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DSM-048 2.4GHz Spread-Spectrum Module

Table of Contents

1. Introduction

1.1 Purpose& Description

DSM-048 is a low-power-consuming embedded 2.4GHz Spread-Spectrum module. It consists of the highly integrated wireless radio processor chip, EFR32MG21A020F768IM32-B, and several peripherals, with a wireless protocol stack and robust library functions.
DSM-048 is a FreeRTOS platform integrating the function library of all the related protocols. The User can develop embedded wireless products that meet their needs based on these function libraries.

1.2 Product Feature Summary
  • Built-in low power-consumption 32-bit Cortex-M33 core with DSP instructions and floating-point unit function as an application processor
  • Clock rate: 80MHz
  • Peripherals: 9XGPIOs, 1XUART, 1XADC
  • Working voltage: 2.0 V to 3.8 V
  • Wireless RF Connectivity
    802.15.4 MAC/PHY supported
    Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface, rate of 250 Kbps
    Maximum output power: +10 dBm; dynamic difference of output power: > 35 dB
    Power consumption when DSM-048 is working: 60 μA/MHz; current when DSM-048 is in sleep mode: 5.0 μA
    AES 128/256-based hardware encryption
    The terminal device actively enters into the pairing mode
  • Dimension: 17 x 22 x 2.8 mm
  • Working temperature: –40°C to +85°C
  • Certification CE, FCC, SRRC
1.3 Scenario
  • Intelligent Building
  • Intelligent Home And Household Applications
  • Industrial Wireless Control
  • Intelligent Public Traffic
  • Intelligent socket and smart lighting
  • Web Camera
  • Baby Monitor

2. Mechanical Requirement

2.1 Drawing
DSM 048 1
2.2 Dimensions

DSM-048 provides thress lines of pins with a distance of 1.27±0.1mm between every two pins.
Dimensions: 14.9±0.35 mm (W) x20 ±0.35 mm (L) x 2.8±0.15 mm (H).

DSM 048 2
2.3 Pin Definition
DSM 048 3
Pin Number Symbol IO Type Function
1 GND P Power supply reference ground pin
2 UART_TX PA05 MP test points need to be reserved for calibration
3 UART_RX PA06 MP test points need to be reserved for calibration
4 SWDIO PA02 GPIO interface; 8mA drive capability. Wake-up function. Internal strong/weak pull-up and pull-down. SWDIO (default)
5 SWDCLK PA01
6 ADC2 PB02 GPIO interface, which can be configured as an ADC
7 LOG PB01 Power-on mode: normal operation pull-down, bypassing the program code executed in the flash (the PAD internal pull-down by default).
8 LED1 PB00 Common GPIO interface
9 SPI_CLK PC02 Common GPIO interface
10 SPI_MISO PC01 Common GPIO interface
11 SPI_MOSI PC00 Common GPIO interface
12 SPI_CSN PC03 Common GPIO interface
13 GND GND Power supply reference ground pin
14 RESET RESET MP test points need to be reserved for calibration
15 VCC VCC 1. Power:2V ~ 3.6V
2. MP test points need to be reserved for calibration
16 GND P Power supply reference ground pin
17 PWM1 PD04 Support PWM function LED (fixed timer), default connection cold LED
18 PWM2 PD03 Support PWM function LED (fixed timer), default connection warm LED
19 PWM3 PD02 1. The I2C SDA
2. LED support PWM such as breathing light (adjustable timer)
3. Red LED by default
20 PWM4 PC04 1. The I2C SCL
2. LED support PWM such as breathing light (adjustable timer)
3. Green LED by default
21 PWM5 PC05 1. LED support PWM such as breathing light (adjustable timer)
2. Blue LED by default
22 ADC1 PD00 Common GPIO interface
23 GPIO1 PA03 Common GPIO interface
24 GPIO2 PA04 Common GPIO interface

•P indicates power supply pins, I/O indicates input/output pins

3. Electrical parameters

3.1 Absolute electrical parameters
Parameter Description Typical
value
Minimum value Maximum value Unit
Ts Storage temperature -50 150
VCC Power supply voltage 2.0 3.8 V
Static electricity voltage (human body model) TAMB-25 - 2 KV
Static electricity voltage (machine model) TAMB-25 - 0.5 KV
3.2 Working conditions
Parameter Description Minimum value Maximum value Typical
Value
Unit
Ta Working temperature -40 105 -
VCC Power supply voltage 2.0 3.8 3.0 V
VIL I/O low-level input - I0VDD*0.3 V
VIH I/O high-level input I0VDD*0.7 - - V
VOL I/O low-level output - I0VDD*0.2 - V
VOH I/O high-level output I0VDD*0.8 - - V

NOTE: VCC=3.0V, Tamb=-10~70℃

3.3 Power consumption during constant transmission and receiving
Working status Rate TX Power/ Receiving Typical value Average
value
Unit
TX 250 Kbps +10dBm 64 62 mA
TX 250 Kbps 0dBm 25 20 mA
RX 125 Kbps Constant receiving 12 10 mA
RX 500 Kbps Constant receiving 12 10.5 mA
RX 1Mbps Constant receiving 11 9 mA
RX 2Mbps Constant receiving 12 10 mA
RX 250 Kbps Constant receiving 12.5 11 mA
3.4 Operation Current
Working status Operating condition, Ta=25 Typical value Average
value
Unit
Quick configuration Module in the quick configuration state 40 10 mA
Network connection state Connected to a network 5 4.2 mA
Deep sleep mode Deep-sleep mode and retains 64KB RAM - 5 uA

4. RF features

4.1 Basic RF feature
Parameter Description
Frequency band 2.412~2.483.5GHz
Data transmission rate 250 Kbps
Antenna type PCB antenna with gain 1dBi, ipex (optional)
4.2 Continuous TX performance
Parameter Minimum value Typical value Maximum value Unit
Maximum output power - 10 - dBm
Minimum output power - -30 - dBm
Output power adjustment step - 0.5 1 dBm
Output spectrum adjacent-channel rejection ratio -31 dBc
Frequency error -15 - 15 ppm
4.3 RX performance (RX sensitivity)
Parameter Minimum value Typical value Maximum value Unit
PER<1%, RX sensitivity(250Kbps) -103 -102 -100 dBm

5. Antenna

5.1 Antenna type

This product uses an onboard PCB antenna.

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.  If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.

DSM 048 4

6. Firmware

6.1 API

We offer customized product solutions, including temperature/door/window/PIR/leakage sensors, smart meter, smart lock, etc., and provide related API documents and support. Customers can pair the device to the gateway (Dusun gateway or Private gateway )according to the API description and standard Zigbee 3.0 protocol.
API document includes reading sensor data, controlling device switches, setting configuration of the device, OTA, etc.

6.2 MQTT

There is currently support for custom Zigbee devices and providing the complete solution based on the Dusun Gateway, which can connect to the customer web platform via MQTT protocol. So Customers can easily deploy the entire system and view status and real-time data from end devices.

DSM 048 5
6.3 Supporting Product List
Product Name Wireless Device Firmware Name
DSM-048-1 Temperature &humidity sensor DSM-048_T&H sensor.bin
DSM-048-2 Door/window sensor DSM-048_Door.bin
DSM-048-3 PIR DSM-048_PIR.bin
DSM-048-4 Leakage DSM-048_Leakage.bin
DSM-048-5 Plug DSM-048-Plug.bin
DSM-048-6 Light Switch/Dimmer Switch DSM-048-Switch.bin
DSM-048-7 Smoke DSM-048-Smoke.bin
DSM-048-8 Emergency button DSM-048-SOS button.bin
DSM-048-9 RGB lighting DSM-048-RGB.bin
DSM-048-10 Thermostat DSM-048-thermostat.bin

7. Production instructions

1.Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
    Reflow soldering machine
    Automated optical inspection (AOI) equipment
    Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
    Cabinet oven
    Anti-static heat-resistant trays
    Anti-static heat-resistant gloves

2.Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
DSM 048 6

3.Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4.Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5.Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.

6.Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

DSM 048 7
7.2 Storage conditions
DSM 048 8

8. MOQ and packing

Product model MOQ(pcs) Packing method Number of Modules in each reel pack Number of reel packs in each box
DSM-048 4000 Carrier tape and reel packing 1000 4

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