DSM-103 EFR32ZG23 Z-Wave Module

Table of Contents

1. Introduction

1.1. Purpose& Description

DSM-103 is a low-power embedded Z-WAVE module. It is composed of a highly integrated wireless chip EFR32ZG23A020F512GM40-C and some peripheral devices, and supports Z-WAVE and Z-WAVE long range protocols.

The product has two antenna connection methods. The default is IPEX socket connection method, and it can also be extended to the motherboard through the port. There are also two ways to connect to the motherboard. One is directly attached to the motherboard, and the other uses standard 1.27-pitch connectors and Motherboard connection supports global frequency bands.

1.2. Key Features
  • Low Power Z-Wave Wireless SoC
  • 32-bit ARM® Cortex®-M33 core with 78 MHz maximum operating frequency
  • Up to 512 kB of flash and 64 kB of RAM
  • Integrated sub-GHz PA with up to 20 dBm TX power
  • Integrated LNA with RX Sensitivity as low as -109.8 dBm.
  • Secure Element with Secure Vault
  • 4.0 mA RX current at 868 MHz (9.6 kbps FSK)
  • 4.0 mA RX current at 868 MHz (100 kbps GFSK)
  • 4.0 mA RX current at 908.42 MHz (9.6 kbps FSK)
  • 4.0 mA RX current at 916 MHz (100 kbps GFSK)
  • 9.8 mA TX current @ 0 dBm output power at 916 MHz
  • 25.0 mA TX current @ 14 dBm output power at 916 MHz
  • 85.5 mA TX current @ 20 dBm output power at 916 MHz
  • 26 μA/MHz in Active Mode (EM0) at 39.0 MHz
  • 1.5 μA EM2 DeepSleep current (64 kB RAM retention and RTC running from LFXO)
  • 1.2 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO)
1.3. Appearance
dsm 103 appearance
1.4. Dimensions

DSM-103 has 2 columns of Pins (2* 14).The distance between each Pin is 1.27±0.1mm.
Size: 17±0.35 mm (W) x 22±0.35 mm (L) x 2.8±0.15 mm (H).

dsm 103 dimension
1.5. Interface Pin definition
Pin Number Symbol IO Type Function
1 GND P Power supply reference ground pin
2 ANT RF RF signal input/output port, which corresponds to ANT of IC
3 GND P Power supply reference ground pin
4 NC Not connect
5 NC Not connect
6 PD13 I/O Corresponding to PD13 of IC
7 PD14 I/O Corresponding to PD14 of IC
8 PD15 I/O Corresponding to PD15 of IC
9 PB11 I/O Corresponding to PB11 of IC
10 PB12 I/O Corresponding to PB12 of IC
11 PB13 I/O Corresponding to PB13 of IC
12 PB14 I/O Corresponding to PB14 of IC
13 PB15 I/O Corresponding to P15 of IC
14 NC Not connect
15 NC Not connect
16 NC Not connect
17 PF3 I/O Corresponding to PF3 of IC
18 PF2 I/O Corresponding to PF2 of IC
19 NC Not connect
20 GND P Power supply reference ground pin
21 VCC P Power supply pin (3.3V)
22 RX0 I Corresponding to internal RXD0 of IC
23 TX0 O Corresponding to internal TXD0 of IC
24 SWDIO I/O Corresponding to internal SWDIO of IC
25 SWCLK I/O Corresponding to internal SWCLK of IC
26 PC11 I/O Corresponding to PC11 of IC
27 PC10 I/O Corresponding to PC10 of IC
28 nRESET I Hardware reset pin, which is at a high level by default and is active at a low level

2. Electrical Characteristics

2.1 Absolute Maximum Ratings
Parameter Symbol Test Condition Min Typ Max Unit
Storage temperature range TSTG -50 +150 °C
Voltage on any supply pin VDDMAX -0.3 3.8 V
Junction temperature TJMAX -G grade +105 °C
-I grade +125 °C
Voltage ramp rate on any supply pin VDDRAMPMAX 1.0 V / µs
Voltage on HFXO pins VHFXOPIN -0.3 1.2 V
DC voltage on any GPIO pin1
DC voltage on RESETn pin2
Absolute voltage on Sub-GHz RF pins
VDIGPIN -0.3 VIOVDD + 0.3 V
VRESETn -0.3 3.8 V
VMAXSUBG SUBG_O
pins
-0.3 1.2 V
SUBG_I
pins
-0.3 3.8 V
Total current into VDD power lines IVDDMAX Source 200 mA
Total current into VSS ground lines IVSSMAX Sink 200 mA
Current per I/O pin IIOMAX Sink 50 mA
Source 50 mA
Current for all I/O pins IIOALLMAX Sink 200 mA
Source 200 mA

3. RF Features

This table is for devices with a output power rating of +20 dBm using the 868/915/920 MHz +20 dBm matching network as shown in the typical connections section. Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.3 V, AVDD = DVDD = IOVDD = RFVDD = 1.8 V powered from DCDC. PAVDD = 3.3V. Crystal frequency= 39.0 MHz. RFVDD and external PA supply paths filtered using ferrites. RF center frequency 916 MHz.

Sub-GHz RF Transmitter characteristics for 916 MHz Band
sub g rf transmitter
3.1. Sub-GHz RF Transmitter characteristics for 916 MHz Band, +14 dBm
This table is for devices with a output power rating of +14 dBm using the 868/915/920 MHz 14 dBm matching network as shown in the typical connections section. Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.3 V, AVDD = DVDD = IOVDD = RFVDD = PAVDD = 1.8 V powered from DCDC. Crystal frequency= 39.0 MHz. RFVDD and external PA supply paths filtered using ferrites. RF center frequency 916 MHz.
sub ghz rf
3.2. Sub-GHz RF Receiver Characteristics for 916 MHz Band
916 mhz band

868 MHz Band +20 dBm RF
Table 4.16. 868 MHz Band +20 dBm RF Transmitter Characteristics

4. Antenna

4.1. Antenna type

uses an onboard PCB antenna or Ipex antenna.

4.2. Antenna interference reduction

To ensure optimal Z-WAVE performance when the module uses an onboard PCB antenna, it is recommended that the antenna be at least 5 mm away from other metal parts.
To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antennaarea on the PCB.

dsm 103 antenna
dsm 103 antenna area

5. Firmware

5.1. Docking support
A. API

Support customized various product solutions. and provide related API documents and support. Customers can pair the device to the gateway (Dusun gateway or Private gateway )according to the API description and standard protocol.
API content includes reading sensor data, controlling device switches, changing device configuration, OTA, etc.

B. MQTT

It can provide the erminal device customization + Dusun gateway overall solution, and can provide the MQTT protocol for the gateway to connect to the customer platform. Customers can easily deploy the entire system and view the status and data of the terminal equipment at any time.

dsm 103 mqtt
5.2. Product list

6. Production instruction

Use an SMT placement machine to mount components to the stamp hole module that Dusun produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.

Product Name Wireless Devices Firmware version
DSM-103-1 Temperature &humidity sensor DSM-103_T&H sensor.bin
DSM-103-2 Door/window sensor DSM-103_Beacon.bin
DSM-103-3 PIR DSM-103_ PIR.bin
DSM-103-4 Leakage DSM-103_Leakage.bin
DSM-103-5 Plug DSM-103-Plug.bin
DSM-103-6 Switch(3 gang) DSM-103-Switch.bin
DSM-103-7 Smoke DSM-103-Smoke.bin
DSM-103-8 Emergency button DSM-103-SOS button.bin
DSM-103-9 RGB lighting DSM-103-lighting.bin
DSM-103-10 Strip(4 gang) DSM-103-Strip.bin
  • SMT placement equipment: Reflow soldering machine Automated optical inspection (AOI) equipment Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment: Cabinet oven Anti-static heat-resistant trays Anti-static heat￾resistant gloves
  • Storage conditions for a delivered module are as follows: The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

The package contains a humidity indicator card (HIC).

dsm 103 antenna
  • Bake a module based on HIC status as follows when you unpack the module package: If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. If the 30% circle is pink, bake the module for 4 consecutive hours.
    If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  • Baking settings:
    Baking temperature: 125±5℃
    Alarm temperature: 130℃
    SMT placement ready temperature after natural cooling: < 36℃
    Number of drying times: 1
    Rebaking condition: The module is not soldered within 12 hours after baking.
  • Do not use SMT to process modules that have unpacked for over three months.
    Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Dusun is not liable for such problems and consequences.
  • Before SMT placement, take electrostatic discharge (ESD) protective measures.
    To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection andAOI.

7. Recommended oven temperature curve

7.1. Reflow soldering temperature profile

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

dsm 103 temperature
7.2. Wave soldering temperature curve

Please refer to the recommended furnace temperature setting for wave soldering, the peak temperature is 260℃±5℃, and the wave soldering temperature curve is shown in the figure below:

dsm 103 dip

8. Storage conditions

dsm 103 storage

9. packing

Product type MOQ Packing method Number of Modules in Each Reel Pack Number of Reel Packs in Each Box
DSM-103 4000 Carrier tape and reel packing 1000 4
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