DSOM-070N NXP i.MX 8M Mini SoM System on Module

DSOM-070N i.MX 8M Mini SoM is developed based on a quad-core Arm® Cortex®-A53 applications processor, featuring higher operation speed up to 1.8 GHz and lower consumption. With excellent high-performance computing capability, embedded security, and advanced audio, video and graphics function, it is a good choice for general purpose industrial and IoT applications.Support RAM up to 4GB, and 64GB eMMC Flash; Operating Temperature: -40 °C ~85 °C; backed by NXP’s product longevity program.
Table of Contents

1. Overview of DSOM-070N NXP I.MX 8M Mini SoM

1.1. Product Description

The DSOM-070N I.MX 8M Mini System on Module is developed based on NXP’s multicore embedded applications processor, featuring  a quad-core ARM Cortex-A53 that operates at up to 1.8GHz and a 400MHz Cortex-M4 processor. It employs sophisticated 14LPC FinFET process technology to deliver superior speed and improved power efficiency.

The standard memory and storage configuration consists of 2GB DDR4, 8GB eMMC, and 32MB QSPI flash.  Optional configuration for RAM and eMMC avaliable.

DSOM-070N I.MX 8M Mini SoM incorporates GigE PHY and PMIC. Various peripherals and I/O signals can be accessed via two 0.8mm pitch 100-pin board-to-board expansion connectors.

DSOM-070N I.MX 8M Mini system on module is compatible with Linux and Android OS. It is designed to provide an accessible and efficient development experience for developers by offering a wide array of free and open-source resources, aiming to make product development more convenient, efficient, and less risky.

DSOM-070N NXP I.MX 8M Mini System on Module (SOM) is compact in size, measuring only 60mm * 49mm.  It is a cost-effective NXP SoM used for developing IoT edge computing, industrial real-time control, industrial data acquisition and control, and IoT predictive maintenance.

1.2. Features

  • Featuring a compact form factor and sufficient GPIO interfaces
  • Size 60mm*49mm,board to board connector
  • With VPU and GPU
  • Rich extension interfaces, supporting PCIE2.0, Gigabit Ethernet, SAI, I2C, UART, SDIO3.0, MIPI￾CSI, MIPI-DSI, SPDIF, USB2.0, SPI, etc.
  • eMMC up to 16GB
  • RAM up to 2GB
  • 8-layer board to board connector, produced by sinking gold technology, independent
    grounding signal layer, lead-free
  • Leads out 200 PIN pins, including almost all CPU pins.
  • RoHS certified

1.3. Application

  • Camera video monitoring
  •  Two-way video conference
  • Visual doorbell
  • Image analysis
  • Home display
  • Wireless or networked speakers
  • Home appliance system control
  • Sound amplification device system

2. System Block Diagram of DSOM-070N NXP I.MX 8M Mini SoM

2.1. Main Chip Block Diagram

dsom 070n main chip block diagram

2.2. System on Module Block Diagram

dsom 070n core board block diagram

3. Basic Parameters and Interfaces of DSOM-070N NXP I.MX 8M Mini SoM

Item Parameter
CPU Quad Cortex®-A53 processors operation up to 1.6 GHz
Cortex®-M4 CPU operating up to 400 MHz
GPU • GCNanoUltra for 3D acceleration
• GC320 for 2D acceleration
VPU Video Decode
• 1080p60 VP9 Profile 0, 2 (10-bit)
• 1080p60 HEVC/H.265 Decoder
• 1080p60 AVC/H.264 Baseline, Main, High decoder
• 1080p60 VP8
• 1080p60 AVC/H.264 Encoder
• TrustZone support
RAM 2GB (1GB/4GB optional)
Storage eMMC 16 GB (8GB / 16GB / 32GB eMMC optional)
Operating Voltage Typical voltage 5V/2.1A
Temperature Operating Temperature: -40 °C ~75 °C (industrial grade)
Storage Temperature: -40 °C ~ 85 °C
Humidity 10~95%(Non-condensing)
Barometric Pressure 76Kpa ~106Kpa
Size 60mm × 49mm × 1.2mm
Peripheral Description
USB 2.0 2 X USB2.0 OTG
PCIE 1 X PCIE, Supports 1-way PCI Express Gen2.0
MIPI CSI 1 X MIPI CSI,Provide a four-lane MIPI camera serial interfaces, capable of operating up to 1.5 Gbps
MIPI DSI 1 X MIPI DSI,Provide a four-lane MIPI display serial interface, capable of operating up to 1.5 Gbps
• 1080 p60
Ethernet 1 X 10/100/1000Mbps PHY
SDIO 2 X SDIO
UART 4 X UART , The maximum supported baud rate is 4Mbp
SPI 3 X SPI , the master-slave mode can be configured
I2C 3 X I2C, The maximum speed supported in standard mode is 100Kbit/s; The maximum supported speed in fast mode is 320Kbit/s
SAI 5 X SAI, supporting I2S, AC97, TDM, codec/DSP, and DSD interfaces, including one SAI with 8 Tx and 8 Rx lanes, one SAI with 4 Tx and 4 Rx lanes, two SAI with 2 Tx and 2 Rx lanes, and one SAI with 1 Tx and 1Rx lane. Support over 20 channels of audio subject to I/O limitations
SPDIF 1 X SPDIF,A standard audio file transfer format, developed jointly by the Sony and Phillips corporations. It supports Transmitter and Receiver functionality.
PWM 4 X PWM,The pulse-width modulator (PWM) has a 16-bit counter and is optimized to generate sound from stored sample audio images. It can also generate tones. It uses 16-bit resolution and a 4x16 data FIFO to generate sound.
QSPI 1 X QSPI,Already occupied by the core board, connected to 32MB of Nor Flash
Upgrade Supports local firmware upgrades via USB interface

4. Pin Definition of DSOM-070N NXP I.MX 8M Mini SoM

dsom 070n nxp imx8m mini front
Top
dsom 070n nxp imx8m mini bottom
Buttom
dsom 070n pins 1
dsom 070n pins 2
dsom 070 pins table

5. Electrical Parameters of DSOM-070N NXP I.MX 8M Mini SoM

5.1. Absolute Electrical Parameters

Parameter Description Min Typ Max Unit
VCC_SYS Input Voltage -0.3 6.0 V
Ta Operating temperature range -40 25 75
Ts Store temperature range -40 25 125

Note: Exposure to conditions beyond the absolute maximum ratings may cause permanent damage and affect the reliability and safety of the device and its systems. The functional operations cannot be guaranteed beyond specified values in the recommended conditions.

5.2. Normal working parameters

Parameter Description Min Typ Max Unit
VCC_5V Input Voltage 4.5 5 5.5 V
Temperature Operating temperature range -40 25 75
Store temperature range -40 25 85
Humidity Operating humidity range 10 80 %RH
Store humidity range 10 90 %RH

5.3. Power Consumption parameters

Working conditions Supply voltage(unit: V) Average current(unit: mA) Peak current(unit: mA) Total power consumption(unit: mW)
During boot 5 110 130 550
Full-load stage 5 420 - 2100
Mem low power mode 5 10 - 50
Freeze low power mode 5 90 - 450

6. Dimensions of DSOM-070N NXP I.MX 8M Mini SoM

dsom 070n dimension
Item Parameter
Exterior Board To Board Connectors
Core Board Size 60mm X 49mm X 2.4mm
Pin Spacing 0.8
Number of Pins 200 Pins
Number of Layers 8 layers, produced by gold sinking process, lead-free
Warpage less than 0.5 %

7. Production Guide of DSOM-070N NXP I.MX 8M Mini SoM

7.1. SMT process

Select modules that can be SMT or in-line packaged according to the customer’s PCB design scheme. If the board is designed for SMT packaging, use SMT-packaged modules. If the board is designed for in-line assembly, use in-line assembly. Modules must be soldered within 24 hours of unpacking. If not, place them in a dry cabinet with a relative humidity of no more than 10% or repack them in a vacuum and record the exposure time (total exposure time must not exceed 168 hours).

Instruments or equipment required for SMT assembly:

  • SMT Mounter
  • SPI
  • Reflow soldering
  • Oven temperature tester
  • AOI

Instruments or equipment required for baking:

  • Cabinet ovens
  • Antistatic high-temperature trays
  • Antistatic and high-temperature gloves

7.2. Module storage conditions:

Moisture-proof bags must be stored at a temperature <40°C and humidity <90% RH. Dry-packed products have a shelf life of 12 months from the date of sealing of the package. Sealed packaging with humidity indicator card.

dsom 070n storage condition

7.3. Baking is required when:

The vacuum bag is found to be broken before unpacking.
After unpacking, the bag is found to be without a humidity indicator card.

The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink. Total exposure time after unpacking exceeds 168 hours.
More than 12 months from the date of the first sealed packaging.

Baking parameters are as follows:
Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).
Baking time: 48 hours for reel packaging; 12 hours for pallet packaging.
Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.
After cooling to below 36°C under natural conditions, production can be carried out.
If the exposure time after baking is greater than 168 hours and not used up, bake again.
If the exposure time is more than 168 hours without baking, it is not recommended to use the reflow soldering process to solder this batch of modules. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time is exceeded. This may lead to device failure or poor soldering when high-temperature soldering is carried out.

7.4. ESD

Please protect the module from electrostatic discharge (ESD) during the entire production process.

7.5. Conformity

To ensure product qualification rates, it is recommended to use SPI and AOI test equipment to monitor solder paste printing and placement quality

7.6. Recommended Furnace Temperature Profile

Please follow the reflow profile for SMT placement with a peak temperature of 245°C. The reflow temperature profile is shown below using the SAC305 alloy solder paste as an example.

dsom 070n temperature profile

Description for graphs of curves.
A: Temperature axis
B: Time axis
C: Alloy liquid phase line temperature: 217-220°C
D: Slope of temperature rise: 1-3°C/s
E: Constant temperature time: 60-120s, constant temperature: 150-200°C
F: Time above liquid phase line: 50-70s
G: Peak temperature: 235-245°C
H: slope of temperature reduction: 1-4°C/s
Note: The above recommended curves are based on SAC305 alloy solder paste as an example. Please set the recommended oven temperature curve for other alloy solder pastes according to the solder paste specification.

7.7. Storage

dsom 070n storage

7.8. Order Information

Model RAM eMMC
DSOM-070N-2 2GB 16GB
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