DSOM-050 RK3308 System on Module

DSOM-050 RK3308 System on Module (SoM) / Core Board adopts an IoT-focused processor with a quad-core 64-bit Cortex-A35 architecture that can run at a maximum frequency of 1.3Ghz. It can be paired with DDR3 and DDR3L RAM.
Table of Contents
DSOM 050 RK3308

1. DSOM-050 RK3308 SOM Product Description

1.1 Product Overview and Scope

DSOM-050R RK3308B System on Module adapts 136 pin stamp hole design and is equipped with RK3308B, an IoT-focused processor with a quad-core 64-bit Cortex-A35 architecture that can run at a maximum frequency of 1.3Ghz. It boasts an integrated high-performance Codec and hardware VAD (Voice Activation Detection) and is compatible with a variety of operating systems, speech systems, and services.

Additionally, it offers numerous expansion interfaces and powerful display drive capabilities, making it a versatile choice for IoT applications, including smart speakers and displays, that demand advanced audio processing and speech recognition capabilities.

The DSOM-050R RK3308B System on Module offers a wide range of development documents and software resources that are both free and open-source. This convenience enables developers to enhance their efficiency and shorten the development cycle. Video streams and high quality audio streams – perfect for commercial/industrial applications that will have customer and public facing software.

1.2 System on Module Features

  • Featuring a compact form factor and sufficient GPIO interfaces
  • Size 45mm*40.2mm
  • eMMC up to 128GB
  • RAM up to 512MB DDR3
  • Support power sleep and wake-up
  • Supports Buildroot, Linux + MiniGUI/QT, ROS
  • Supports 100M wired Ethernet
  • Leads out 136 PIN pins, 1.2mm pitch, including all CPU pins
  • RoHS certified

1.3 System on Module Application

  • lIoT Gateways
  • Smart Speakers
  • Smart Displays
  • Voice Assistants
  • Healthcare
  • Industrial Control

2 System Block Diagram of DSOM-050 RK3308 SOM

2.1 Main Chip Block Diagram


2.2 System on Module Block Diagram


3 Basic Parameters and Interfaces of DSOM-050 RK3308 SOM

CPUQuad-Core ARM® Cortex-A35 64-bit processor, Frequency up   to
RAM512 MB DDR3/LPDDR3 (128MB/ 512MB optional)
StorageeMMC 8 GB (4GB / 8GB / 16GB / 32GB/ 64G / 128G eMMC
Power ManagementIsolated DC/DC Converters that support dynamic frequency
Operating VoltageTypical voltage 5V/0.5A
OSBuildroot, Linux + MiniGUI/QT, ROS (Robot Operating System)
TemperatureOperating Temperature: -10°C ~60 °C
Storage Temperature:   -40 °C ~85 °C
Barometric Pressure76Kpa ~106Kpa
Size45mm×40.2mm x 3.35mm
Ethernet1 X 10M/100MHz RMII Ethernet interface needs an external   PHY
LCDParallel RGB LCD interface supports RGB888, ARGB888,   RGB565,
     YCbCr422, YCbCr420, YCbCr444
AudioThe system provides a rich set of digital and analog audio   interfaces, including support for I2S, PDM, TDM, and SPDIF.
     l built-in   stereo headphone and line-out outputs and support for up to six channels of   analog microphone input
     l supports 8-channel    I2S/TDM x 2,    8-channel PDM, and    2- channel I2S/PCM.
     l supports up    to 8-channel microphone    array with echo
UART5 X Serial Ports and flow control are supported on all   four
     channels except for UART2.
I2C4 X I2C
PWM11 X PWM output, including multiplexed channels
USB 2.02 X USB2.0, one of which is for OTG
USB 3.01 X USB3.0
Ethernetthe main chip integrates a 100M Ethernet chip
GPIODefined features
Upgradesupports local firmware upgrades via USB interface

4 Pin Definition of DSOM-050 RK3308 SOM

2q234 01

Top Side Coreboard

2q234 02

Buttom Side Coreboard

5 Eletronical Parameters of DSOM-050 RK3308 SOM

5.1 Absolute Electrical Parameters

VCC5V0_SYS(_1/_2/_3)VCC5V0_SYS Input voltage-0.3 6.0V
3.3V IO out voltage-0.3 3.6V
VCC_1V81.8V IO out voltage-0.3 2.1V
TaOperating temperature range-10 60°C
TsStore temperature range-40 85°C

Note: Exposure to conditions beyond the absolute maximum ratings may cause permanent damage and affect the reliability and safety of the device and its system. 

The functional operations cannot be guaranteed beyond specified values in the recommended conditions.

5.2 Normal working parameters

VCC5V0_SYS(_1/_2/_3)VCC5V0_SYS Input voltage4.855.2V
VCC_IO_1 VCC_IO_23.3V IO out voltage3.03.33.4V
VCC_1V81.8V IO out voltage1.71.81.9V
VCC5V0_SYS SupplyVCC5V0_SYS Input current  0.3A
TaOperating temperature range-102560°C
TsStorage temperature range-402585°C

6 Product Dimensions of DSOM-050 RK3308 SOM

Layout and Dimension
ExteriorStamp Hole
Core Board Size45mm X 40.2mm X 3.35mm
Pin Spacing1.2 mm
Pin Pad Size1.5mm X 0.7mm
Number of Pins136Pins
Number of Layers6 floors
Warpageless than 0.5 %

7 The methods of Coreboard Thermal Control

7.1 Thermal Control Strategy

There is a generic thermal system driver framework in the Linux kernel that defines a number of temperature control strategies. The following three strategies are currently in common use:

  • Power_allocator: Introduces proportional-integral-derivative (PID) control, dynamically allocates power to each module based on the current temperature and converts power to Frequency to achieve Frequency limiting based on temperature.
  • Step_wise: Limits the Frequenof in steps based on the current temperature.
  • User space: Does not limit Frequency.

The RK3328 chip has a T-sensor that detects the chip’s internal temperature and uses the Power_allocator strategy by default. The operating states are as follows:

  • If the temperature exceeds the set temperature value:
    ·  If the temperature trend is rising, the Frequency is gradually reduced.
    ·  If the temperature trend is falling, the Frequency is gradually increased.
  • When the temperature falls to the set temperature value:
    ·  If the temperature trend is increasing, the Frequency remains unchanged.
    ·  If the temperature trend is falling, the Frequency is gradually increased.
  • Suppose the Frequency reaches its maximum and the temperature is still below the set valve. In that case, the CPU frequency is no longer under thermal control, and the CPU frequency becomes system load frequency modulation.
  • If the chip is still overheating after the Frequency has been reduced (e.g., due to poor heat dissipation) and the temperature exceeds 95 degrees, the software will trigger a restart t. If the restart fails due to deadlock or other reasons and the chip exceeds 105 degrees, the otp_out inside the chip will trigger an immediate shutdown by the PMIC.

Note: The temperature trend is determined by comparing the previous and current temperaturesIf the device temperature is below the threshold, the temperature is sampled every l seconds; if the device temperature exceeds the threshold, the temperature is sampled every 20ms, and the Frequency is limited.

7.2 Thermal Control Configure

The RK3328 SDK provides separate thermal control strategies for the CPU and G U.
Please refer to the (Rockchip_Developer_Guide_Thermal) document for specific configurations.

8 Production Guide of DSOM-050 RK3308 SOM

8.1 SMT process

Select modules that can be SMT or in-line packaged according to the customer’s PCB design. If the board is designed for SMT packaging, use SMT-packaged modules. If the board is designed for in-line assembly, use in-line assembly y.

Modules must be soldered within 24 hours of unpacking. If not, place them in a dry cabinet with a relative humidity of no more than 10% or re-pack them in a vacuum and record the exposure time (total exposure time must not exceed 168 hours).

Instruments or equipment required for SMT assembly:

  • SMT Mounter
  • SPI
  • Reflow soldering
  • Oven temperature tester
  • AOI


Instruments or equipment required for baking:

  • Cabinet ovens
  • Antistatic high-temperature trays
  • Antistatic and high-temperature gloves

8.2 Module storage conditions:

Moisture-proof bags must be stored at a temperature <40°C and humidity <90%H. Dry-packed products have a shelf life of 12 months from the date of sealing of the package—sealed packaging with a humidity indicator card.


8.3 Baking is required when:

The vacuum bag is found to be broken before unpacking.
After unpacking, the bag is found to be without a humidity indicator card.
The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink.
Total exposure time after unpacking exceeds 168 hours.
More than 12 months from the date of the first sealed packaging.

Baking parameters are as follows:

Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).

Baking time: 48 hours for reel packaging; 12 hours for pallet packaging.

Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.

After cooling to below 36°C under natural conditions, production can be carried out.

If the exposure time after baking is greater than 168 hours and not used up, bake again.

If the exposure time is more than 168 hours without baking, it is not recommended to use the reflow soldering process to solder this batch of modules. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time exceeds d. 

This may lead to device failure or poor soldering when high-temperature soldering is carried out.

8.4 ESD

Please protect the module from electrostatic discharge (ESD) during the entire production process.

8.5 Conformity

To ensure product qualification rates, it is recommended to use SPI and AOI test equipment to monitor solder paste printing and placement quality.

8.6 Recommended Furnace Temperature Profile

Please follow the reflow profile for SMT placement with a peak temperature of 245C. The reflow temperature profile is shown below using the SAC305 alloy solder paste.


Description for graphs of curves.
A: Temperature axis
B: Time axis
C: Alloy liquid phase line temperature: 217-220°C
D: Slope of temperature rise: 1-3°C/s
E: Constant temperature time: 60-120s, constant temperature: 150-200°C
F: Time above liquid phase line: 50-70s
G: Peak temperature: 235-245°C
H: the slope of temperature reduction: 1-4°C/s
Note: above-recommended curves are based on SAC305 alloy solder paste as an example. Please set the recommended oven temperature curve for other alloy solder pastes according to the solder paste specification.

8.7 Storage


8.8 Order Information



DusunIoT offers full set of development resources including QUICK START, SDK, Firmware packaging, module firmware, Tools, vairous third party software,etc.

Related IoT Product Specifications

DSM-055 Bluetooth Cloud Module

DSM-055 are 2.4 GHz wireless SOCs optimized for line-powered Bluetooth Low Energy and
Bluetooth mesh applications, including connected lighting, smart plugs, gateways and voice

DSGW-280 Wi-Fi 6 XGS-PON Fiber Gateway

DSGW-280 is a Wi-Fi6 XGS-PON FTTH (Fiber-To-The-Home) Gateway featuring High-speed Internet, VoIP and TV services, and supporting internet application such as video, email, web surfing,

DSGW-210N Edge Computing Smart Gateway

The DSGW-210N is an IoT gateway with multiple protocols and edge computing functionality. It supports Total Control powerful tool for projecting the screen of multiple

Looking For An IoT Device Supplier For Your Projects?


    This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

    IoT Gateways for Recommendation


      This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

      Welcome to DusunIoT

      Hi there 👋 Is there anything we can help you with today? Please fill in the form below for the team to follow up if you become disconnected.

        DusunIoT Distributor Program

          This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

            This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.