset)
Alternate Function
1,3 GPIO14 I GPIO14 BOOTMODE0/AUX_0/VOUT_QP/PWM_CTRL4/I2S_TXD
2,4 GPIO15 I GPIO15 BOOTMODE1/AUX_1/VOUT_QN/PWM_CTRL5/I2S_TXWS
5 GPIO20 I GPIO20 PWM_CTRL3/AUX_2/VOUT_IP/I2S_MCLK
6 GPIO16 I/O GPIO16 UART1_CTS/ IR_OUT/PWM_CTRL2
7 GPIO17 I/O GPIO17 UART2_RXD/PWM_CTRL5/SPI1_WP/I2S_TXWS
8 GPIO13 I/O GPIO13 UART2_TXD/I2C_SCL/I2S_RXD/dpll_80M_o
9 GPIO22 I/O GPIO22 UART0_TXD/PWM_CTRL0/I2S_TXWS
10 GPIO21 I/O GPIO21 UART0_RXD/I2C_SDA/I2S_TXD
11 Chip_EN P Chip_EN 0=DEF mode;1=test mode
12 GPIO23 I/O GPIO23 UART1_RTS/PWM_CTRL1/I2S_TXSCK
13 GPIO25 I/O GPIO25 phy_entrx/PWM_CTRL3/!phy_entrx/I2C_SDA
14 GPIO24 IO GPIO24 UART1_CTS/ PWM_CTRL2/ I2S_MCLK
15 GPIO6 I/O GPIO6 UART0_TXD/32K_CLK_OUT/XTAL_O_32k/I2S_RXSCK/COLD_RESET
16 VDD P VDD
17 GND P GND
18 GPIO5 I/O GPIO5 UART0_RXD/40M_CLK_OUT/XTAL_I_32k/I2S_RXWS/IR_OUT
19 GPIO4 I/O GPIO4 UART0_RTS/PWM_CTRL4/SPI1_CS1/MSPI_CS1
20 GPIO3 I/O GPIO3 UART0_CTS/PWM_CTRL3/SPI1_MISO/I2C_SDA
21,24 GPIO2 I/O GPIO2 UART1_TXD/PWM_CTRL2/SPI1_MOSI/I2C_SCL
22,25 GPIO1 I/O GPIO1 UART1_RXD/PWM_CTRL1/SPI1_CS0/I2S_RXD
23 GPIO0 I/O GPIO0 UART2_TXD/PWM_CTRL0/SPI1_CLK/I2S_TXSCK

•P indicates power supply pins, I/O indicates input/output pins

3. Electrical parameters

3.1 Absolute electrical parameters
Parameter Description Typical
value
Minimum value Maximum value Unit
Ts Storage temperature -40 125
VCC Power supply voltage 2.2 3.8 V
Static electricity voltage (human body model) TAMB-25 - 2 KV
Static electricity voltage (machine model) TAMB-25 - 0.5 KV
3.2 Working conditions
Parameter Description Minimum value Maximum value Typical
Value
Unit
Ta Working temperature -40 105 -
VCC Power supply voltage 2.0 3.6 3.3 V
VIL I/O low-level input - I0VDD*0.3 V
VIH I/O high-level input I0VDD*0.7 - - V
VOL I/O low-level output - I0VDD*0.2 - V
VOH I/O high-level output I0VDD*0.8 - - V
Isl Sleeping Current - 6.5 - uA

4. Wi-Fi Performance

4.1 Operation Current for Wi-Fi

Test conditions: 3.3V power supply, launch test at 50% duty cycle.

Parameters Typ. Unit
11b 1Mbps POUT = +20dBm (Transmit) 343 mA
11b 11Mbps POUT = +20dBm(Transmit) 335 mA
11g 6Mbps POUT = +19dBm (Transmit) 255 mA
11g 54Mbps POUT = +17dBm (Transmit) 205 mA
11n HT20 MCS0 POUT = +19dBm (Transmit) 246 mA
11n HT20 MCS7 POUT = +16dBm (Transmit) 206 mA
11ax HT20 MCS0 POUT = +19dBm (Transmit) 250 mA
11ax HT20 MCS7 POUT = +16dBm (Transmit) 205 mA
11n HT40 MCS0 POUT = +18dBm (Transmit) 230 mA
11n HT40 MCS7 POUT = +15dBm (Transmit) 188 mA
Wi-Fi Receive 34.8 mA
4.2 TX performance for Wi-Fi
Parameters Rate Standard (dBm) CH1 CH7 CH13 Unit
Output power











11b, 1Mbps 20±1dBm,EVM<-20dB 20.63 20.18 20.49 dBm
11b,11Mbps 20±1dBm, EVM<-20dB 20.63 20.2 20.5 dBm
11g , 6Mbp 19±1dBm,EVM<-28dB 19.18 19.22 19.29 dBm
11g , 54Mbps 17±1dBm,EVM<-28dB 17.23 17.21 17.14 dBm
11n, HT20 MCS0 19±1dBm,EVM<-29dB 18.64 18.69 18.67 dBm
11n, HT20 MCS7 16±1dBm,EVM<-29dB 16.3 16.13 16.24 dBm
11ax ,HT20 MSC0 19±1dBm,EVM<-32dB 18.91 18.81 18.88 dBm
11ax ,HT20 MSC7 16±1dBm,EVM<-32dB 16.22 16.02 16.15 dBm
Rate Standard (dBm) CH3 CH7 CH11 Unit
11n, HT40 MCS7 17±1dB,EVM<-29dB 17.21 17.22 17.34 dBm
11n, HT40 MCS7 15±1dB,EVM<-29dB 15.05 14.74 14.72 dBm
4.3 RX Performance for Wi-Fi
Parameters Test item CH1 CH7 CH13 Unit





Receive sensitivity
11b, 1M , <[email protected]%PER -94 -94 -94 dBm
11b, 11M ,<[email protected]%PER -86 -86 -86 dBm
11g, 6M , <[email protected]%PER -90 -90 -88 dBm
11g, 54M , <[email protected]%PER -74 -74 -73 dBm
11n, HT20 MCS0, <[email protected]%PER -90 -90 -89 dBm
11n, HT20 MCS7, <[email protected]%PER -71 -71 -70 dBm
11ax, HT20 MCS0, <[email protected]%PER -89 -89 -88 dBm
11ax, HT20 MCS7, <[email protected]%PER -71 -71 -70 dBm
Test item CH1 CH7 CH13 Unit
11n, HT40 MCS0,<[email protected]%PER -87 -87 -87 dBm
11n, HT40 MCS7,<[email protected]%PER -68 -68 -68 dBm

5. BT/BLE Performance

5.1 TX performance (BLE)
Parameters Test Item Standard(dBm) Channel(dBm) Unit
CH0 CH19 CH39
Output power 1Mbps 12±1 11.68 12.41 12.07 dBm
2Mbps 12±1 11.83 12.46 12.11 dBm
5.2 RX performance (BLE)
Parameters Test Item Standard(dBm) Channel(dBm) Unit
CH0 CH19 CH39
Sensitivity>30% packet 1Mbps -70 -92 -92 -92 dBm
2Mbps -70 -90 -90 -90 dBm

6 Antenna

6.1 Antenna type

 This product uses an onboard PCB antenna.

6.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.  If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.

DSM 036 4

7. Production instructions

1.Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
    Reflow soldering machine
    Automated optical inspection (AOI) equipment
    Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
    Cabinet oven
    Anti-static heat-resistant trays
    Anti-static heat-resistant gloves

2.Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
DSM 036 3

3.Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4.Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5.Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.

6.Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

DSM 036 5
7.2 Storage conditions
DSM 036 6

8. MOQ and packing

Product model MOQ(pcs) Packing method Number of Modules in each reel pack Number of reel packs in each box
DSM-036 4000 Carrier tape and reel packing 1000 4

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