DSM-04B Zigbee/Matter/BLE Cloud Module

DSM-04B is a low power-consuming embedded Zigbee/Matter/BLE module developed By Dusun with highly integrated wireless radio processor chip, EFR32MG21 series.
Table of Contents

1 Introduction of DSM-04B Zigbee/Matter/BLE Module

1.1 Purpose& Description

DSM-04B is a low power-consuming embedded Zigbee/matter/BLE module developed By Dusun. It consists of the highly integrated wireless radio processor chip, EFR32MG21 series, and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee/matter/BLE network protocol stack and robust library functions.

This data terminal device is embedded with a low power-consuming 32-bit ARM Cortex-M33 core, 1024/768 KB flash memory, 64 KB RAM data memory, and robust peripheral resources. Besides, it runs on the FreeRTOS platform that integrates all Zigbee/matter/BLE MAC library functions. You can develop built-in Zigbee/matter products as required.

1.2 Product Feature Summary

• Embedded low-power 32-bit MCU, which can also function as an application processor
   Dominant frequency: 80 MHz

• Working voltage: 2.0 V to 3.8 V

• Support Zigbee、matter and BLE protocol (When using the MATTER protocol, the mod can only be used on the host side)

• Peripherals: 1ADC, 9xGPIOs, and 1 universal asynchronous receiver/transmitter (UART) • Zigbee operating feature

   802.15.4 MAC/PHY supported
   Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface, rate of 250 Kbit/s
   Maximum output power: +20 dBm; dynamic difference of output power: > 35 dB
   Power consumption when it is working: 60 μA/MHz; current when it is in sleep mode: 5 μA
   Proactive network configuration for terminals

• BLE operating feature
   BLE 5.1
   Working channel: 0-39@2400~2483MHz

• Matter(only for gateway)

• Dimension: 17 x 22 x 2.8 mm

• Working temperature: –40°C to +105°C

• Certification CE, FCC, SRRC

1.3 Scenario

  • Intelligent Building
  • Intelligent Home And Household Applications
  • Intelligent Socket And Smart Lighting
  • Industrial Wireless Control
  • Baby Monitor
  • IP Camera
  • Intelligent Public Traffic

2 Mechanical Requirement of DSM-04B Zigbee/Matter/BLE Module

2.1 Dimensions

DSM-04B provides two rows of pins(2 *14) with the pin pitch of 1.27±0.1mm

Dimensions: 17±0.35 mm (W) x 22±0.35 mm (L) x 2.8±0.15 mm (H).


2.2 Pin Definition

Symbol IO Type Function
1 GND P Power supply reference ground pin
2 ANT RF RF signal input/output port, which corresponds to ANT of IC
3 GND P Power supply reference ground pin
4 NC Not connect
5 PA0 I/O Corresponding to PA0 of IC
6 PC5 I/O Corresponding to PC5 of IC
7 PC4 I/O Corresponding to PC4 of IC
8 PA3 I/O Corresponding to PA3 of IC
9 PA4 I/O Corresponding to PA4 of IC
10 PC1 I/O Corresponding to PC1 of IC
11 PC0 I/O Corresponding to PC0 of IC
12 PD4 I/O Corresponding to PD4 of IC
13 PD3 I/O Corresponding to PD3 of IC
14 PD2 I/O Corresponding to PD2 of IC
15 NC Not connect
16 NC Not connect
17 PB0 I/O Corresponding to PB0 of IC
18 PB1 I/O Corresponding to PB1 of IC
19 NC Not connect
20 GND P Power supply reference ground pin
21 VCC P Power supply pin (3.3V)
22 RX0 I Corresponding to internal RXD0 of IC
23 TX0 O Corresponding to internal TXD0 of IC
24 SWDIO I/O Corresponding to internal SWDIO of IC
25 SWCLK I/O Corresponding to PF2 of IC
26 PC3 I/O Corresponding to PF3 of IC
27 PC2 I/O Not connect
28 nRESET I Hardware reset pin, which is at a high level by default and is active at a low level
  • P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.

3 Electrical parameters of DSM-04B Zigbee/Matter/BLE Module

3.1 Absolute electrical parameters

Parameter Description Minimum Maximum Unit
Ts Storage temperature -50 125
VCC Power supply voltage 2 3.8 V
Static electricity voltage (human body model) TAMB-25℃ - 2 KV
Static electricity voltage (machine model) TAMB-25℃ - 0.5 KV

3.2 Working conditions

Parameter Description Description Minimum Typical Maximum Unit
Ta Working temperature -40 -105 -
VCC Power supply voltage 2.0 3.0 3.8 V
VIL I/O low-level input - I0VDD*0.3 V
VIH I/O high-level input I0VDD*0.7 - - V
VOL I/O low-level output - I0VDD*0.2 - V
VOH I/O high-level output I0VDD*0.8 - - V

3.3 Current consumption during constant transmission and receiving

Working status Rate TX Power/ Receiving Typical Maximum Unit
TX 250 Kbit/s +20dBm 200 206 mA
TX 250 Kbit/s +10dBm 62 64 mA
TX 250 Kbit/s +0dBm 26 28 mA
RX 250 Kbit/s Constant receiving 10 12 mA
RX 250 Kbit/s Constant receiving 10 12 mA
RX 250 Kbit/s Constant receiving 10 12 mA

3.4 Working current

Working mode Working status (Ta = 25℃) Average Maximum Unit
EZ The module is in EZ mode. 10 40 mA
Connected and idle The module is connected to the network. 4.2 5 mA
Deep sleep mode The module is in deep sleep mode, with 64 KB flash memory. 5 - uA

4 RF features of DSM-04B Zigbee/Matter/BLE Module

4.1 Basic RF feature

Parameter Description
Frequency band 2.412~2.484GHz
Protocol standard Zigbee 3.0/BLE 5.1/Matter
Data transmission rate 250 Kbit/s
Antenna type PCB antenna with a gain of 1dBi. IPEX (optional)

4.2 TX performance (Performance during constant transmission)

Parameter Minimum Typical Maximum Unit
Maximum output power(250Kbps) - 20 - dBm
Minimum output power(250Kbps) - -30 - dBm
Output power adjustment step - 0.5 1 dBm
Output spectrum adjacent-channel rejection ratio - -31 - dBc
Frequency error -15 - 15 ppm

4.3 RX performance (RX sensitivity)

Parameter Minimum Typical Maximum Unit
PER<8%, RX sensitivity(250Kbps) -102 -101 -99 dBm

5 Antenna of DSM-04B Zigbee/Matter/BLE Module

5.1 Antenna type

This product uses an onboard PCB antenna, whose gain is 1dBi

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.


Do not place any metal in the red area above the antenna.

The recommended diameter of the circular arc is greater than 3cm.


6 Production instructions of DSM-04B Zigbee/Matter/BLE Module

1. Use an SMT placement machine to mount components to the stamp hole module that Dusun produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
        Reflow soldering machine
        Automated optical inspection (AOI) equipment
        Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
        Cabinet oven
        Anti-static heat-resistant trays
        Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is
    packaged and sealed.
  • The package contains a humidity indicator card (HIC).

3. Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4. Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Dusun is not liable for such problems and consequences.

6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.


8 Storage conditions


9 Ordering information


10 MOQ and packing

Product model MOQ(pcs) Packing method Number of Modules in each reel pack Number of reel packs in each box
DSM-04B 2800 Carrier tape and reel packing 700 4
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