DSM-102 Z-WAVE Module

Table of Contents

1 Introduction

1.1 Purpose& Description

DSM-102 ZWAVE Module is a low power-consuming embedded ZWAVE module developed By Dusun IoT. It consists of the highly integrated wireless radio processor chip, ZGM130S037HGN1, and several peripherals, with a built-in ZWAVE protocol stack and robust library functions.

This data terminal device is embedded with the high-performance 32-bit 39 MHz ARM Cortex®-M4 CPU with DSP instructions and floating point unit for efficient signal processing, 512 KB flash memory, 64 KB RAM data memory, and robust peripheral resources. It is mainly used for Z-wave gateway coordinators.

1.2 Product Feature Summary
  • •High-performance 32-bit 39 MHz ARM Cortex®-M4 with DSP instructions and floating point unit for efficient signal processing
  • Up to 512kB Flash programming memory
  • Up to 64kB RAM data memory
  • Working voltage: 1.8 V to 3.8 V
    • BLE operating feature
      Supporting 915MHz and 865MHz with an air interface, rate of 100Kbps
    • Maximum output power: +13.5 dBm; dynamic difference of output power: > 43 dB
  • Dimension: 17 x 22 x 2.8 mm
  • Working temperature: –40°C to +85°C
  • Certification CE, FCC, SRRC
1.3 Scenario
  • Intelligent Building
  • Intelligent Home And Household Applications
  • Industrial Wireless Control
  • Intelligent Public Traffic

2 Mechanical Requirement

2.1 Dimensions

DSI-0177-AMBER-ZWAVE provides two rows of pins(2 * 14) with the pin pitch of 1.27±0.1mm
Dimensions: 17±0.35 mm (W) x 22±0.35 mm (L) x 2.8±0.15 mm (H).

2.2 Pin Definition
Pin NumberSymbolIO TypeFunction
1GNDPPower supply reference ground pin
2ANTRFRF signal input/output port, which corresponds to ANT of IC
3GNDPPower supply reference ground pin
4NCNot connect
5NCNot connect
6PD13I/OCorresponding to PD13 of IC
7PD14I/OCorresponding to PD14 of IC
8PD15I/OCorresponding to PD15 of IC
9PB11I/OCorresponding to PB11 of IC
10PB12I/OCorresponding to PB12 of IC
11PB13I/OCorresponding to PB13 of IC
12PB14I/OCorresponding to PB14 of IC
13PB15I/OCorresponding to P15 of IC
14NCNot connect
15NCNot connect
16NCNot connect
17PF3I/OCorresponding to PF3 of IC
18PF2I/OCorresponding to PF2 of IC
19NCNot connect
20GNDPPower supply reference ground pin
21VCCPPower supply pin (3.3V)
22RX0ICorresponding to internal RXD0 of IC
23TX0OCorresponding to internal TXD0 of IC
24SWDIOI/OCorresponding to internal SWDIO of IC
25SWCLKI/OCorresponding to internal SWCLK of IC
26PC11I/OCorresponding to PC11 of IC
27PC10I/OCorresponding to PC10 of IC
28nRESETIHardware reset pin, which is at a high level by default and is active at a low level
  • P indicates power supply pins, I/O indicates input/output pins

3 Electrical parameters

3.1 Absolute electrical parameters
Minimum valueMaximum valueUnit
Ts Storage temperature-4085
VCCPower supply voltage-0.33.8V
Static electricity voltage (human body model)TAMB-25-KV
Static electricity voltage (machine model)TAMB-25-KV
3.2 Working conditions
ParameterDescriptionMinimum valueMaximum valueTypical
TaWorking temperature-4085-25
VCCPower supply voltage1.83.83.3V
VILI/O low-level input-I0VDD*0.3V
VIHI/O high-level inputI0VDD*0.7--V
VOLI/O low-level output-I0VDD*0.2-V
VOHI/O high-level outputI0VDD*0.8--V
3.3 Current consumption during constant transmission and receiving
Working statusTypeTX Power/ ReceivingTypical valueAverage
TXF=868.4MHZ CW Mode+13dBm40.7mA
TXF=908.4MHZ CW Mode+4dBm17.9mA
TXF=908.4MHZ CW Mode+0dBm9.8mA
RX100kbps 2GFSK,F=869.85MHzConstant receiving9.6mA
RX40kbps,2FSK,F=868.4Constant receiving8.8mA
RX9.6kbps,Manchester,2FSK,F=868.42MHZConstant receiving9.1mA
RXConstant receiving9.9

4 RF features

4.1 Basic RF feature
Frequency band868 MHz Band & 915 MHz Band
Wi-Fi standardZWAVE
Data transmission rate100kbps max
Antenna typePCB antenna with a gain of 1dBi. IPEX (optional)
4.2 TX performance (Performance during constant transmission)
ParameterMinimum valueTypical valueMaximum valueUnit
Maximum output power4-10dBm
Minimum output power--30-dBm
Output power adjustment step-0.5dBm
Output spectrum adjacent-channel rejection ratio-49-47-30dBc
Frequency error-15-15ppm
4.3 RX performance (RX sensitivity)
ParameterMinimum valueTypical valueMaximum valueUnit
PER<1%, RX sensitivity(Zigbee 250Kbps)-102.6--97.5dBm

5 Antenna

5.1 Antenna type

This product uses an onboard PCB antenna or IPEX.

5.2 Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.  If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.


7 Production instructions

  1. Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.
  • SMT placement equipment:
  1. Reflow soldering machine
  2. Automated optical inspection (AOI) equipment
  3. Nozzle with a 6 mm to 8 mm diameter
  • Baking equipment:
  1. Cabinet oven
  2. Anti-static heat-resistant trays
  3. Anti-static heat-resistant gloves

2.Storage conditions for a delivered module are as follows:

  • The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
  • The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).

3.Bake a module based on HIC status as follows when you unpack the module package:

  • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
  • If the 30% circle is pink, bake the module for 4 consecutive hours.
  • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
  • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
4.Baking settings:
  • Baking temperature: 125±5℃
  • Alarm temperature: 130℃
  • SMT placement ready temperature after natural cooling: < 36℃
  • Number of drying times: 1
  • Rebaking condition: The module is not soldered within 12 hours after baking.

5.Do not use SMT to process modules that have been unpacked for over three months.

Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.

6.Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

7.1 Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

7.2 Storage conditions

8 MOQ and packing

Product modelMOQ(pcs)Packing methodNumber of Modules in each reel packNumber of reel packs in each box
DSI-0177-AMBER-ZWAVE4000Carrier tape and reel packing10004
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