DSOM-080M MediaTek MT7628 System on Module

The DSOM-080M SOM, is a low-cost and low-power 300M IoT system on module based on MediaTek MT7628AN as the core, supporting Linux & OpenWrt operating systems.
Table of Contents
dsom 080m

1 Product Description of DSOM-080M MediaTek MT7628 SOM

1.1 Product Overview and Scope

The DSOM-080M System on Module, produced by Dusun Electronics, is a low-cost and low-power 300M IoT module based on MediaTek MT7628AN as the core. This module provides access to all the interfaces of MT7628AN, supports Linux and OpenWrt operating systems, and allows for custom development. With its rich interfaces and powerful processors, it can be widely used in smart devices or cloud service applications.

The DSOM-080M System on Module offers a wide range of development documents and software resources that are both free and open-source. This convenience enables developers to enhance their development efficiency and shorten the development cycle.

1.2 System on Module Feature
  • Super data processing capability, with an MCU main frequency of up to 580MHz
  • 300M wireless rate
  • Support for 802.11b/g/n mode
  • 20/40 channel bandwidth
  • Support for AP, STA, and AP/STA mixed mode
  • Support for up to 5 10/100M adaptive network ports
  • Multiple interfaces: SPI/SD-XC/eMMC
  • Rich peripheral interfaces: SPI, I2C, I2S, PCM, UART, JTAG, GPIO
  • Widely used in the Internet of Things
  • Built-in powerful PMU
  • Built-in 64MB DDR2 (MTK7628DAN)
  • Support for 16 Multiple BSSID
  • Support for multiple encryption methods: WEP64/128, TKIP, AES, WPA, WPA2, WAPI
  • Support for QoS, WMM, WMM-PS
  • Support for multiple systems: Linux 2.6.36 SDK, OpenWrt 3.10
  • Working temperature: -20 to +55℃
  • CE, FCC, SRRC certification
1.3 System on Module Application
  • Industrial-embedded Linux computer
  • Home Appliances
  • Home Automation – Smart Home
  • IoT gateways

2 System Block Diagram of DSOM-080M MediaTek MT7628 SOM

2.1 Main Chip Block Diagram
mt7628nn mt7628an mt7628dan
2.2 Core Board Block Diagram
Interface diagram

Interface diagram

3 Basic Parameters and Interfaces of DSOM-080M MediaTek MT7628 SOM

Item Parameter
Mode DSOM-080M
Man chip MT7628AN
Kernel MIPS24KEc
Frequency 575/580MHz
RAM DDR2 128MB, Optional 64MB
Flash 16MB, Optional 32MB
Temperature Working Temperature:-20℃~55℃
Storage Temperature:-40℃~85℃
Humidity 10~95% (Non-condensing)
Atmospheric pressure
Dimension
76Kpa ~106Kpa
18.7mm x 35.2mm x 2.8mm
Item Parameter
Wi-Fi 2 x IPEX Antenna (IEEE 802.11b/g/n)
Ethernet 1 x WAN+4 x LAN(10M/100M)
UART 2 x UART, With transparent transmission function
SDIO 3 x SDIO interfaces
SPI 1 x SPI interfaces
I2C 1 x I2C interfaces
I2S 1 x I2S interfaces
PWM 1 x PWM interfaces
GPIO Up to 8 GPIO interfaces
USB2.0 1 x USB 2.0 interfaces
  • The module’s factory default programming is the firmware developed by our company based on Linux. The Ethernet, Wi-Fi, UART0, and UART1 of this firmware have transparent transmission functions.
  • You can burn the OPENWRT program or MTK original Linux program according to actual usage.

4 Pin Definition of DSOM-080M MediaTek MT7628 SOM

WechatIMG582

Top Side Coreboard

Pin Name I/O Typ e I/O Voltage   (Unit: V) Function Remark
1 GND P   Ground System Power
2 3.3VD P   Power,supplycurrent≥ 1000mA
3 3.3VD P  
4 GND P   Ground
5 SPI_CS0 O 3.3 SPI0 chip select 0  
6 REF_CLK0 I/O   Reference clock output  
7 PERST_N I/O 3.3 PCIE device reset Internal pull-up, Don't pull down
8 WDT_RST_N I/O 3.3 Watchdog timeout reset Pull down 1s to enter the AirKiss function of WeChat; Pull down   3s, Exits transparent transmission and enters AT mode; Pull down 6s, and the   module will restore the default settings;
9 EPHY_LED4 I/O 3.3 PORT4 LED, Active
     low
LAN4 LED
10 EPHY_LED3 I/O 3.3 PORT3 LED,Active low LAN3 LED
11 EPHY_LED2 I/O 3.3 PORT2 LED,Active low LAN2 LED
12 EPHY_LED1 I/O 3.3 PORT1 LED,Active low LAN1 LED
13 EPHY_LED0 I/O 3.3 PORT0 LED,Active low WAN LED
14 PORST_N I/O 3.3 CPU reset,Active low CPU Reset,Floating
15 UART_TXD1 O 3.3 Uart1 TXD Uart1 TXD, if not use, Floating,Internal pull-up, Don't pull
16 UART_RXD1 I 3.3 Uart1 RXD Uart1 RXD,if not use, Floating
17 I2S_SDI I/O 3.3 I2S data input GPIO Optional
18 I2S_SDO I/O 3.3 I2S data output GPIO Optional, Internal pull-down, Don't
     pull up
19 I2S_WS I/O 3.3 I2S Channel selection ,
     0:Left;1:Right
GPIO Optional
20 I2S_CLK I/O 3.3 I2S clock GPIO Optional
21 GND P   Ground Ground
22 ANT P   Antenna, the default open If you need to connect this pin, you need to remove the antenna   base and
     replace it with a 0 ohm resistor
23 GND P   Ground Ground
24 I2C_SCLK I/O 3.3 I2C Clock GPIO Optional
25 I2C_SD I/O 3.3 I2C data GPIO Optional
26 SPI_CS1 I/O 3.3 SPI chip select 1 Internal pull-down, Don't pull up
27 SPI_CLK I/O 3.3 SPI clock Internal pull-up, Don't pull down
28 SPI_MISO I/O 3.3 SPI Bus data master in
     and slave out
 
29 SPI_MOSI I/O 3.3 SPI Bus data master out
     and slave in
 
30 GPIO0 I/O 3.3 Universal input and
     output interface
 
31 UART_TXD0 O 3.3 Uart0 TXD Uart0 TXD, if not use,   Floating, Internal
     pull-down, Don't pull up
32 UART_RXD0 I 3.3 Uart0 RXD Uart0 RXD, if not used,   Floating
33 WLED_N I/O 3.3 Wi-Fi LED, Active low During Wi-Fi communication, the WI-FI
     LED flashes and can be Floating
34 MDI_RP_P0 I/O   PORT0 Network signal
     is receiving positive
WAN port, if not used,   Floating
35 MDI_RN_P0 I/O   PORT0 Network signal
     is receiving negative
 
36 MDI_TP_P0 I/O   PORT0 Network signal
     is sending positive
 
37 MDI_TN_P0 I/O   PORT0 Network signal
     is sending negative
 
38 MDI_TP_P1 I/O   PORT1 Network signal
     is receiving positive
LAN Port1, if not used, Floating
39 MDI_TN_P1 I/O   PORT1 Network signal
     is receiving negative
40 MDI_RP_P1 I/O   PORT1 Network signal
     is sending positive
41 MDI_RN_P1 I/O   PORT1 Network signal
     is sending negative
42 MDI_RP_P2 I/O   PORT2 Network signal
     is receiving positive
LAN Port2, if not used, Floating
43 MDI_RN_P2 I/O   PORT2 Network signal
     is receiving negative
44 MDI_TP_P2 I/O   PORT2 Network signal
     is sending positive
45 MDI_TN_P2 I/O   PORT2 Network signal
     is sending negative
46 MDI_TP_P3 I/O   PORT3 Network signal
     is receiving positive
LAN Port2, if not used, Floating
47 MDI_TN_P3 I/O   PORT3 Network signal
     is receiving negative
48 MDI_RP_P3 I/O   PORT3 Network signal
     is sending positive
49 MDI_RN_P3 I/O   PORT3 Network signal
     is sending negative
50 MDI_RP_P4 I/O   PORT4 Network signal
     is receiving positive
LAN Port4, if not used,   Floating
51 MDI_RN_P4 I/O   PORT4 Network signal
     is receiving negative
52 MDI_TP_P4 I/O   PORT4 Network signal
     is sending positive
 
53 MDI_TN_P4 I/O   PORT4 Network signal
     is sending negative
54 USB_DP I/O   USB data positive If not used, Floating
55 USB_DM I/O   USB data negative If not used, Floating
56 GND P   Ground Ground

Remark:
I-input; O-output; I/O-digital I/O; P-power supply. The drive current of the IO ports is 4mA, and the voltage level of all IO pins is 3.3V.
The red color in the name column indicates that it is related to the chip’s startup, and it cannot be pulled up or down from the outside nor connected to the drive source.

5 Electrical Parameters of DSOM-080M MediaTek MT7628 SOM

5.1 Absolute Electrical Parameters
Parameter Description Min Typ Max Unit
Ts Storage
temperature
-40 - 85
Ta Operating
temperature
-20 - 55
3.3VD Input voltage -0.3 - 3.8 V
Electrostatic discharge voltage (human body   model) TAMB-25℃ - - 2 KV
Electrostatic discharge voltage (machine   model) TAMB-25℃ - - 0.5 KV

Note: Exposure to conditions beyond the absolute maximum ratings may cause
permanent damage and affect the reliability and safety of the device and its systems.
The functional operations cannot be guaranteed beyond specified values in the
recommended conditions.

5.2 Normal working parameters
Parameter Description Min Typ Max Unit
Ta Operating temperature -10 25 55 °C
3.3VD     3.0 3.3 3.6 V
VIL Low-level input voltage -0.3 - VDD*0.25 V
VIH High-level input voltage VDD*0.75 - 3.6 V
VOL Low-level output voltage   - VDD*0.1 V
VOH High-level output voltage VDD*0.8 - - V
ISTD No-load running current 130   230 mA
Ipeak Peak current - 850 - mA
PAVG Average power - 650 - mW
Fo Operating frequency 2412   2484 Mhz

6 Hardware Design Guidelines of DSOM-080M MediaTek MT7628 SOM

6.1 SPI Interface

The MT7628AN chip features an SPI controller with a choice of CS0 and CS1, which can be utilized for connecting SPI devices. The recommended design for the SPI interface, including drop-down and match, is shown in the following table

Name Internal State External connection mode Description (chip side)
SPI_MOSI Pull-Down Direct connection SPI Master output
SPI_MISO \ Direct connection SPI Master input
SPI_CLK Pull-Up 33ohm resistor in series SPI clock
SPI_CS1 Pull-Down Direct connection SPI chip select1
SPI_CS0 \ Direct connection SPI chip select0,Has been
used for internal flash chips
6.2 I2C Interface
Name Internal State External connection mode Description (chip side)
I2C_SCLK \ 33ohm resistor in series,
4.7K resistance pull up
I2C Clock
I2C_SD \ 33ohm resistor in series,
4.7K resistance pull up
I2C Data
6.3 USB Interface

The DSOM-080M module has a set of USB 2.0 interfaces as the host. Please note the following in the design:

  • Ensure that the internal capacitance of the ESD device is less than 3PF when the USB/DP is close to the access port.
  • To restrain electromagnetic radiation, reserve the common-mode inductor on the signal line, and choose to use resistance or common-mode inductor according to the actual situation in the debugging process.
    The design recommendations for the USB 2.0 interface are shown in the following table: 
Name External Connection Mode Description
USB_DP 2.2ohm resistor in series USB data is positive
USB_DN 2.2ohm resistor in series USB data is negative

USB 2.0 Signal Design Rules:

  • The internal offset of the difference pair should be less than 2 PS;
  • The length of the difference pair should be less than 3 inches;
  • The differential convection layer should have less than 3 holes.
  • The differential pair impedance should be controlled at 90 ohms +/-10%.
  • The distance between the differential pair and other signals should follow the 3W principle
6.4 I2S Interface
Name External Connection Model Description
I2S_SDI 22ohm resistor in series I2S data input terminal
I2S_SDO 22ohm resistor in series I2S data output terminal
I2S_WS 22ohm resistor in series I2s channel selection, 0:   left; 1: Right
I2S_CLK 22ohm resistor in series I2S clock
6.5 Ethernet

The DSOM-080 module supports a total of 1 WAN and 4 LANs. LANs can be used as other functions when not needed. However, note that all four LANs can only be used either as LANs or as other GPIO-like functions. There is no case where LAN Port 1 is used as a LAN, and LAN Port 2/3/4 is used as other GPIO-like functions.

Please Note the following during design:
Near the Ethernet port, differential mode and common mode protection devices should be added, as shown in the following figure

image5

7 Product Dimensions of DSOM-080M MediaTek MT7628 SOM

dsom-080m module dimensions

Module Dimensions

Suggested Package Dimensions

Suggested Package Dimensions

Item Parameter
Core Board Size 18.7 mm x 35.2mm x 2.8mm
Pin Spacing 1.4mm
Warpage less than 0.5 %

8 Production Guide of DSOM-080M MediaTek MT7628 SOM

8.1 SMT process

Select modules that can be SMT or in-line packaged according to the customer’s PCB design scheme. If the board is designed for SMT packaging, use SMT-packaged modules. If the board is designed for in-line assembly, use in-line assembly.
Modules must be soldered within 24 hours of unpacking. If not, place them in a dry cabinet with a relative humidity of no more than 10% or re-pack them in a vacuum and record the exposure time (total exposure time must not exceed 168 hours).

Instruments or equipment required for SMT assembly:

  • SMT Mounter
  • SPI
  • Reflow soldering
  • Oven temperature tester
  • AOI

 

Instruments or equipment required for baking:

  • Cabinet ovens
  • Antistatic high-temperature trays
  • Antistatic and high-temperature gloves
8.2 Module storage conditions:

Moisture-proof bags must be stored at a temperature <40°C and humidity <90% RH. Dry-packed products have a shelf life of 12 months from the date of sealing of the package. Sealed packaging with humidity indicator card.

image8
8.3 Baking is required when:

The vacuum bag is found to be broken before unpacking.
After unpacking, the bag is found to be without a humidity indicator card.
The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink.
Total exposure time after unpacking exceeds 168 hours.
More than 12 months from the date of the first sealed packaging.

Baking parameters are as follows:
Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).

Baking time: 48 hours for reel packaging; 12 hours for pallet packaging.

Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.

After cooling to below 36°C under natural conditions, production can be carried out.

If the exposure time after baking is greater than 168 hours and not used up, bake again.

If the exposure time is more than 168 hours without baking, it is not recommended to use the reflow soldering process to solder this batch of modules. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time is exceeded. This may lead to device failure or poor soldering when high-temperature soldering is carried out.

8.4 ESD

Please protect the module from electrostatic discharge (ESD) during the entire production process.

8.5 Conformity

To ensure product qualification rates, it is recommended to use SPI and AOI test equipment to monitor solder paste printing and placement quality.

8.6 Recommended Furnace Temperature Profile

Please follow the reflow profile for SMT placement with a peak temperature of 245°C. The reflow temperature profile is shown below using the SAC305 alloy solder paste as an example.

image9

Description for graphs of curves.
A: Temperature axis
B: Time axis
C: Alloy liquid phase line temperature: 217-220°C
D: Slope of temperature rise: 1-3°C/s
E: Constant temperature time: 60-120s, constant temperature: 150-200°C
F: Time above liquid phase line: 50-70s
G: Peak temperature: 235-245°C
H: the slope of temperature reduction: 1-4°C/s
Note: The above-recommended curves are based on SAC305 alloy solder paste as an example. Please set the recommended oven temperature curve for other alloy solder pastes according to the solder paste specification.

8.7 Storage
image10
8.8 Order Information
Model DDR Flash
DSOM-080M-Z 64Mb 32Mb
DSOM-080M-C 128Mb 32Mb

9 Appendix of DSOM-080M MediaTek MT7628 SOM

Extendable the Reuseable Function Menu

PIN Name (function1) Function 2 Function 3 Function 4 GPIO#
1 GND
2 3.3VD
3 3.3VD
4 GND
5 SPI_CS0       GPIO#10
6 REF_CLK0       GPIO#37
7 PERST_N       GPIO#36
8 WDT_RST_N       GPIO#38
9 EPHY_LED4 JTAG_RST_N     GPIO#39
10 EPHY_LED3 JTAG_CLK     GPIO#40
11 EPHY_LED2 JTAG_TMS     GPIO#41
12 EPHY_LED1 JTAG_TDI     GPIO#42
13 EPHY_LED0 JTAG_TDO     GPIO#43
14 PORST_N        
15 UART_TXD1     PWM_CH0 GPIO#45
16 UART_RXD1     PWM_CH1 GPIO#46
17 I2S_SDI PCMDRX     GPIO#0
18 I2S_SDO PCMDTX     GPIO#1
19 I2S_WS PCMCLK     GPIO#2
20 I2S_CLK PCMFS     GPIO#3
21 GND
22 ANT
23 GND
24 I2C_SCLK       GPIO#4
25 I2C_SD       GPIO#5
26 SPI_CS1       GPIO#6
27 SPI_CLK       GPIO#7
28 SPI_MISO       GPIO#9
29 SPI_MOSI       GPIO#8
30 GPIO0       GPIO#11
31 UART_TXD0       GPIO#12
32 UART_RXD0       GPIO#13
33 WLED_N       GPIO#44
34 MDI_RP_P0        
35 MDI_RN_PO        
36 MDI_TP_P0        
37 MDI_TN_P0        

Documentations

DusunIoT offers full set of development resources including QUICK START, SDK, Firmware packaging, module firmware, Tools, vairous third party software,etc.

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