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DSM-042 Zigbee Cloud Module

Table of Contents

1. Introduction

1.1 Purpose& Description

DSM-042 is a low-power-consuming embedded Zigbee module. It consists of the highly integrated wireless radio processor chip, EFR32MG21A020F768IM32-B, and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions.
DSM-042 is embedded with a low-power-consuming 32-bit ARM Cortex-M33 Core, 768 KB flash memory, 64 KB RAM data memory, and robust peripheral resources.

1.2 Product Feature Summary
  • Built-in low power-consumption 32-bit Cortex-M33 core with DSP instructions and floating-point unit function as an application processor
  • Clock rate: 80MHz
  • Peripherals: 5XPWMs, 1XUART, 1XADC
  • Working voltage: 2.0 V to 3.8 V
  • Zigbee operating feature
    802.15.4 MAC/PHY supported
    Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface, rate of 250 Kbps
    Maximum output power: +19.5 dBm; dynamic difference of output power: > 35 dB
    Power consumption when DSM-042 is working: 60 μA/MHz; current when DSM-042 is in sleep mode: 5.0 μA
    AES 128/256-based hardware encryption
    Built-in onboard PCB antenna, the gain of the antenna is 2.5dBi
  • Dimension: 17 x 22 x 2.8 mm
  • Working temperature: –40°C to +85°C
  • Certification CE, FCC, SRRC
1.3 Scenario
  • Intelligent Building
  • Intelligent Home And Household Applications
  • Industrial Wireless Control
  • Intelligent Public Traffic
  • Intelligent socket and smart lighting
  • Asset tracing

2. Mechanical Requirement

2.1 Drawing
DSM 042 1
2.2 Dimensions

DSM-042 provides two lines of pins with a distance of 2 mm between every two pins.
Dimensions: 14.9±0.35 mm (W) x17.9 ±0.35 mm (L) x 2.8±0.15 mm (H).

DSM 042 2
2.3 Pin Definition
Pin Number Symbol IO Type Function
1 3V3 P Power-supply pin of DSM-042 (typical power-supply voltage: 3.3 V).
2 PA00 I/O Functions as a GPIO can be as PWM outputs, corresponding to the PA00 pin of the IC.
3 GND P Power supply reference ground
4 PA03 I/O Functions as a GPIO can be as PWM outputs, corresponding to the PA03 pin of the IC.
5 RDX I/O UART_RX, corresponding to the PA06 pin of the IC
6 PA04 I/O Functions as a GPIO can be as PWM outputs, corresponding to the PA04 pin of the IC.
7 TXD I/O UART_TX, corresponding to the PA05 pin of the IC
8 ADC AI ADC, corresponding to the PC01 pin of the IC
9 PB00 I/O Functions as a GPIO can be as PWM outputs, corresponding to the PB00 pin of the internal IC.
10 RST I Hardware reset pin, corresponding to the reset pin of the IC
11 PB01 I/O Functions as a GPIO can be as PWM outputs, corresponding to the PB01 pin of the IC.
12 V P Power-supply pin of DSM-042 (typical power-supply voltage: 3.3 V).
13 D I/O JLINK SWDIO programming pin. corresponding to the PA02 pin of the IC.
14 C I/O JLINK SWDIO programming pin. corresponding to the PA01 pin of the IC.
15 G P Power supply reference ground

•P indicates power supply pins, I/O indicates input/output pins

3. Electrical parameters

3.1 Absolute electrical parameters
Parameter Description Typical
Minimum value Maximum value Unit
Ts Storage temperature -50 105
VCC Power supply voltage 2.0 3.8 V
Static electricity voltage (human body model) TAMB-25 - 2 KV
Static electricity voltage (machine model) TAMB-25 - 0.5 KV
3.2 Working conditions
Parameter Description Minimum value Maximum value Typical
Ta Working temperature -40 85 -
VCC Power supply voltage 2.0 3.3 3.6 V
VIL I/O low-level input - I0VDD*0.3 V
VIH I/O high-level input I0VDD*0.7 - - V
VOL I/O low-level output - I0VDD*0.2 - V
VOH I/O high-level output I0VDD*0.8 - - V

NOTE: VCC=3.0V, Tamb=-10~70℃

3.3 Power consumption during constant transmission and receiving
Working status Mode Rate TX Power/ Receiving Typical value Average
TX 250 Kbit/s +20dBm 210 200 mA
TX 250 Kbit/s +10dBm 64 62 mA
TX 250 Kbit/s +0dBm 28 26 mA
RX 250 Kbit/s Constant receiving 12 10 mA
RX 2Mbps Constant receiving 10 mA
RX 250Mbps Constant receiving 11 mA
3.4 Operation Current
Working status Operating condition, Ta=25 Typical value Average
Quick configuration Module in the quick configuration state 40 10 mA
Network connection state Connected to a network 5 4.2 mA
Deep sleep mode Deep-sleep mode and retains 64KB RAM - 5 uA

4. RF features

4.1 Basic RF feature
Parameter Description
Frequency band 2.412~2.484GHz
Wi-Fi standard IEEE 802.15.4
Data transmission rate 250 Kbps
Antenna type PCB antenna
Line-of-sight transmission distance >120m
4.2 Continuous TX performance
Parameter Minimum value Typical value Maximum value Unit
Maximum output power - 20 - dBm
Minimum output power - -30 - dBm
Output power adjustment step - 0.5 1 dBm
Output spectrum adjacent-channel rejection ratio -31 dBc
Frequency error -15 - 15 ppm
4.3 RX performance (RX sensitivity)
Parameter Minimum value Typical value Maximum value Unit
PER<10%, RX sensitivity(Zigbee 250Kbps) - -102 - dBm

5. Antenna

5.1 Antenna type

This product uses an onboard PCB antenna with Antenna gain 2.5dBi.

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.  If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.

DSM 042 3

6. Firmware

6.1 API

We offer customized product solutions, including temperature/door/window/PIR/leakage sensors, smart meter, smart lock, etc., and provide related API documents and support. Customers can pair the device to the gateway (Dusun gateway or Private gateway )according to the API description and standard Zigbee 3.0 protocol.
API document includes reading sensor data, controlling device switches, setting configuration of the device, OTA, etc.

6.2 MQTT

There is currently support for custom Zigbee devices and providing the complete solution based on the Dusun Gateway, which can connect to the customer web platform via MQTT protocol. So Customers can easily deploy the entire system and view status and real-time data from end devices.

DSM 042 4

7. Production instructions

1.Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
    Reflow soldering machine
    Automated optical inspection (AOI) equipment
    Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
    Cabinet oven
    Anti-static heat-resistant trays
    Anti-static heat-resistant gloves

2.Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
DSM 042 5

3.Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4.Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5.Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.

6.Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

DSM 042 6
7.2 Storage conditions
DSM 042 7

8. MOQ and packing

Product model MOQ(pcs) Packing method Number of Modules in each reel pack Number of reel packs in each box
DSM-042 4000 Carrier tape and reel packing 1000 4

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