DSOM-040R Rockchip RK3588 System on Module

Table of Contents

1. Product Description

1.1. Product Overview and Scope

The DSOM-040R System on Module adopts RK3588 8-core 64 bit (4 * Cortex-A76+4 * Cortex-A55), advanced 8nm technology, and a low-power processor with a main frequency of up to 2.2GHz. Supports multiple operating systems, with powerful hardware decoding capabilities and rich interfaces. Interfaces such as PCIE3.0, SATA3.0, I2S, I2C, CAN, UART, SDIO3.0, MIPI-CSI, MIPI-DSI, SPDIF, USB3.1, USB2.0, SPI, etc..

The DSOM-040R System on Module offers a wide range of development documents and software resources that are both free and open-source. This convenience enables developers to enhance their development efficiency and shorten the development cycle.

1.2. Product Features
  • Size 45mm*45mm.
  • RAM up to 8GB.
  • eMMC up to 64GB.
  • 8K video co encoding and decoding, supporting multiple decoders, 6TOPS computing power NPU.
  • 48 million pixel ISP3.0, meeting image post-processing needs.
  • Supports multiple multi-channel video outputs with resolutions up to 8K@60Hz
  • Powerful network communication function, integrated with PCIe 3.0/ GMAC/ SDIO3.0/ USB3.0.
  • Rich extension interfaces, supporting PCIE3.0, SATA3.0, I2S, I2C, CAN, UART, SDIO3.0, MIPI-CSI, MIPI￾DSI, SPDIF, USB3.1, USB2.0, SPI, etc.
  • 340pin ultra-thin connector, which can lead out all the leadable functions of the processor

2. System Block Diagram

2.1. Main Chip Block Diagram
rk3588 main chip block

3. Basic Parameters and Interfaces Item Param

Item Parameter
Soc RockChip RK3588
CPU Eight core 64 bit (4 * Cortex-A76 + 4 * Cortex-A55), advanced 8nm technology, with a main frequency of up to 2.2GHz
GPU ARM Mali-G610 MP4 quad core GPU, supports OpenGL ES3.2/ OpenCL 2.2/ Vulkan1.1, 450 GFLOPS
NPU NPU has a computing power of up to 6 TOPS, supports INT4/ INT8/ INT16 mixed operations, and can achieve network model conversion based on TensorFlow/ MXNet/ PyTorch/ Caffe and other frameworks
ISP Integrated 48MP ISP with HDR&3DNR
Encoding and decoding Video decoding: 8K@60fps H.265/ VP9/ AVS2 8K@30fps H.264 AVC/ MVC 4K@60fps AV1 1080P@60fps MPEG-2/-1/ VC-1/VP8
Video encoding: 8K@30fps Encoding, supports H.265/H.264
RAM 4GB/ 8GB/ 16GB 64bit LPDDR4/ LPDDR4x
FLASH 16GB/ 32GB/ 64GB/ 128GB eMMC
Ethernet Integrated PCIe3.0/ 2 * GMAC/ SDIO3.0/ USB3.0, expandable multi-gigabit Ethernet, WiFi6, Bluetooth, 5G/4G LTE
Video output 2 * HDMI2.1( 8K@60fps or 4K@120fps Reused with eDP,
2 * MIPI-DSI( 4K@60fps )
2 * DP1.4( 8K@30fps Reusable with USB 3.0),
1 * BT.1120( 1080P@60fps )
Video input 1 * HDMI-IN( 4K@60fps ), supports HDCP 2.3,
2 * MIPI CSI (4 Lane), 4 * MIPI CSI (2 Lane), or 1 * MIPI CSI (4 Lane) + 2 * MIPI CSI (2 Lane)
2 * MIPI DC (4-channel DPHY v2.0 or 3-channel CPHY V1.1),
1 * DVP camera interface (up to 150MHz input data)
Supports multi-channel 8K video output and 4K video input, with up to seven different displays
Audio 2 * 8-channel I2S,
2 * 2-channel I2S,
2 * SPDIF,
2 * 8-channel PDM (supporting multiple MIC arrays),
1 * dual channel digital audio codec (16 bit DAC),
1 * VAD
PCIe PCIe3.0 ( 2 * 2lanes,1 * 4lanes,4 * 1lanes), 3 * PCIE2.0 ( 1lanes )
SATA 3 * SATA3.0
Watchdog 1 * Independent watchdog
USB2.0 2 * USB2.0 Host, 2 * USB2.0 OTG
USB3.0 3 * USB3.1(Gen1)
UART 10 * UART
I2C 9 * I2C
SPI 5 * SPI
ADC 5 * ADC
PWM 16 * PWM
SDIO 1 * SDIO
OS Supports Android 12.0, Ubuntu desktop and server versions, Debian11, and Buildroot; Supports RTLinux kernel

4. Pin Definition

rk3588 dsom 040r top
Top Side Coreboard
rk3588 dsom 040r button
Bottom Side Coreboard

Pad types:
I = input, O = output, I/O = input/output (bidirectional) , G= Ground ,P = power supply , DOWN = Internal pull down , UP = Internal pull UP L = Lowe Level H = High level

PIN J1 Pin Definition Pad type IO Pull Function for Mainboard (MB-Q-RK3588) Default Function Description IO Power domain RK3588 Pin Number
1 GND G GND GND
GND
3 GND G GND
5 GND G GND
7 GND G GND
9 VCC4V0_SYS P VCC4V0_SYS Core board Power Input:
4.0V+/-5%
4.0V
11 VCC4V0_SYS P 4.0V
13 VCC4V0_SYS P 4.0V
15 VCC4V0_SYS P 4.0V
17 VCC4V0_SYS P 4.0V
19 VCC4V0_SYS P 4.0V
21 VCCA_3V3_S0 P VCCA_3V3_S0 3.3V Output ( Max:300mA ) 3.3V
23 MIPI_CAMERA0_CLK_M0/
SPDIF1_TX_M1/
I2S1_SDO0_M0/
PCIE30X1_0_BUTTON_RSTN/
SATA2_ACT_LED_M0/
I2C6_SCL_M3/
UART8_RX_M0/
SPI0_CS1_M1/
GPIO4_B1_u
I/O UP I2S1_SDO_M0_BT I2S1_SDO_M0_BT 3.3V AL24
25 BT1120_D15/
SPDIF1_TX_M2/
PCIE20X1_2_PERSTN_M1/
HDMI_TX0_CEC_M0/
I2C8_SDA_M3/
PWM6_M1/
SPI3_CS1_M1/
GPIO4_C1_d
I/O DOWN HDMITX0_CEC_M0 HDMITX0_CEC_M0 3.3V AK24
27 BT1120_D14/
PCIE20X1_2_WAKEN_M1/
HDMI_TX0_SDA_M0/
I2C8_SCL_M3/
SPI3_CS0_M1/
GPIO4_C0_u

I/O UP HDMITX0_SDA_M0 HDMITX0_SDA_M0 3.3V AJ25
29 BT1120_D13/
PCIE20X1_2_CLKREQN_M1/
HDMI_TX0_SCL_M0/
I2C5_SDA_M1/
SPI3_CLK_M1/
GPIO4_B7_u
I/O UP HDMITX0_SCL_M0 HDMITX0_SCL_M0 3.3V AJ28
31 TYPEC1_USB20_OTG_ID I NC NC 1.8V AK8
33 TYPEC1_USB20_VBUSDET I NC NC 3.3V AL8
35 TYPEC0_USB20_OTG_ID I NC NC 1.8V AL14
37 TYPEC0_USB20_VBUSDET I TYPEC0_ USB20_ VBUSDET TYPEC0_ USB20_ VBUSDET,
ActiveH
3.3V AM14
39 CIF_D14/
PCIE30X2_CLKREQN_M2/
HDMI_RX_SCL_M1/
I2C7_SCL_M2/
UART9_RTSN_M2/
SPI0_MOSI_M3/
GPIO3_D2_d
I/O DOWN HDMI_ RX_ SCL_ M1 HDMI_ RX_ SCL_ M1 VCCIO5 AG25
41 CIF_D15/
PCIE30X2_WAKEN_M2/
HDMI_RX_SDA_M1/
I2C7_SDA_M2/
UART9_CTSN_M2/
PWM10_M2/
SPI0_CLK_M
I/O DOWN HDMI_ RX_ SDA_ M1 HDMI_ RX_ SDA_ M1 VCCIO5 AG24
MORE

*Notes: VCCIO5_CTL is Hight:VCCIO5=3.3V

5. Electrical Parameters

5.1. Absolute Electrical Parameters
Parameter Description Min Typ Max Unit
VCC4V0_SYS Input Voltage -0.5 5 V
Ta Operating temperature range 0 25 80
Ts Store temperature range -20 25 80

Note: Exposure to conditions beyond the absolute maximum ratings may cause permanent damage and affect the reliability and safety of the device and its systems. The functional operations cannot be guaranteed beyond specified values in the recommended conditions.

5.2. Normal working parameters
Parameter Description Min Typ Max Unit
VSYS_5V Input Voltage 3.8 4 4.2 V
Temperature Operating temperature range 0 25 60
Store temperature range 0 25 70
Humidity Operating humidity range 10 80 %RH
Store temperature range 10 80 %RH

6. Hardware Design Guidelines

6.1. SDMMC/SDIO

RK3588 integrates 1 SDMMC controller and 1 SDIO controller, and they all support SDIO3.0 protocol and MMC V4.51 protocol. 4-wire data bus width; supports SDR104 mode with a rate of 150MHz. 4-wire data bus width; supports SDR104 mode with a rate of 150MHz.

6.1.1. SDMMC Interface
  • The SDMMC interface is multiplexed in the VCCIO2 power domain
  • Support System Boot, default allocation of SD card function
  • SDMMC is multiplexed with JTAG and other functions. The function selection is performed through the SDMMC_DET state by default. For details, please refer to the description in section 2.1.5
  • VCCIO2 power supply, need to provide external 3.3V or 1.8V power supply
  • When connecting to an SD card: If you only need to support SD2.0 mode, you can directly supply 3.3V power; if you want to support SD3.0 mode and be compatible with SD2.0 mode, 3.3V power is supplied by default. After negotiating with the SD card to run the SD3.0 mode, the power supply voltage needs to be switched to 1.8V. PLDO5 of RK806-2 or RK806-1 can power VCCIO2 alone to realize this process
  • When connected to SDIO device: 1.8V or 3.3V according to the peripherals and the actual operating mode
rk3588 sdmmc interface pin
RK3588 SDMMC Interface Pin
  • When realizing the board-to-board connection through the connector, it is recommended to connect a certain resistance resistor in series (between 22ohm-100ohm, specific to meet the SI test) and reserve TVS devices;
  • When using an SD card, pay attention to the following items:
    • 1) The supply voltage of the VDD pin of the SD card is 3.3V, and the decoupling capacitors are not allowed to be deleted. Place them close to the connector when layout.
    • 2) SDMMC0_D [3:0], SDMMC0_CMD, SDMMC0_CLK need to be connected to a 22ohm resistor in series, and SDMMC0_DET to be connected to a 100ohm resistor in series;
    • 3) SDMMC_D[3:0], SDMMC_CMD, SDMMC_CLK, and SDMMC_DET signals need to place ESD devices in the SD card position. To support the SD3.0 mode, the junction capacitance of the ESD device must be less than 1pF. If only the SD2.0 mode is required, the junction capacitance of the ESD device can be relaxed to 9pF.
sd card interface circuit
SD Card Interface Circuit
    • 4) SDMMC0 interface pull-up/down and matching design recommendations are shown in the table
Signal Internal pull up/down Connection method Description
SDMMC0_D[3:0] Pull-up Series with 22ohm resistor
Use corresponding IO internal pull-up resistor
SD data transmission/reception
SDMMC0_CLK Pull-down Series with 22ohm resistor
Use corresponding IO internal pull-up resistor
SD clock transmission
SDMMC0_CMD Pull-up Series with 22ohm resistor
Use corresponding IO internal pull-up resistor
SD command transmission/reception
SDMMC0_DET Pull-up Series with 100ohm resistor
Use the corresponding IO internal pull-up resistor
SD card insertion detection
SDMMC0 Interface Design
6.1.2. SDIO Interface
  • The SDIO interface is multiplexed in two locations: one in the VCCIO3 power domain and one in the VCCIO5 power domain. Only one of them can be used. Either all use the VCCIO3 power domain, or all use the VCCIO5 power domain, it does not support part of the VCCIO3 power domain, and some of the VCCIO5 power domain
  • Does not support System Boot
  • The power supply of VCCIO3 is 1.8V only; the power supply of VCCIO5 is 1.8V or 3.3V, and the corresponding voltage should be selected according to the needs of the peripheral. It should be kept consistent with the IO of the peripheral. 
rk3588sdio interface m0 function pin
RK3588 SDIO Interface M0 Function Pin
rk3588 sdio interface m1 function pin
RK3588 SDIO Interface M1 Function Pin
  • SDIO interface pull-up and pull-down and matching design recommendations are shown in the Table
Signal Internal pull up/down Connection method Description
SDMMC2_D[3:0] Pull-up When the wiring is short, a 22ohm
resistor in series can be removed,
and the corresponding IO internal
pull-up resistor can be used instead
SD data transmission/ reception
SDMMC2_CLK Pull-down Series with 22ohm resistor SD clock transmission
SDMMC2_CMD Pull-up When the wiring is short, a 22ohm resistor in series can be removed, and the corresponding IO internal pull-up resistor can be used instead SD command transmission/reception

When implementing board-to-board connections via connectors, it is recommended to add a certain value of the resistor in series (between 22 Ohm and 100 Ohm, depending on the fulfillment of the SI test requirements) and to reserve TVS devices.

6.1.3. Notes of When SDIO Connects to Wi-Fi

Please ensure that the IO level of the module is consistent with the IO level of the CPU otherwise, level￾matching processing is required

  • The crystal load capacitance should be selected according to the CL capacitance value of the crystal used, and the frequency tolerance at room temperature should be controlled within 10ppm
  • The antenna reserves a π-type circuit for antenna matching adjustment
  • Confirm the connection direction of PCM and UART interface, such as IN and OUT, TXD and RXD
  • If you need to use a 32.768k clock input module, a 32.768kohm pull-up resistor is required, and you need to pay attention to the clock amplitude to meet the parameters of the Wi-Fi module.

7. Product Dimensions

rk3588 dsom 040r dimensions
dsom 040r dimensions
dsom 040r dimensions rk3588
Item Parameter
Exterior board to board connectors
Core Board Size 66mm X 50mm X 5.8mm
Pin Spacing 0.4mm/0.5 mm
Number of Pins 340 Pins
PCB board thickness 1.6mm
PCB process Produced by gold sinking process, lead-free
Warpage less than 0.5 %

Connector: Four 0.5mm spacing, 80pin board to board connectors. The core board connector model is AXK6F80337YG, and the corresponding bottom board connector model is AXK5F80537YG. The bconnector size diagram is shown in the appendix.

Reserve four installation holes with a diameter of 3.2mm at the four corners of the core board.
Customers who use this product in vibration environments can install fixing screws to improve the reliability of product connections.

Users can refer to the design of the development board and use M2, L=3.0mm patch nuts on the bottom plate. The specifications of the patch nut are shown in the following figure:

rk3588 dsom 040r

8. Production Guide

8.1. SMT Process

Select modules that can be SMT or in-line packaged according to the customer’s PCB design
scheme. If the board is designed for SMT packaging, use SMT-packaged modules. If the board is designed for in-line assembly, use in-line assembly. Modules must be soldered within 24 hours of unpacking. If not, place them in a dry cabinet with a relative humidity of no more than 10% or repack them in a vacuum and record the exposure time (total exposure time must not exceed 168 hours).

Instruments or equipment required for SMT assembly:

  • SMT Mounter
  • SPI
  • Reflow soldering
  • Oven temperature tester
  • AOI

Instruments or equipment required for baking:

  • Cabinet ovens
  • Antistatic high-temperature trays
  • Antistatic and high-temperature gloves
8.2. Storage Conditions

Moisture-proof bags must be stored at a temperature <40°C and humidity <90% RH. Dry-packed products have a shelf life of 12 months from the date of sealing of the package. Sealed packaging with humidity indicator card.

rk3588 storage conditions
8.3. Baking is Required When

The vacuum bag is found to be broken before unpacking.
After unpacking, the bag is found to be without a humidity indicator card.
The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink.
Total exposure time after unpacking exceeds 168 hours.
More than 12 months from the date of the first sealed packaging.

Baking parameters are as follows:
Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).
Baking time: 48 hours for reel packaging 12 hours for pallet packaging.
Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.
Production can be carried out after cooling to below 36°C under natural conditions.
If the exposure time after baking is greater than 168 hours and not used up, bake again.
If the exposure time is more than 168 hours without baking, using the reflow soldering process to solder this batch of modules is not recommended. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time is exceeded. This may lead to device failure or poor soldering during high-temperature soldering.

8.4. ESD

Please protect the module from electrostatic discharge (ESD) during production.

8.5. Conformity

To ensure product qualification rates, it is recommended to use SPI and AOI test equipment to monitor solder paste printing and placement quality.

8.6. Recommended Furnace Temperature Profile

Please follow the reflow profile for SMT placement with a peak temperature of 245°C. The reflow temperature profile is shown below using the SAC305 alloy solder paste as an example.

rk3588 recommended furnace temperature profile

Description for graphs of curves.
A: Temperature axis
B: Time axis
C: Alloy liquid phase line temperature: 217-220°C
D: Slope of temperature rise: 1-3°C/s
E: Constant temperature time: 60-120s, constant temperature: 150-200°C
F: Time above liquid phase line: 50-70s
G: Peak temperature: 235-245°C
H: slope of temperature reduction: 1-4°C/s

Note: The above recommended curves are based on SAC305 alloy solder paste as an example.
Please set the recommended oven temperature curve for other alloy solder pastes according to the solder paste specification.

8.7. Storage
rk3588 storage
8.8. Order Information
Model RAM eMMC
DSOM-040R-U 8GB 64GB
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