DSOM-080M MediaTek MT7628 System on Module

The DSOM-080M SOM, is a low-cost and low-power 300M IoT system on module based on MediaTek MT7628AN as the core, supporting Linux & OpenWrt operating systems.
Table of Contents
dsom 080m

1 Product Description of DSOM-080M MediaTek MT7628 SOM

1.1 Product Overview and Scope

The DSOM-080M System on Module, produced by Dusun Electronics, is a low-cost and low-power 300M IoT module based on MediaTek MT7628AN as the core. This module provides access to all the interfaces of MT7628AN, supports Linux and OpenWrt operating systems, and allows for custom development. With its rich interfaces and powerful processors, it can be widely used in smart devices or cloud service applications.

The DSOM-080M System on Module offers a wide range of development documents and software resources that are both free and open-source. This convenience enables developers to enhance their development efficiency and shorten the development cycle.

1.2 System on Module Feature
  • Super data processing capability, with an MCU main frequency of up to 580MHz
  • 300M wireless rate
  • Support for 802.11b/g/n mode
  • 20/40 channel bandwidth
  • Support for AP, STA, and AP/STA mixed mode
  • Support for up to 5 10/100M adaptive network ports
  • Multiple interfaces: SPI/SD-XC/eMMC
  • Rich peripheral interfaces: SPI, I2C, I2S, PCM, UART, JTAG, GPIO
  • Widely used in the Internet of Things
  • Built-in powerful PMU
  • Built-in 64MB DDR2 (MTK7628DAN)
  • Support for 16 Multiple BSSID
  • Support for multiple encryption methods: WEP64/128, TKIP, AES, WPA, WPA2, WAPI
  • Support for QoS, WMM, WMM-PS
  • Support for multiple systems: Linux 2.6.36 SDK, OpenWrt 3.10
  • Working temperature: -20 to +55℃
  • CE, FCC, SRRC certification
1.3 System on Module Application
  • Industrial-embedded Linux computer
  • Home Appliances
  • Home Automation – Smart Home
  • IoT gateways

2 System Block Diagram of DSOM-080M MediaTek MT7628 SOM

2.1 Main Chip Block Diagram
mt7628nn mt7628an mt7628dan
2.2 Core Board Block Diagram
Interface diagram

Interface diagram

3 Basic Parameters and Interfaces of DSOM-080M MediaTek MT7628 SOM

ItemParameter
ModeDSOM-080M
Man chipMT7628AN
KernelMIPS24KEc
Frequency575/580MHz
RAMDDR2 128MB, Optional 64MB
Flash16MB, Optional 32MB
TemperatureWorking Temperature:-20℃~55℃
Storage Temperature:-40℃~85℃
Humidity10~95% (Non-condensing)
Atmospheric pressure
Dimension
76Kpa ~106Kpa
18.7mm x 35.2mm x 2.8mm
ItemParameter
Wi-Fi2 x IPEX Antenna (IEEE 802.11b/g/n)
Ethernet1 x WAN+4 x LAN(10M/100M)
UART2 x UART, With transparent transmission function
SDIO3 x SDIO interfaces
SPI1 x SPI interfaces
I2C1 x I2C interfaces
I2S1 x I2S interfaces
PWM1 x PWM interfaces
GPIOUp to 8 GPIO interfaces
USB2.01 x USB 2.0 interfaces
  • The module’s factory default programming is the firmware developed by our company based on Linux. The Ethernet, Wi-Fi, UART0, and UART1 of this firmware have transparent transmission functions.
  • You can burn the OPENWRT program or MTK original Linux program according to actual usage.

4 Pin Definition of DSOM-080M MediaTek MT7628 SOM

WechatIMG582

Top Side Coreboard

PinNameI/O Typ eI/O Voltage   (Unit: V)FunctionRemark
1GNDP GroundSystem Power
23.3VDP Power,supplycurrent≥ 1000mA
33.3VDP 
4GNDP Ground
5SPI_CS0O3.3SPI0 chip select 0 
6REF_CLK0I/O Reference clock output 
7PERST_NI/O3.3PCIE device resetInternal pull-up, Don't pull down
8WDT_RST_NI/O3.3Watchdog timeout resetPull down 1s to enter the AirKiss function of WeChat; Pull down   3s, Exits transparent transmission and enters AT mode; Pull down 6s, and the   module will restore the default settings;
9EPHY_LED4I/O3.3PORT4 LED, Active
     low
LAN4 LED
10EPHY_LED3I/O3.3PORT3 LED,Active lowLAN3 LED
11EPHY_LED2I/O3.3PORT2 LED,Active lowLAN2 LED
12EPHY_LED1I/O3.3PORT1 LED,Active lowLAN1 LED
13EPHY_LED0I/O3.3PORT0 LED,Active lowWAN LED
14PORST_NI/O3.3CPU reset,Active lowCPU Reset,Floating
15UART_TXD1O3.3Uart1 TXDUart1 TXD, if not use, Floating,Internal pull-up, Don't pull
16UART_RXD1I3.3Uart1 RXDUart1 RXD,if not use, Floating
17I2S_SDII/O3.3I2S data inputGPIO Optional
18I2S_SDOI/O3.3I2S data outputGPIO Optional, Internal pull-down, Don't
     pull up
19I2S_WSI/O3.3I2S Channel selection ,
     0:Left;1:Right
GPIO Optional
20I2S_CLKI/O3.3I2S clockGPIO Optional
21GNDP GroundGround
22ANTP Antenna, the default openIf you need to connect this pin, you need to remove the antenna   base and
     replace it with a 0 ohm resistor
23GNDP GroundGround
24I2C_SCLKI/O3.3I2C ClockGPIO Optional
25I2C_SDI/O3.3I2C dataGPIO Optional
26SPI_CS1I/O3.3SPI chip select 1Internal pull-down, Don't pull up
27SPI_CLKI/O3.3SPI clockInternal pull-up, Don't pull down
28SPI_MISOI/O3.3SPI Bus data master in
     and slave out
 
29SPI_MOSII/O3.3SPI Bus data master out
     and slave in
 
30GPIO0I/O3.3Universal input and
     output interface
 
31UART_TXD0O3.3Uart0 TXDUart0 TXD, if not use,   Floating, Internal
     pull-down, Don't pull up
32UART_RXD0I3.3Uart0 RXDUart0 RXD, if not used,   Floating
33WLED_NI/O3.3Wi-Fi LED, Active lowDuring Wi-Fi communication, the WI-FI
     LED flashes and can be Floating
34MDI_RP_P0I/O PORT0 Network signal
     is receiving positive
WAN port, if not used,   Floating
35MDI_RN_P0I/O PORT0 Network signal
     is receiving negative
 
36MDI_TP_P0I/O PORT0 Network signal
     is sending positive
 
37MDI_TN_P0I/O PORT0 Network signal
     is sending negative
 
38MDI_TP_P1I/O PORT1 Network signal
     is receiving positive
LAN Port1, if not used, Floating
39MDI_TN_P1I/O PORT1 Network signal
     is receiving negative
40MDI_RP_P1I/O PORT1 Network signal
     is sending positive
41MDI_RN_P1I/O PORT1 Network signal
     is sending negative
42MDI_RP_P2I/O PORT2 Network signal
     is receiving positive
LAN Port2, if not used, Floating
43MDI_RN_P2I/O PORT2 Network signal
     is receiving negative
44MDI_TP_P2I/O PORT2 Network signal
     is sending positive
45MDI_TN_P2I/O PORT2 Network signal
     is sending negative
46MDI_TP_P3I/O PORT3 Network signal
     is receiving positive
LAN Port2, if not used, Floating
47MDI_TN_P3I/O PORT3 Network signal
     is receiving negative
48MDI_RP_P3I/O PORT3 Network signal
     is sending positive
49MDI_RN_P3I/O PORT3 Network signal
     is sending negative
50MDI_RP_P4I/O PORT4 Network signal
     is receiving positive
LAN Port4, if not used,   Floating
51MDI_RN_P4I/O PORT4 Network signal
     is receiving negative
52MDI_TP_P4I/O PORT4 Network signal
     is sending positive
 
53MDI_TN_P4I/O PORT4 Network signal
     is sending negative
54USB_DPI/O USB data positiveIf not used, Floating
55USB_DMI/O USB data negativeIf not used, Floating
56GNDP GroundGround

Remark:
I-input; O-output; I/O-digital I/O; P-power supply. The drive current of the IO ports is 4mA, and the voltage level of all IO pins is 3.3V.
The red color in the name column indicates that it is related to the chip’s startup, and it cannot be pulled up or down from the outside nor connected to the drive source.

5 Electrical Parameters of DSOM-080M MediaTek MT7628 SOM

5.1 Absolute Electrical Parameters
ParameterDescriptionMinTypMaxUnit
TsStorage
temperature
-40-85
TaOperating
temperature
-20-55
3.3VDInput voltage-0.3-3.8V
Electrostatic discharge voltage (human body   model)TAMB-25℃--2KV
Electrostatic discharge voltage (machine   model)TAMB-25℃--0.5KV

Note: Exposure to conditions beyond the absolute maximum ratings may cause
permanent damage and affect the reliability and safety of the device and its systems.
The functional operations cannot be guaranteed beyond specified values in the
recommended conditions.

5.2 Normal working parameters
ParameterDescriptionMinTypMaxUnit
TaOperating temperature-102555°C
3.3VD   3.03.33.6V
VILLow-level input voltage-0.3-VDD*0.25V
VIHHigh-level input voltageVDD*0.75-3.6V
VOLLow-level output voltage -VDD*0.1V
VOHHigh-level output voltageVDD*0.8--V
ISTDNo-load running current130 230mA
IpeakPeak current-850-mA
PAVGAverage power-650-mW
FoOperating frequency2412 2484Mhz

6 Hardware Design Guidelines of DSOM-080M MediaTek MT7628 SOM

6.1 SPI Interface

The MT7628AN chip features an SPI controller with a choice of CS0 and CS1, which can be utilized for connecting SPI devices. The recommended design for the SPI interface, including drop-down and match, is shown in the following table

NameInternal StateExternal connection modeDescription (chip side)
SPI_MOSIPull-DownDirect connectionSPI Master output
SPI_MISO\Direct connectionSPI Master input
SPI_CLKPull-Up33ohm resistor in seriesSPI clock
SPI_CS1Pull-DownDirect connectionSPI chip select1
SPI_CS0\Direct connectionSPI chip select0,Has been
used for internal flash chips
6.2 I2C Interface
NameInternal StateExternal connection modeDescription (chip side)
I2C_SCLK\33ohm resistor in series,
4.7K resistance pull up
I2C Clock
I2C_SD\33ohm resistor in series,
4.7K resistance pull up
I2C Data
6.3 USB Interface

The DSOM-080M module has a set of USB 2.0 interfaces as the host. Please note the following in the design:

  • Ensure that the internal capacitance of the ESD device is less than 3PF when the USB/DP is close to the access port.
  • To restrain electromagnetic radiation, reserve the common-mode inductor on the signal line, and choose to use resistance or common-mode inductor according to the actual situation in the debugging process.
    The design recommendations for the USB 2.0 interface are shown in the following table: 
NameExternal Connection ModeDescription
USB_DP2.2ohm resistor in seriesUSB data is positive
USB_DN2.2ohm resistor in seriesUSB data is negative

USB 2.0 Signal Design Rules:

  • The internal offset of the difference pair should be less than 2 PS;
  • The length of the difference pair should be less than 3 inches;
  • The differential convection layer should have less than 3 holes.
  • The differential pair impedance should be controlled at 90 ohms +/-10%.
  • The distance between the differential pair and other signals should follow the 3W principle
6.4 I2S Interface
NameExternal Connection ModelDescription
I2S_SDI22ohm resistor in seriesI2S data input terminal
I2S_SDO22ohm resistor in seriesI2S data output terminal
I2S_WS22ohm resistor in seriesI2s channel selection, 0:   left; 1: Right
I2S_CLK22ohm resistor in seriesI2S clock
6.5 Ethernet

The DSOM-080 module supports a total of 1 WAN and 4 LANs. LANs can be used as other functions when not needed. However, note that all four LANs can only be used either as LANs or as other GPIO-like functions. There is no case where LAN Port 1 is used as a LAN, and LAN Port 2/3/4 is used as other GPIO-like functions.

Please Note the following during design:
Near the Ethernet port, differential mode and common mode protection devices should be added, as shown in the following figure

image5

7 Product Dimensions of DSOM-080M MediaTek MT7628 SOM

dsom-080m module dimensions

Module Dimensions

Suggested Package Dimensions

Suggested Package Dimensions

ItemParameter
Core Board Size18.7 mm x 35.2mm x 2.8mm
Pin Spacing1.4mm
Warpageless than 0.5 %

8 Production Guide of DSOM-080M MediaTek MT7628 SOM

8.1 SMT process

Select modules that can be SMT or in-line packaged according to the customer’s PCB design scheme. If the board is designed for SMT packaging, use SMT-packaged modules. If the board is designed for in-line assembly, use in-line assembly.
Modules must be soldered within 24 hours of unpacking. If not, place them in a dry cabinet with a relative humidity of no more than 10% or re-pack them in a vacuum and record the exposure time (total exposure time must not exceed 168 hours).

Instruments or equipment required for SMT assembly:

  • SMT Mounter
  • SPI
  • Reflow soldering
  • Oven temperature tester
  • AOI

 

Instruments or equipment required for baking:

  • Cabinet ovens
  • Antistatic high-temperature trays
  • Antistatic and high-temperature gloves
8.2 Module storage conditions:

Moisture-proof bags must be stored at a temperature <40°C and humidity <90% RH. Dry-packed products have a shelf life of 12 months from the date of sealing of the package. Sealed packaging with humidity indicator card.

image8
8.3 Baking is required when:

The vacuum bag is found to be broken before unpacking.
After unpacking, the bag is found to be without a humidity indicator card.
The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink.
Total exposure time after unpacking exceeds 168 hours.
More than 12 months from the date of the first sealed packaging.

Baking parameters are as follows:
Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).

Baking time: 48 hours for reel packaging; 12 hours for pallet packaging.

Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.

After cooling to below 36°C under natural conditions, production can be carried out.

If the exposure time after baking is greater than 168 hours and not used up, bake again.

If the exposure time is more than 168 hours without baking, it is not recommended to use the reflow soldering process to solder this batch of modules. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time is exceeded. This may lead to device failure or poor soldering when high-temperature soldering is carried out.

8.4 ESD

Please protect the module from electrostatic discharge (ESD) during the entire production process.

8.5 Conformity

To ensure product qualification rates, it is recommended to use SPI and AOI test equipment to monitor solder paste printing and placement quality.

8.6 Recommended Furnace Temperature Profile

Please follow the reflow profile for SMT placement with a peak temperature of 245°C. The reflow temperature profile is shown below using the SAC305 alloy solder paste as an example.

image9

Description for graphs of curves.
A: Temperature axis
B: Time axis
C: Alloy liquid phase line temperature: 217-220°C
D: Slope of temperature rise: 1-3°C/s
E: Constant temperature time: 60-120s, constant temperature: 150-200°C
F: Time above liquid phase line: 50-70s
G: Peak temperature: 235-245°C
H: the slope of temperature reduction: 1-4°C/s
Note: The above-recommended curves are based on SAC305 alloy solder paste as an example. Please set the recommended oven temperature curve for other alloy solder pastes according to the solder paste specification.

8.7 Storage
image10
8.8 Order Information
ModelDDRFlash
DSOM-080M-Z64Mb32Mb
DSOM-080M-C128Mb32Mb

9 Appendix of DSOM-080M MediaTek MT7628 SOM

Extendable the Reuseable Function Menu

PINName (function1)Function 2Function 3Function 4GPIO#
1GND
23.3VD
33.3VD
4GND
5SPI_CS0   GPIO#10
6REF_CLK0   GPIO#37
7PERST_N   GPIO#36
8WDT_RST_N   GPIO#38
9EPHY_LED4JTAG_RST_N  GPIO#39
10EPHY_LED3JTAG_CLK  GPIO#40
11EPHY_LED2JTAG_TMS  GPIO#41
12EPHY_LED1JTAG_TDI  GPIO#42
13EPHY_LED0JTAG_TDO  GPIO#43
14PORST_N    
15UART_TXD1  PWM_CH0GPIO#45
16UART_RXD1  PWM_CH1GPIO#46
17I2S_SDIPCMDRX  GPIO#0
18I2S_SDOPCMDTX  GPIO#1
19I2S_WSPCMCLK  GPIO#2
20I2S_CLKPCMFS  GPIO#3
21GND
22ANT
23GND
24I2C_SCLK   GPIO#4
25I2C_SD   GPIO#5
26SPI_CS1   GPIO#6
27SPI_CLK   GPIO#7
28SPI_MISO   GPIO#9
29SPI_MOSI   GPIO#8
30GPIO0   GPIO#11
31UART_TXD0   GPIO#12
32UART_RXD0   GPIO#13
33WLED_N   GPIO#44
34MDI_RP_P0    
35MDI_RN_PO    
36MDI_TP_P0    
37MDI_TN_P0    

Documentations

DusunIoT offers full set of development resources including QUICK START, SDK, Firmware packaging, module firmware, Tools, vairous third party software,etc.

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