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DSM-048 2.4GHz Spread-Spectrum Module

Table of Contents

1. Introduction

1.1 Purpose& Description

DSM-048 is a low-power-consuming embedded 2.4GHz Spread-Spectrum module. It consists of the highly integrated wireless radio processor chip, EFR32MG21A020F768IM32-B, and several peripherals, with a wireless protocol stack and robust library functions.
DSM-048 is a FreeRTOS platform integrating the function library of all the related protocols. The User can develop embedded wireless products that meet their needs based on these function libraries.

1.2 Product Feature Summary
  • Built-in low power-consumption 32-bit Cortex-M33 core with DSP instructions and floating-point unit function as an application processor
  • Clock rate: 80MHz
  • Peripherals: 9XGPIOs, 1XUART, 1XADC
  • Working voltage: 2.0 V to 3.8 V
  • Wireless RF Connectivity
    802.15.4 MAC/PHY supported
    Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface, rate of 250 Kbps
    Maximum output power: +10 dBm; dynamic difference of output power: > 35 dB
    Power consumption when DSM-048 is working: 60 μA/MHz; current when DSM-048 is in sleep mode: 5.0 μA
    AES 128/256-based hardware encryption
    The terminal device actively enters into the pairing mode
  • Dimension: 17 x 22 x 2.8 mm
  • Working temperature: –40°C to +85°C
  • Certification CE, FCC, SRRC
1.3 Scenario
  • Intelligent Building
  • Intelligent Home And Household Applications
  • Industrial Wireless Control
  • Intelligent Public Traffic
  • Intelligent socket and smart lighting
  • Web Camera
  • Baby Monitor

2. Mechanical Requirement

2.1 Drawing
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2.2 Dimensions

DSM-048 provides thress lines of pins with a distance of 1.27±0.1mm between every two pins.
Dimensions: 14.9±0.35 mm (W) x20 ±0.35 mm (L) x 2.8±0.15 mm (H).

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2.3 Pin Definition
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Pin NumberSymbolIO TypeFunction
1GND PPower supply reference ground pin
2UART_TX PA05MP test points need to be reserved for calibration
3UART_RX PA06MP test points need to be reserved for calibration
4SWDIO PA02GPIO interface; 8mA drive capability. Wake-up function. Internal strong/weak pull-up and pull-down. SWDIO (default)
6ADC2 PB02GPIO interface, which can be configured as an ADC
7LOG PB01Power-on mode: normal operation pull-down, bypassing the program code executed in the flash (the PAD internal pull-down by default).
8LED1 PB00Common GPIO interface
9SPI_CLKPC02Common GPIO interface
10SPI_MISOPC01Common GPIO interface
11SPI_MOSIPC00Common GPIO interface
12SPI_CSNPC03Common GPIO interface
13GNDGNDPower supply reference ground pin
14RESETRESETMP test points need to be reserved for calibration
15VCCVCC1. Power:2V ~ 3.6V
2. MP test points need to be reserved for calibration
16GNDPPower supply reference ground pin
17PWM1PD04Support PWM function LED (fixed timer), default connection cold LED
18PWM2PD03Support PWM function LED (fixed timer), default connection warm LED
19PWM3PD021. The I2C SDA
2. LED support PWM such as breathing light (adjustable timer)
3. Red LED by default
20PWM4PC041. The I2C SCL
2. LED support PWM such as breathing light (adjustable timer)
3. Green LED by default
21PWM5PC051. LED support PWM such as breathing light (adjustable timer)
2. Blue LED by default
22ADC1PD00Common GPIO interface
23GPIO1PA03Common GPIO interface
24GPIO2PA04Common GPIO interface

•P indicates power supply pins, I/O indicates input/output pins

3. Electrical parameters

3.1 Absolute electrical parameters
Minimum valueMaximum valueUnit
Ts Storage temperature-50150
VCCPower supply voltage2.03.8V
Static electricity voltage (human body model)TAMB-25-2KV
Static electricity voltage (machine model)TAMB-25-0.5 KV
3.2 Working conditions
ParameterDescriptionMinimum valueMaximum valueTypical
TaWorking temperature-40105-
VCCPower supply voltage2.03.83.0V
VILI/O low-level input-I0VDD*0.3V
VIHI/O high-level inputI0VDD*0.7--V
VOLI/O low-level output-I0VDD*0.2-V
VOHI/O high-level outputI0VDD*0.8--V

NOTE: VCC=3.0V, Tamb=-10~70℃

3.3 Power consumption during constant transmission and receiving
Working statusRateTX Power/ ReceivingTypical valueAverage
TX250 Kbps+10dBm6462mA
TX250 Kbps0dBm2520mA
RX125 KbpsConstant receiving1210mA
RX500 KbpsConstant receiving1210.5mA
RX1MbpsConstant receiving119mA
RX2MbpsConstant receiving1210mA
RX250 KbpsConstant receiving12.511mA
3.4 Operation Current
Working statusOperating condition, Ta=25Typical valueAverage
Quick configurationModule in the quick configuration state4010mA
Network connection stateConnected to a network54.2mA
Deep sleep modeDeep-sleep mode and retains 64KB RAM-5uA

4. RF features

4.1 Basic RF feature
Frequency band2.412~2.483.5GHz
Data transmission rate250 Kbps
Antenna typePCB antenna with gain 1dBi, ipex (optional)
4.2 Continuous TX performance
ParameterMinimum valueTypical valueMaximum valueUnit
Maximum output power-10-dBm
Minimum output power--30-dBm
Output power adjustment step-0.51dBm
Output spectrum adjacent-channel rejection ratio-31dBc
Frequency error-15-15ppm
4.3 RX performance (RX sensitivity)
ParameterMinimum valueTypical valueMaximum valueUnit
PER<1%, RX sensitivity(250Kbps)-103-102-100dBm

5. Antenna

5.1 Antenna type

This product uses an onboard PCB antenna.

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.  If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.

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6. Firmware

6.1 API

We offer customized product solutions, including temperature/door/window/PIR/leakage sensors, smart meter, smart lock, etc., and provide related API documents and support. Customers can pair the device to the gateway (Dusun gateway or Private gateway )according to the API description and standard Zigbee 3.0 protocol.
API document includes reading sensor data, controlling device switches, setting configuration of the device, OTA, etc.

6.2 MQTT

There is currently support for custom Zigbee devices and providing the complete solution based on the Dusun Gateway, which can connect to the customer web platform via MQTT protocol. So Customers can easily deploy the entire system and view status and real-time data from end devices.

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6.3 Supporting Product List
Product NameWireless DeviceFirmware Name
DSM-048-1Temperature &humidity sensorDSM-048_T&H sensor.bin
DSM-048-2Door/window sensorDSM-048_Door.bin
DSM-048-6Light Switch/Dimmer SwitchDSM-048-Switch.bin
DSM-048-8Emergency buttonDSM-048-SOS button.bin
DSM-048-9RGB lightingDSM-048-RGB.bin

7. Production instructions

1.Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
    Reflow soldering machine
    Automated optical inspection (AOI) equipment
    Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
    Cabinet oven
    Anti-static heat-resistant trays
    Anti-static heat-resistant gloves

2.Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
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3.Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4.Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5.Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.

6.Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

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7.2 Storage conditions
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8. MOQ and packing

Product modelMOQ(pcs)Packing methodNumber of Modules in each reel packNumber of reel packs in each box
DSM-0484000Carrier tape and reel packing10004

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