Core Board

The RK3328 core board belongs to the Android smart motherboard, which is generally suitable for face recognition, smart display terminal products, video terminal products, industrial automation terminal products, such as: advertising machines, digital signage, smart self-service terminals, smart retail terminals, smart homes, O2O Intelligent equipment, industrial control host, robot equipment, etc.


Product overview

RK3328 adopts ROCHCHIPRK3328Cortex-A53 quad-core processor, equipped with Android/Linux+QT/Ubuntu system, 1.5GHz high performance. Adopt Mali-450MP2GPU, support 4K video encoding, H.264 hard decoding. Multi-channel video output, rich core board interface, lead out all functional pins, support a variety of peripheral expansion, is your best choice for human-computer interaction and industrial control projects.

Product features

Stamp hole welded core board, onboard CVBS, HDMI display interface.

Support Android/Linux+QT system customization, provide system call interface API reference code, and perfectly support customer upper-level application APP development and SDK.

Chip Block Diagram

Chip Block Diagram.png

Mainboard Diagram

Mainboard Diagram.png

Basic parameters


Common Interface


Mechanical feature


size: 44 ± 0.35mm (W) × 44 ± 0.35mm (L) × 3 ± 0.15mm (H)


Pin define

Pin define01.png
Pin define02.png

Pin description



1. I-input; O-output; I/O-digital I/O; P-power supply.

Electrical Specification

Absolute Ratings


remark:Absolute maximum ratings specify the values beyond which the device may be damaged permanently. Long-term exposure to absolute maximum ratings conditions may affect device reliability.

Recommended Operating Condition


Production instructions

The SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours)

  • SMT devices:
    Reflow soldering machine
    Thermal profiler
    Automated optical inspection (AOI) equipment


  • Baking devices:
    Cabinet oven
    Anti-electrostatic and heat-resistant trays
    Anti-electrostatic and heat-resistant gloves

Storage conditions for a delivered module

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • There is a humidity indicator card (HIC) in the packaging bag.


The module needs to be baked in the following cases

  • The packaging bag is damaged before unpacking.

  • There is no HIC in the packaging bag.

  • After unpacking, circles of 10% and above on the HIC become pink.

  • The total exposure time has lasted for over 168 hours since unpacking.

  • More than 12 months have passed since the sealing of the bag.

Baking settings

  • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)

  • Time: 48 hours for reel package and 12 hours for tray package

  • Alarm temperature: 65°C for reel package and 135°C for tray package

  • Production-ready temperature after natural cooling: < 36°C

  • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.

  • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

In the whole production process, take electrostatic discharge (ESD) protective measures

To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

  • A: Temperature axis

  • B: Time axis

  • C: Liquids temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquids: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions