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Zigbee/matter/BLE Cloud Module

Table of Contents

1 Introduction

1.1 Purpose& Description

DSM-04B is a low power-consuming embedded Zigbee/matter/BLE module developed By Dusun. It consists of the highly integrated wireless radio processor chip, EFR32MG21 series, and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee/matter/BLE network protocol stack and robust library functions.

This data terminal device is embedded with a low power-consuming 32-bit ARM Cortex-M33 core, 1024/768 KB flash memory, 64 KB RAM data memory, and robust peripheral resources. Besides, it runs on the FreeRTOS platform that integrates all Zigbee/matter/BLE MAC library functions. You can develop built-in Zigbee/matter products as required.

1.2 Product Feature Summary

• Embedded low-power 32-bit MCU, which can also function as an application processor
   Dominant frequency: 80 MHz

• Working voltage: 2.0 V to 3.8 V

• Support Zigbee、matter and BLE protocol (When using the MATTER protocol, the mod can only be used on the host side)

• Peripherals: 1ADC, 9xGPIOs, and 1 universal asynchronous receiver/transmitter (UART) • Zigbee operating feature

   802.15.4 MAC/PHY supported
   Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface, rate of 250 Kbit/s
   Maximum output power: +20 dBm; dynamic difference of output power: > 35 dB
   Power consumption when it is working: 60 μA/MHz; current when it is in sleep mode: 5 μA
   Proactive network configuration for terminals

• BLE operating feature
   BLE 5.1
   Working channel: [email protected]~2483MHz

• Matter(only for gateway)

• Dimension: 17 x 22 x 2.8 mm

• Working temperature: –40°C to +105°C

• Certification CE, FCC, SRRC

1.3 Scenario
  • Intelligent Building
  • Intelligent Home And Household Applications
  • Intelligent Socket And Smart Lighting
  • Industrial Wireless Control
  • Baby Monitor
  • IP Camera
  • Intelligent Public Traffic

2 Mechanical Requirement

2.1 Dimensions

DSM-04B provides two rows of pins(2 *14) with the pin pitch of 1.27±0.1mm

Dimensions: 17±0.35 mm (W) x 22±0.35 mm (L) x 2.8±0.15 mm (H).

2.2 Pin Definition
SymbolIO TypeFunction
1GNDPPower supply reference ground pin
2ANTRFRF signal input/output port, which corresponds to ANT of IC
3GNDPPower supply reference ground pin
4NCNot connect
5PA0I/OCorresponding to PA0 of IC
6PC5I/OCorresponding to PC5 of IC
7PC4I/OCorresponding to PC4 of IC
8PA3I/OCorresponding to PA3 of IC
9PA4I/OCorresponding to PA4 of IC
10PC1I/OCorresponding to PC1 of IC
11PC0I/OCorresponding to PC0 of IC
12PD4I/OCorresponding to PD4 of IC
13PD3I/OCorresponding to PD3 of IC
14PD2I/OCorresponding to PD2 of IC
15NCNot connect
16NCNot connect
17PB0I/OCorresponding to PB0 of IC
18PB1I/OCorresponding to PB1 of IC
19NCNot connect
20GNDPPower supply reference ground pin
21VCCPPower supply pin (3.3V)
22RX0ICorresponding to internal RXD0 of IC
23TX0OCorresponding to internal TXD0 of IC
24SWDIOI/OCorresponding to internal SWDIO of IC
25SWCLKI/OCorresponding to PF2 of IC
26PC3I/OCorresponding to PF3 of IC
27PC2I/ONot connect
28nRESETIHardware reset pin, which is at a high level by default and is active at a low level
  • P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.

3 Electrical parameters

3.1 Absolute electrical parameters
TsStorage temperature-50125
VCCPower supply voltage23.8V
Static electricity voltage (human body model)TAMB-25℃-2KV
Static electricity voltage (machine model)TAMB-25℃-0.5KV
3.2 Working conditions
Parameter DescriptionDescriptionMinimumTypicalMaximumUnit
TaWorking temperature-40-105-
VCCPower supply voltage2.03.03.8V
VILI/O low-level input-I0VDD*0.3V
VIHI/O high-level inputI0VDD*0.7--V
VOLI/O low-level output-I0VDD*0.2-V
VOHI/O high-level outputI0VDD*0.8--V
3.3 Current consumption during constant transmission and receiving
Working statusRateTX Power/ ReceivingTypicalMaximumUnit
TX250 Kbit/s+20dBm200206mA
TX250 Kbit/s+10dBm6264mA
TX250 Kbit/s+0dBm2628mA
RX250 Kbit/sConstant receiving1012mA
RX250 Kbit/sConstant receiving1012mA
RX250 Kbit/sConstant receiving1012mA
3.4 Working current
Working modeWorking status (Ta = 25℃)AverageMaximumUnit
EZThe module is in EZ mode.1040mA
Connected and idleThe module is connected to the network.4.25mA
Deep sleep modeThe module is in deep sleep mode, with 64 KB flash memory.5-uA

4 RF features

4.1 Basic RF feature
Frequency band2.412~2.484GHz
Protocol standardZigbee 3.0/BLE 5.1/Matter
Data transmission rate250 Kbit/s
Antenna typePCB antenna with a gain of 1dBi. IPEX (optional)
4.2 TX performance (Performance during constant transmission)
Maximum output power(250Kbps)-20-dBm
Minimum output power(250Kbps)--30-dBm
Output power adjustment step-0.51dBm
Output spectrum adjacent-channel rejection ratio--31-dBc
Frequency error-15-15ppm
4.3 RX performance (RX sensitivity)
PER<8%, RX sensitivity(250Kbps)-102-101-99dBm

5 Antenna

5.1 Antenna type

This product uses an onboard PCB antenna, whose gain is 1dBi

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.


Do not place any metal in the red area above the antenna.

The recommended diameter of the circular arc is greater than 3cm.


6 Production instructions

1. Use an SMT placement machine to mount components to the stamp hole module that Dusun produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.

  • SMT placement equipment:
        Reflow soldering machine
        Automated optical inspection (AOI) equipment
        Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
        Cabinet oven
        Anti-static heat-resistant trays
        Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is
    packaged and sealed.
  • The package contains a humidity indicator card (HIC).

3. Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4. Baking settings:

  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Dusun is not liable for such problems and consequences.

6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.


8 Storage conditions


9 Ordering information


10 MOQ and packing

Product modelMOQ(pcs)Packing methodNumber of Modules in each reel packNumber of reel packs in each box
DSM-04B2800Carrier tape and reel packing7004

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