1. Product Description
The DSOM-040R System on Module adopts RK3588 8-core 64 bit (4 * Cortex-A76+4 * Cortex-A55), advanced 8nm technology, and a low-power processor with a main frequency of up to 2.2GHz. Supports multiple operating systems, with powerful hardware decoding capabilities and rich interfaces. Interfaces such as PCIE3.0, SATA3.0, I2S, I2C, CAN, UART, SDIO3.0, MIPI-CSI, MIPI-DSI, SPDIF, USB3.1, USB2.0, SPI, etc..
The DSOM-040R System on Module offers a wide range of development documents and software resources that are both free and open-source. This convenience enables developers to enhance their development efficiency and shorten the development cycle.
- Size 45mm*45mm.
- RAM up to 8GB.
- eMMC up to 64GB.
- 8K video co encoding and decoding, supporting multiple decoders, 6TOPS computing power NPU.
- 48 million pixel ISP3.0, meeting image post-processing needs.
- Supports multiple multi-channel video outputs with resolutions up to 8K@60Hz
- Powerful network communication function, integrated with PCIe 3.0/ GMAC/ SDIO3.0/ USB3.0.
- Rich extension interfaces, supporting PCIE3.0, SATA3.0, I2S, I2C, CAN, UART, SDIO3.0, MIPI-CSI, MIPIDSI, SPDIF, USB3.1, USB2.0, SPI, etc.
- 340pin ultra-thin connector, which can lead out all the leadable functions of the processor
2. System Block Diagram
3. Basic Parameters and Interfaces Item Param
| Item | Parameter |
|---|---|
| Soc | RockChip RK3588 |
| CPU | Eight core 64 bit (4 * Cortex-A76 + 4 * Cortex-A55), advanced 8nm technology, with a main frequency of up to 2.2GHz |
| GPU | ARM Mali-G610 MP4 quad core GPU, supports OpenGL ES3.2/ OpenCL 2.2/ Vulkan1.1, 450 GFLOPS |
| NPU | NPU has a computing power of up to 6 TOPS, supports INT4/ INT8/ INT16 mixed operations, and can achieve network model conversion based on TensorFlow/ MXNet/ PyTorch/ Caffe and other frameworks |
| ISP | Integrated 48MP ISP with HDR&3DNR |
| Encoding and decoding | Video decoding: 8K@60fps H.265/ VP9/ AVS2 8K@30fps H.264 AVC/ MVC 4K@60fps AV1 1080P@60fps MPEG-2/-1/ VC-1/VP8 Video encoding: 8K@30fps Encoding, supports H.265/H.264 |
| RAM | 4GB/ 8GB/ 16GB 64bit LPDDR4/ LPDDR4x |
| FLASH | 16GB/ 32GB/ 64GB/ 128GB eMMC |
| Ethernet | Integrated PCIe3.0/ 2 * GMAC/ SDIO3.0/ USB3.0, expandable multi-gigabit Ethernet, WiFi6, Bluetooth, 5G/4G LTE |
| Video output | 2 * HDMI2.1（ 8K@60fps or 4K@120fps Reused with eDP, 2 * MIPI-DSI（ 4K@60fps ） 2 * DP1.4（ 8K@30fps Reusable with USB 3.0), 1 * BT.1120（ 1080P@60fps ） |
| Video input | 1 * HDMI-IN（ 4K@60fps ）, supports HDCP 2.3, 2 * MIPI CSI (4 Lane), 4 * MIPI CSI (2 Lane), or 1 * MIPI CSI (4 Lane) + 2 * MIPI CSI (2 Lane) 2 * MIPI DC (4-channel DPHY v2.0 or 3-channel CPHY V1.1), 1 * DVP camera interface (up to 150MHz input data) Supports multi-channel 8K video output and 4K video input, with up to seven different displays |
| Audio | 2 * 8-channel I2S, 2 * 2-channel I2S, 2 * SPDIF, 2 * 8-channel PDM (supporting multiple MIC arrays), 1 * dual channel digital audio codec (16 bit DAC), 1 * VAD |
| PCIe | PCIe3.0 ( 2 * 2lanes,1 * 4lanes,4 * 1lanes), 3 * PCIE2.0 ( 1lanes ) |
| SATA | 3 * SATA3.0 |
| Watchdog | 1 * Independent watchdog |
| USB2.0 | 2 * USB2.0 Host, 2 * USB2.0 OTG |
| USB3.0 | 3 * USB3.1(Gen1) |
| UART | 10 * UART |
| I2C | 9 * I2C |
| SPI | 5 * SPI |
| ADC | 5 * ADC |
| PWM | 16 * PWM |
| SDIO | 1 * SDIO |
| OS | Supports Android 12.0, Ubuntu desktop and server versions, Debian11, and Buildroot; Supports RTLinux kernel |
4. Pin Definition
Pad types:
I = input, O = output, I/O = input/output (bidirectional) , G= Ground ,P = power supply , DOWN = Internal pull down , UP = Internal pull UP L = Lowe Level H = High level
| PIN | J1 Pin Definition | Pad type | IO Pull | Function for Mainboard (MB-Q-RK3588) | Default Function Description | IO Power domain | RK3588 Pin Number |
|---|---|---|---|---|---|---|---|
| 1 | GND | G | GND | GND |
GND | ||
| 3 | GND | G | GND | ||||
| 5 | GND | G | GND | ||||
| 7 | GND | G | GND | ||||
| 9 | VCC4V0_SYS | P | VCC4V0_SYS | Core board Power Input: 4.0V+/-5% |
4.0V | ||
| 11 | VCC4V0_SYS | P | 4.0V | ||||
| 13 | VCC4V0_SYS | P | 4.0V | ||||
| 15 | VCC4V0_SYS | P | 4.0V | ||||
| 17 | VCC4V0_SYS | P | 4.0V | ||||
| 19 | VCC4V0_SYS | P | 4.0V | ||||
| 21 | VCCA_3V3_S0 | P | VCCA_3V3_S0 | 3.3V Output ( Max:300mA ) | 3.3V | ||
| 23 | MIPI_CAMERA0_CLK_M0/ SPDIF1_TX_M1/ I2S1_SDO0_M0/ PCIE30X1_0_BUTTON_RSTN/ SATA2_ACT_LED_M0/ I2C6_SCL_M3/ UART8_RX_M0/ SPI0_CS1_M1/ GPIO4_B1_u |
I/O | UP | I2S1_SDO_M0_BT | I2S1_SDO_M0_BT | 3.3V | AL24 |
| 25 | BT1120_D15/ SPDIF1_TX_M2/ PCIE20X1_2_PERSTN_M1/ HDMI_TX0_CEC_M0/ I2C8_SDA_M3/ PWM6_M1/ SPI3_CS1_M1/ GPIO4_C1_d |
I/O | DOWN | HDMITX0_CEC_M0 | HDMITX0_CEC_M0 | 3.3V | AK24 |
| 27 | BT1120_D14/ PCIE20X1_2_WAKEN_M1/ HDMI_TX0_SDA_M0/ I2C8_SCL_M3/ SPI3_CS0_M1/ GPIO4_C0_u |
I/O | UP | HDMITX0_SDA_M0 | HDMITX0_SDA_M0 | 3.3V | AJ25 |
| 29 | BT1120_D13/ PCIE20X1_2_CLKREQN_M1/ HDMI_TX0_SCL_M0/ I2C5_SDA_M1/ SPI3_CLK_M1/ GPIO4_B7_u |
I/O | UP | HDMITX0_SCL_M0 | HDMITX0_SCL_M0 | 3.3V | AJ28 |
| 31 | TYPEC1_USB20_OTG_ID | I | NC | NC | 1.8V | AK8 | |
| 33 | TYPEC1_USB20_VBUSDET | I | NC | NC | 3.3V | AL8 | |
| 35 | TYPEC0_USB20_OTG_ID | I | NC | NC | 1.8V | AL14 | |
| 37 | TYPEC0_USB20_VBUSDET | I | TYPEC0_ USB20_ VBUSDET | TYPEC0_ USB20_ VBUSDET, ActiveH |
3.3V | AM14 | |
| 39 | CIF_D14/ PCIE30X2_CLKREQN_M2/ HDMI_RX_SCL_M1/ I2C7_SCL_M2/ UART9_RTSN_M2/ SPI0_MOSI_M3/ GPIO3_D2_d |
I/O | DOWN | HDMI_ RX_ SCL_ M1 | HDMI_ RX_ SCL_ M1 | VCCIO5 | AG25 |
| 41 | CIF_D15/ PCIE30X2_WAKEN_M2/ HDMI_RX_SDA_M1/ I2C7_SDA_M2/ UART9_CTSN_M2/ PWM10_M2/ SPI0_CLK_M |
I/O | DOWN | HDMI_ RX_ SDA_ M1 | HDMI_ RX_ SDA_ M1 | VCCIO5 | AG24 |
| MORE | |||||||
*Notes: VCCIO5_CTL is Hight:VCCIO5=3.3V
5. Electrical Parameters
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| VCC4V0_SYS | Input Voltage | -0.5 | 5 | V | |
| Ta | Operating temperature range | 0 | 25 | 80 | ℃ |
| Ts | Store temperature range | -20 | 25 | 80 | ℃ |
Note: Exposure to conditions beyond the absolute maximum ratings may cause permanent damage and affect the reliability and safety of the device and its systems. The functional operations cannot be guaranteed beyond specified values in the recommended conditions.
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| VSYS_5V | Input Voltage | 3.8 | 4 | 4.2 | V |
| Temperature | Operating temperature range | 0 | 25 | 60 | ℃ |
| Store temperature range | 0 | 25 | 70 | ℃ | |
| Humidity | Operating humidity range | 10 | 80 | %RH | |
| Store temperature range | 10 | 80 | %RH |
6. Hardware Design Guidelines
RK3588 integrates 1 SDMMC controller and 1 SDIO controller, and they all support SDIO3.0 protocol and MMC V4.51 protocol. 4-wire data bus width; supports SDR104 mode with a rate of 150MHz. 4-wire data bus width; supports SDR104 mode with a rate of 150MHz.
- The SDMMC interface is multiplexed in the VCCIO2 power domain
- Support System Boot, default allocation of SD card function
- SDMMC is multiplexed with JTAG and other functions. The function selection is performed through the SDMMC_DET state by default. For details, please refer to the description in section 2.1.5
- VCCIO2 power supply, need to provide external 3.3V or 1.8V power supply
- When connecting to an SD card: If you only need to support SD2.0 mode, you can directly supply 3.3V power; if you want to support SD3.0 mode and be compatible with SD2.0 mode, 3.3V power is supplied by default. After negotiating with the SD card to run the SD3.0 mode, the power supply voltage needs to be switched to 1.8V. PLDO5 of RK806-2 or RK806-1 can power VCCIO2 alone to realize this process
- When connected to SDIO device: 1.8V or 3.3V according to the peripherals and the actual operating mode
- When realizing the board-to-board connection through the connector, it is recommended to connect a certain resistance resistor in series (between 22ohm-100ohm, specific to meet the SI test) and reserve TVS devices;
- When using an SD card, pay attention to the following items:
- 1) The supply voltage of the VDD pin of the SD card is 3.3V, and the decoupling capacitors are not allowed to be deleted. Place them close to the connector when layout.
- 2) SDMMC0_D [3:0], SDMMC0_CMD, SDMMC0_CLK need to be connected to a 22ohm resistor in series, and SDMMC0_DET to be connected to a 100ohm resistor in series;
- 3) SDMMC_D[3:0], SDMMC_CMD, SDMMC_CLK, and SDMMC_DET signals need to place ESD devices in the SD card position. To support the SD3.0 mode, the junction capacitance of the ESD device must be less than 1pF. If only the SD2.0 mode is required, the junction capacitance of the ESD device can be relaxed to 9pF.
-
- 4) SDMMC0 interface pull-up/down and matching design recommendations are shown in the table
| Signal | Internal pull up/down | Connection method | Description |
|---|---|---|---|
| SDMMC0_D[3:0] | Pull-up | Series with 22ohm resistor Use corresponding IO internal pull-up resistor |
SD data transmission/reception |
| SDMMC0_CLK | Pull-down | Series with 22ohm resistor Use corresponding IO internal pull-up resistor |
SD clock transmission |
| SDMMC0_CMD | Pull-up | Series with 22ohm resistor Use corresponding IO internal pull-up resistor |
SD command transmission/reception |
| SDMMC0_DET | Pull-up | Series with 100ohm resistor Use the corresponding IO internal pull-up resistor |
SD card insertion detection |
- The SDIO interface is multiplexed in two locations: one in the VCCIO3 power domain and one in the VCCIO5 power domain. Only one of them can be used. Either all use the VCCIO3 power domain, or all use the VCCIO5 power domain, it does not support part of the VCCIO3 power domain, and some of the VCCIO5 power domain
- Does not support System Boot
- The power supply of VCCIO3 is 1.8V only; the power supply of VCCIO5 is 1.8V or 3.3V, and the corresponding voltage should be selected according to the needs of the peripheral. It should be kept consistent with the IO of the peripheral.
- SDIO interface pull-up and pull-down and matching design recommendations are shown in the Table
| Signal | Internal pull up/down | Connection method | Description |
|---|---|---|---|
| SDMMC2_D[3:0] | Pull-up | When the wiring is short, a 22ohm resistor in series can be removed, and the corresponding IO internal pull-up resistor can be used instead |
SD data transmission/ reception |
| SDMMC2_CLK | Pull-down | Series with 22ohm resistor | SD clock transmission |
| SDMMC2_CMD | Pull-up | When the wiring is short, a 22ohm resistor in series can be removed, and the corresponding IO internal pull-up resistor can be used instead | SD command transmission/reception |
When implementing board-to-board connections via connectors, it is recommended to add a certain value of the resistor in series (between 22 Ohm and 100 Ohm, depending on the fulfillment of the SI test requirements) and to reserve TVS devices.
Please ensure that the IO level of the module is consistent with the IO level of the CPU otherwise, levelmatching processing is required
- The crystal load capacitance should be selected according to the CL capacitance value of the crystal used, and the frequency tolerance at room temperature should be controlled within 10ppm
- The antenna reserves a π-type circuit for antenna matching adjustment
- Confirm the connection direction of PCM and UART interface, such as IN and OUT, TXD and RXD
- If you need to use a 32.768k clock input module, a 32.768kohm pull-up resistor is required, and you need to pay attention to the clock amplitude to meet the parameters of the Wi-Fi module.
7. Product Dimensions
| Item | Parameter |
|---|---|
| Exterior | board to board connectors |
| Core Board Size | 66mm X 50mm X 5.8mm |
| Pin Spacing | 0.4mm/0.5 mm |
| Number of Pins | 340 Pins |
| PCB board thickness | 1.6mm |
| PCB process | Produced by gold sinking process, lead-free |
| Warpage | less than 0.5 % |
Connector: Four 0.5mm spacing, 80pin board to board connectors. The core board connector model is AXK6F80337YG, and the corresponding bottom board connector model is AXK5F80537YG. The bconnector size diagram is shown in the appendix.
Reserve four installation holes with a diameter of 3.2mm at the four corners of the core board.
Customers who use this product in vibration environments can install fixing screws to improve the reliability of product connections.
Users can refer to the design of the development board and use M2, L=3.0mm patch nuts on the bottom plate. The specifications of the patch nut are shown in the following figure:
8. Production Guide
Select modules that can be SMT or in-line packaged according to the customer’s PCB design
scheme. If the board is designed for SMT packaging, use SMT-packaged modules. If the board is designed for in-line assembly, use in-line assembly. Modules must be soldered within 24 hours of unpacking. If not, place them in a dry cabinet with a relative humidity of no more than 10% or repack them in a vacuum and record the exposure time (total exposure time must not exceed 168 hours).
Instruments or equipment required for SMT assembly：
- SMT Mounter
- SPI
- Reflow soldering
- Oven temperature tester
- AOI
Instruments or equipment required for baking:
- Cabinet ovens
- Antistatic high-temperature trays
- Antistatic and high-temperature gloves
Moisture-proof bags must be stored at a temperature <40°C and humidity <90% RH. Dry-packed products have a shelf life of 12 months from the date of sealing of the package. Sealed packaging with humidity indicator card.
The vacuum bag is found to be broken before unpacking.
After unpacking, the bag is found to be without a humidity indicator card.
The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink.
Total exposure time after unpacking exceeds 168 hours.
More than 12 months from the date of the first sealed packaging.
Baking parameters are as follows:
Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).
Baking time: 48 hours for reel packaging 12 hours for pallet packaging.
Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.
Production can be carried out after cooling to below 36°C under natural conditions.
If the exposure time after baking is greater than 168 hours and not used up, bake again.
If the exposure time is more than 168 hours without baking, using the reflow soldering process to solder this batch of modules is not recommended. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time is exceeded. This may lead to device failure or poor soldering during high-temperature soldering.
Please protect the module from electrostatic discharge (ESD) during production.
To ensure product qualification rates, it is recommended to use SPI and AOI test equipment to monitor solder paste printing and placement quality.
Please follow the reflow profile for SMT placement with a peak temperature of 245°C. The reflow temperature profile is shown below using the SAC305 alloy solder paste as an example.
Description for graphs of curves.
A: Temperature axis
B: Time axis
C: Alloy liquid phase line temperature: 217-220°C
D: Slope of temperature rise: 1-3°C/s
E: Constant temperature time: 60-120s, constant temperature: 150-200°C
F: Time above liquid phase line: 50-70s
G: Peak temperature: 235-245°C
H: slope of temperature reduction: 1-4°C/s
Note: The above recommended curves are based on SAC305 alloy solder paste as an example.
Please set the recommended oven temperature curve for other alloy solder pastes according to the solder paste specification.
| Model | RAM | eMMC |
|---|---|---|
| DSOM-040R-U | 8GB | 64GB |
