DSM-042 is a low-power-consuming embedded Zigbee module. It consists of the highly integrated wireless radio processor chip, EFR32MG21A020F768IM32-B, and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions.
DSM-042 is embedded with a low-power-consuming 32-bit ARM Cortex-M33 Core, 768 KB flash memory, 64 KB RAM data memory, and robust peripheral resources.
- Built-in low power-consumption 32-bit Cortex-M33 core with DSP instructions and floating-point unit function as an application processor
- Clock rate: 80MHz
- Peripherals: 5XPWMs, 1XUART, 1XADC
- Working voltage: 2.0 V to 3.8 V
- Zigbee operating feature
802.15.4 MAC/PHY supported
Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface, rate of 250 Kbps
Maximum output power: +19.5 dBm; dynamic difference of output power: > 35 dB
Power consumption when DSM-042 is working: 60 μA/MHz; current when DSM-042 is in sleep mode: 5.0 μA
AES 128/256-based hardware encryption
Built-in onboard PCB antenna, the gain of the antenna is 2.5dBi
- Dimension: 17 x 22 x 2.8 mm
- Working temperature: –40°C to +85°C
- Certification CE, FCC, SRRC
- Intelligent Building
- Intelligent Home And Household Applications
- Industrial Wireless Control
- Intelligent Public Traffic
- Intelligent socket and smart lighting
- Asset tracing
2. Mechanical Requirement
DSM-042 provides two lines of pins with a distance of 2 mm between every two pins.
Dimensions: 14.9±0.35 mm (W) x17.9 ±0.35 mm (L) x 2.8±0.15 mm (H).
|Pin Number||Symbol||IO Type||Function|
|1||3V3||P||Power-supply pin of DSM-042 (typical power-supply voltage: 3.3 V).|
|2||PA00||I/O||Functions as a GPIO can be as PWM outputs, corresponding to the PA00 pin of the IC.|
|3||GND||P||Power supply reference ground|
|4||PA03||I/O||Functions as a GPIO can be as PWM outputs, corresponding to the PA03 pin of the IC.|
|5||RDX||I/O||UART_RX, corresponding to the PA06 pin of the IC|
|6||PA04||I/O||Functions as a GPIO can be as PWM outputs, corresponding to the PA04 pin of the IC.|
|7||TXD||I/O||UART_TX, corresponding to the PA05 pin of the IC|
|8||ADC||AI||ADC, corresponding to the PC01 pin of the IC|
|9||PB00||I/O||Functions as a GPIO can be as PWM outputs, corresponding to the PB00 pin of the internal IC.|
|10||RST||I||Hardware reset pin, corresponding to the reset pin of the IC|
|11||PB01||I/O||Functions as a GPIO can be as PWM outputs, corresponding to the PB01 pin of the IC.|
|12||V||P||Power-supply pin of DSM-042 (typical power-supply voltage: 3.3 V).|
|13||D||I/O||JLINK SWDIO programming pin. corresponding to the PA02 pin of the IC.|
|14||C||I/O||JLINK SWDIO programming pin. corresponding to the PA01 pin of the IC.|
|15||G||P||Power supply reference ground|
•P indicates power supply pins, I/O indicates input/output pins
3. Electrical parameters
|Minimum value||Maximum value||Unit|
|VCC||Power supply voltage||2.0||3.8||V|
|Static electricity voltage (human body model)||TAMB-25℃||-||2||KV|
|Static electricity voltage (machine model)||TAMB-25℃||-||0.5||KV|
|Parameter||Description||Minimum value||Maximum value||Typical
|VCC||Power supply voltage||2.0||3.3||3.6||V|
|VIL||I/O low-level input||-||I0VDD*0.3||V|
|VIH||I/O high-level input||I0VDD*0.7||-||-||V|
|VOL||I/O low-level output||-||I0VDD*0.2||-||V|
|VOH||I/O high-level output||I0VDD*0.8||-||-||V|
NOTE: VCC=3.0V, Tamb=-10~70℃
|Working status||Mode||Rate||TX Power/ Receiving||Typical value||Average
|RX||250 Kbit/s||Constant receiving||12||10||mA|
|Working status||Operating condition, Ta=25℃||Typical value||Average
|Quick configuration||Module in the quick configuration state||40||10||mA|
|Network connection state||Connected to a network||5||4.2||mA|
|Deep sleep mode||Deep-sleep mode and retains 64KB RAM||-||5||uA|
4. RF features
|Wi-Fi standard||IEEE 802.15.4|
|Data transmission rate||250 Kbps|
|Antenna type||PCB antenna|
|Line-of-sight transmission distance||>120m|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Maximum output power||-||20||-||dBm|
|Minimum output power||-||-30||-||dBm|
|Output power adjustment step||-||0.5||1||dBm|
|Output spectrum adjacent-channel rejection ratio||-31||dBc|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER<10%, RX sensitivity(Zigbee 250Kbps)||-||-102||-||dBm|
This product uses an onboard PCB antenna with Antenna gain 2.5dBi.
To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.
We offer customized product solutions, including temperature/door/window/PIR/leakage sensors, smart meter, smart lock, etc., and provide related API documents and support. Customers can pair the device to the gateway (Dusun gateway or Private gateway )according to the API description and standard Zigbee 3.0 protocol.
API document includes reading sensor data, controlling device switches, setting configuration of the device, OTA, etc.
There is currently support for custom Zigbee devices and providing the complete solution based on the Dusun Gateway, which can connect to the customer web platform via MQTT protocol. So Customers can easily deploy the entire system and view status and real-time data from end devices.
7. Production instructions
1.Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.
- SMT placement equipment:
Reflow soldering machine
Automated optical inspection (AOI) equipment
Nozzle with a 6 mm to 8 mm diameter
- Baking equipment:
Anti-static heat-resistant trays
Anti-static heat-resistant gloves
2.Storage conditions for a delivered module are as follows:
- The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
- The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
- The package contains a humidity indicator card (HIC).
3.Bake a module based on HIC status as follows when you unpack the module package:
- If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
- If the 30% circle is pink, bake the module for 4 consecutive hours.
- If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
- If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
- Baking temperature: 125±5℃
- Alarm temperature: 130℃
- SMT placement ready temperature after natural cooling: < 36℃
- Number of drying times: 1
- Rebaking condition: The module is not soldered within 12 hours after baking.
5.Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.
6.Before SMT placement, take electrostatic discharge (ESD) protective measures.
7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
8. MOQ and packing
|Product model||MOQ（pcs）||Packing method||Number of Modules in each reel pack||Number of reel packs in each box|
|DSM-042||4000||Carrier tape and reel packing||1000||4|